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DMG6898LSD-13

Diodes Incorporated · MOSFETs · SO-8

DMG6898LSD-13 from Diodes Incorporated, in a SO-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 S2 passive Source of MOSFET 2 (N-channel), per the internal schematic.
2 G2 input Gate of MOSFET 2, ESD protected to 2kV, with VGSS rating of ±12V.
3 S1 passive Source of MOSFET 1 (N-channel), per the internal schematic.
4 G1 input Gate of MOSFET 1, ESD protected to 2kV, with VGSS rating of ±12V.
5 D1 passive Drain of MOSFET 1, tied to pin 6, with VDSS rating of 20V.
6 D1 passive Drain of MOSFET 1, tied to pin 5, with VDSS rating of 20V.
7 D2 passive Drain of MOSFET 2, tied to pin 8, with VDSS rating of 20V.
8 D2 passive Drain of MOSFET 2, tied to pin 7, with VDSS rating of 20V.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SO-8
Category Transistors/Thyristors
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS 20 V VGS = 0V, ID = 250μA 2
Zero Gate Voltage Drain Current IDSS 1 μA TJ = +25°C; VDS = 20V, VGS = 0V 2
Gate-Source Leakage IGSS -10 10 μA VGS = ±12V, VDS = 0V 2
Gate Threshold Voltage VGS(TH) 0.5 1 1.5 V VDS = VGS, ID = 250μA 2
Static Drain-Source On-Resistance RDS(ON) 11 16 mΩ VGS = 4.5V, ID = 9.4A 2
Static Drain-Source On-Resistance RDS(ON) 17 23 mΩ VGS = 2.5V, ID = 8.3A 2
Diode Forward Voltage VSD 0.7 1.2 V VGS = 0V, IS = 1.3A 2
Drain-Source Voltage VDSS 20 V 2
Gate-Source Voltage VGSS -12 12 V Printed as ±12 V 2
Continuous Drain Current ID 9.5 A Steady state, TA = +25°C (Note 5) 2
Continuous Drain Current ID 7.1 A Steady state, TA = +85°C (Note 5) 2
Pulsed Drain Current IDM 30 A Note 6: repetitive rating, pulse width limited by junction temperature 2
Power Dissipation PD 1.28 W Note 5 (FR-4 PCB, minimum recommended pad layout) 2
Thermal Resistance, Junction to Ambient RθJA 99.3 °C/W @TA = +25°C (Note 5) 2
Operating and Storage Temperature Range TJ, TSTG -55 150 °C 2
Thermal Resistance, Junction to Ambient (transient thermal response chart) RθJA 205 °C/W Printed beside Fig. 12 Transient Thermal Response 5

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts Copper tin  Terminals: Finish- Matte Tin Annealed over Copper Lead Frame. 1

CAD (KiCad official)

  • Symbol: DMG6898LSD-13
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SO-8 (KiCad packages3D, STEP)
  • 3D model files: dmg6898lsd-13-etched.step / dmg6898lsd-13-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); dmg6898lsd-13.step / dmg6898lsd-13.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (7 pp, sha256 fb569fef87f7b42e, retrieved 2026-10-21, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF