component
DMG4800LSDQ-13
Public Made by Adomby adom
Diodes Incorporated MOSFETs, SO-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
main
DMG4800LSDQ-13
Diodes Incorporated · MOSFETs · SO-8
DMG4800LSDQ-13 from Diodes Incorporated, in a SO-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | S1 | passive | Source of N-channel MOSFET 1. |
| 2 | G1 | input | Gate of N-channel MOSFET 1; VGS rated ±25 V maximum. |
| 3 | S2 | passive | Source of N-channel MOSFET 2. |
| 4 | G2 | input | Gate of N-channel MOSFET 2; VGS rated ±25 V maximum. |
| 5 | D2 | passive | Drain of N-channel MOSFET 2, connected to pin 6; VDSS 30 V. |
| 6 | D2 | passive | Drain of N-channel MOSFET 2, connected to pin 5; VDSS 30 V. |
| 7 | D1 | passive | Drain of N-channel MOSFET 1, connected to pin 8; VDSS 30 V. |
| 8 | D1 | passive | Drain of N-channel MOSFET 1, connected to pin 7; VDSS 30 V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Diodes Incorporated |
| Package | SO-8 |
| Category | Triode/MOS Tube/Transistor |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Breakdown Voltage | BVDSS | 30 | V | VGS = 0V, ID = 250μA | 3 | ||
| Zero Gate Voltage Drain Current | IDSS | 1 | μA | TJ = +25°C, VDS = 30V, VGS = 0V | 3 | ||
| Gate-Source Leakage | IGSS | -100 | 100 | nA | VGS = ±20V, VDS = 0V | 3 | |
| Gate Threshold Voltage | VGS(TH) | 0.8 | 1.6 | V | VDS = VGS, ID = 250μA | 3 | |
| Static Drain-Source On-Resistance | RDS(ON) | 12 | 16 | mΩ | VGS = 10V, ID = 9A | 3 | |
| Static Drain-Source On-Resistance | RDS(ON) | 16 | 22 | mΩ | VGS = 4.5V, ID = 7A | 3 | |
| Diode Forward Voltage | VSD | 0.72 | 0.94 | V | VGS = 0V, IS = 1A | 3 | |
| Drain-Source Voltage | VDSS | 30 | V | TA = +25°C | 2 | ||
| Gate-Source Voltage | VGSS | -25 | 25 | V | TA = +25°C | 2 | |
| Continuous Drain Current, steady state | ID | 7.5 | A | VGS = 10V, TA = +25°C, steady state | 2 | ||
| Continuous Drain Current, steady state | ID | 6 | A | VGS = 10V, TA = +70°C, steady state | 2 | ||
| Continuous Drain Current, t < 10s | ID | 9.8 | A | VGS = 10V, TA = +25°C, t < 10s | 2 | ||
| Continuous Drain Current, t < 10s | ID | 7.7 | A | VGS = 10V, TA = +70°C, t < 10s | 2 | ||
| Continuous Drain Current, steady state | ID | 6.4 | A | VGS = 4.5V, TA = +25°C, steady state | 2 | ||
| Continuous Drain Current, steady state | ID | 5 | A | VGS = 4.5V, TA = +70°C, steady state | 2 | ||
| Continuous Drain Current, t < 10s | ID | 8.4 | A | VGS = 4.5V, TA = +25°C, t < 10s | 2 | ||
| Continuous Drain Current, t < 10s | ID | 6.6 | A | VGS = 4.5V, TA = +70°C, t < 10s | 2 | ||
| Maximum Continuous Body Diode Forward Current | IS | 2 | A | 2 | |||
| Pulsed Drain Current | IDM | 42 | A | 10µs Pulse, Duty Cycle = 1% | 2 | ||
| Avalanche Current | IAR | 17 | A | L = 0.1mH | 2 | ||
| Repetitive Avalanche Energy | EAR | 14 | mJ | L = 0.1mH | 2 | ||
| Operating and Storage Temperature Range | TJ, TSTG | -55 | 150 | °C | 2 | ||
| Total Power Dissipation (Note 8) | PD | 1.17 | W | Minimum recommended pad layout | 2 | ||
| Thermal Resistance, Junction to Ambient (Note 8), steady state | RθJA | 107 | °C/W | Steady State, minimum recommended pad layout | 2 | ||
| Thermal Resistance, Junction to Ambient (Note 8), t < 10s | RθJA | 61 | °C/W | t < 10s, minimum recommended pad layout | 2 | ||
| Total Power Dissipation (Note 5) | PD | 1.5 | W | 1inch square copper plate | 2 | ||
| Thermal Resistance, Junction to Ambient (Note 5), steady state | RθJA | 83 | °C/W | Steady State, 1inch square copper plate | 2 | ||
| Thermal Resistance, Junction to Ambient (Note 5), t < 10s | RθJA | 49 | °C/W | t < 10s, 1inch square copper plate | 2 | ||
| Thermal Resistance, Junction to Case | RθJC | 14.5 | °C/W | 2 | |||
| Forward Transfer Admittance | /Yfs/ | 8 | S | VDS = 10V, ID = 9A | 3 | ||
| Input Capacitance | Ciss | 798 | pF | VDS = 10V, VGS = 0V, f = 1.0MHz | 3 | ||
| Output Capacitance | Coss | 128 | pF | VDS = 10V, VGS = 0V, f = 1.0MHz | 3 | ||
| Reverse Transfer Capacitance | Crss | 122 | pF | VDS = 10V, VGS = 0V, f = 1.0MHz | 3 | ||
| Gate Resistance | Rg | 1.37 | Ω | VDS = 0V, VGS = 0V, f = 1MHz | 3 | ||
| Total Gate Charge | Qg | 8.56 | nC | VGS = 5V, VDS = 15V, ID = 9A | 3 | ||
| Gate-Source Charge | Qgs | 1.8 | nC | VGS = 5V, VDS = 15V, ID = 9A | 3 | ||
| Gate-Drain Charge | Qgd | 2.5 | nC | VGS = 5V, VDS = 15V, ID = 9A | 3 | ||
| Turn-On Delay Time | tD(ON) | 5.03 | ns | VDD = 15V, VGEN = 10V, RL = 15Ω, RG = 6Ω, ID = 1A | 3 | ||
| Turn-On Rise Time | tR | 4.5 | ns | VDD = 15V, VGEN = 10V, RL = 15Ω, RG = 6Ω, ID = 1A | 3 | ||
| Turn-Off Delay Time | tD(OFF) | 26.33 | ns | VDD = 15V, VGEN = 10V, RL = 15Ω, RG = 6Ω, ID = 1A | 3 | ||
| Turn-Off Fall Time | tF | 8.55 | ns | VDD = 15V, VGEN = 10V, RL = 15Ω, RG = 6Ω, ID = 1A | 3 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | Copper | tin | Terminal Connections Indicator: See Diagram Terminals: Finish, Matte Tin Annealed over Copper Leadframe. | 1 |
CAD (KiCad official)
- Symbol:
DMG4800LSDQ-13 - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SO-8 (KiCad packages3D, STEP)
- 3D model files:
dmg4800lsdq-13-etched.step/dmg4800lsdq-13-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);dmg4800lsdq-13.step/dmg4800lsdq-13.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Diodes Incorporated datasheet (8 pp, sha256
cb48fab8b54527b1, retrieved 2026-10-22, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# DMG4800LSDQ-13
**Diodes Incorporated** · MOSFETs · SO-8
DMG4800LSDQ-13 from Diodes Incorporated, in a SO-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | S1 | passive | Source of N-channel MOSFET 1. |
| 2 | G1 | input | Gate of N-channel MOSFET 1; VGS rated ±25 V maximum. |
| 3 | S2 | passive | Source of N-channel MOSFET 2. |
| 4 | G2 | input | Gate of N-channel MOSFET 2; VGS rated ±25 V maximum. |
| 5 | D2 | passive | Drain of N-channel MOSFET 2, connected to pin 6; VDSS 30 V. |
| 6 | D2 | passive | Drain of N-channel MOSFET 2, connected to pin 5; VDSS 30 V. |
| 7 | D1 | passive | Drain of N-channel MOSFET 1, connected to pin 8; VDSS 30 V. |
| 8 | D1 | passive | Drain of N-channel MOSFET 1, connected to pin 7; VDSS 30 V. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Diodes Incorporated |
| Package | SO-8 |
| Category | Triode/MOS Tube/Transistor |
| Pins | 8 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Breakdown Voltage | BVDSS | 30 | | | V | VGS = 0V, ID = 250μA | 3 |
| Zero Gate Voltage Drain Current | IDSS | | | 1 | μA | TJ = +25°C, VDS = 30V, VGS = 0V | 3 |
| Gate-Source Leakage | IGSS | -100 | | 100 | nA | VGS = ±20V, VDS = 0V | 3 |
| Gate Threshold Voltage | VGS(TH) | 0.8 | | 1.6 | V | VDS = VGS, ID = 250μA | 3 |
| Static Drain-Source On-Resistance | RDS(ON) | | 12 | 16 | mΩ | VGS = 10V, ID = 9A | 3 |
| Static Drain-Source On-Resistance | RDS(ON) | | 16 | 22 | mΩ | VGS = 4.5V, ID = 7A | 3 |
| Diode Forward Voltage | VSD | | 0.72 | 0.94 | V | VGS = 0V, IS = 1A | 3 |
| Drain-Source Voltage | VDSS | | | 30 | V | TA = +25°C | 2 |
| Gate-Source Voltage | VGSS | -25 | | 25 | V | TA = +25°C | 2 |
| Continuous Drain Current, steady state | ID | | | 7.5 | A | VGS = 10V, TA = +25°C, steady state | 2 |
| Continuous Drain Current, steady state | ID | | | 6 | A | VGS = 10V, TA = +70°C, steady state | 2 |
| Continuous Drain Current, t < 10s | ID | | | 9.8 | A | VGS = 10V, TA = +25°C, t < 10s | 2 |
| Continuous Drain Current, t < 10s | ID | | | 7.7 | A | VGS = 10V, TA = +70°C, t < 10s | 2 |
| Continuous Drain Current, steady state | ID | | | 6.4 | A | VGS = 4.5V, TA = +25°C, steady state | 2 |
| Continuous Drain Current, steady state | ID | | | 5 | A | VGS = 4.5V, TA = +70°C, steady state | 2 |
| Continuous Drain Current, t < 10s | ID | | | 8.4 | A | VGS = 4.5V, TA = +25°C, t < 10s | 2 |
| Continuous Drain Current, t < 10s | ID | | | 6.6 | A | VGS = 4.5V, TA = +70°C, t < 10s | 2 |
| Maximum Continuous Body Diode Forward Current | IS | | | 2 | A | | 2 |
| Pulsed Drain Current | IDM | | | 42 | A | 10µs Pulse, Duty Cycle = 1% | 2 |
| Avalanche Current | IAR | | | 17 | A | L = 0.1mH | 2 |
| Repetitive Avalanche Energy | EAR | | | 14 | mJ | L = 0.1mH | 2 |
| Operating and Storage Temperature Range | TJ, TSTG | -55 | | 150 | °C | | 2 |
| Total Power Dissipation (Note 8) | PD | | | 1.17 | W | Minimum recommended pad layout | 2 |
| Thermal Resistance, Junction to Ambient (Note 8), steady state | RθJA | | 107 | | °C/W | Steady State, minimum recommended pad layout | 2 |
| Thermal Resistance, Junction to Ambient (Note 8), t < 10s | RθJA | | 61 | | °C/W | t < 10s, minimum recommended pad layout | 2 |
| Total Power Dissipation (Note 5) | PD | | | 1.5 | W | 1inch square copper plate | 2 |
| Thermal Resistance, Junction to Ambient (Note 5), steady state | RθJA | | 83 | | °C/W | Steady State, 1inch square copper plate | 2 |
| Thermal Resistance, Junction to Ambient (Note 5), t < 10s | RθJA | | 49 | | °C/W | t < 10s, 1inch square copper plate | 2 |
| Thermal Resistance, Junction to Case | RθJC | | 14.5 | | °C/W | | 2 |
| Forward Transfer Admittance | /Yfs/ | | 8 | | S | VDS = 10V, ID = 9A | 3 |
| Input Capacitance | Ciss | | 798 | | pF | VDS = 10V, VGS = 0V, f = 1.0MHz | 3 |
| Output Capacitance | Coss | | 128 | | pF | VDS = 10V, VGS = 0V, f = 1.0MHz | 3 |
| Reverse Transfer Capacitance | Crss | | 122 | | pF | VDS = 10V, VGS = 0V, f = 1.0MHz | 3 |
| Gate Resistance | Rg | | 1.37 | | Ω | VDS = 0V, VGS = 0V, f = 1MHz | 3 |
| Total Gate Charge | Qg | | 8.56 | | nC | VGS = 5V, VDS = 15V, ID = 9A | 3 |
| Gate-Source Charge | Qgs | | 1.8 | | nC | VGS = 5V, VDS = 15V, ID = 9A | 3 |
| Gate-Drain Charge | Qgd | | 2.5 | | nC | VGS = 5V, VDS = 15V, ID = 9A | 3 |
| Turn-On Delay Time | tD(ON) | | 5.03 | | ns | VDD = 15V, VGEN = 10V, RL = 15Ω, RG = 6Ω, ID = 1A | 3 |
| Turn-On Rise Time | tR | | 4.5 | | ns | VDD = 15V, VGEN = 10V, RL = 15Ω, RG = 6Ω, ID = 1A | 3 |
| Turn-Off Delay Time | tD(OFF) | | 26.33 | | ns | VDD = 15V, VGEN = 10V, RL = 15Ω, RG = 6Ω, ID = 1A | 3 |
| Turn-Off Fall Time | tF | | 8.55 | | ns | VDD = 15V, VGEN = 10V, RL = 15Ω, RG = 6Ω, ID = 1A | 3 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | Copper | tin | Terminal Connections Indicator: See Diagram Terminals: Finish, Matte Tin Annealed over Copper Leadframe. | 1 |
## CAD (KiCad official)
- Symbol: `DMG4800LSDQ-13`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SO-8 (KiCad packages3D, STEP)
- 3D model files: `dmg4800lsdq-13-etched.step` / `dmg4800lsdq-13-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `dmg4800lsdq-13.step` / `dmg4800lsdq-13.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Diodes Incorporated datasheet](https://www.diodes.com/assets/Datasheets/DMG4800LSDQ-13.pdf) (8 pp, sha256 `cb48fab8b54527b1`, retrieved 2026-10-22, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/dmg4800lsdq-13-datasheet.pdf)