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DMG4468LK3-13

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Diodes Incorporated MOSFETs, TO-252. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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DMG4468LK3-13

Diodes Incorporated · MOSFETs · TO-252

DMG4468LK3-13 from Diodes Incorporated, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; gate-source voltage rating is ±20 V (VGSS) with threshold VGS(th) of 1.05 V min to 1.95 V max at ID = 250 µA.
2 D passive Drain (center lead, shorted to the drain tab); drain-source voltage rating is 30 V (VDSS) with 9.7 A continuous drain current at TA = +25°C.
3 S passive Source; connects to the body diode anode and the return path for drain current, with pulsed drain current up to 48 A (IDM).

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package TO-252
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS 30 V VGS = 0V, ID = 250µA 2
Zero Gate Voltage Drain Current (TJ = +25°C) IDSS 1 µA VDS = 30V, VGS = 0V 2
Gate-Source Leakage IGSS -100 100 nA VGS = ±20V, VDS = 0V 2
Gate Threshold Voltage VGS(th) 1.05 1.95 V VDS = VGS, ID = 250µA 2
Static Drain-Source On-Resistance RDS(ON) 11 17 mΩ VGS = 10V, ID = 11.6A 2
Static Drain-Source On-Resistance RDS(ON) 16 25 mΩ VGS = 4.5V, ID = 10A 2
Diode Forward Voltage VSD 0.73 1 V VGS = 0V, IS = 1A 2
Drain-Source Voltage VDSS 30 V 2
Gate-Source Voltage VGSS -20 20 V 2
Continuous Drain Current (steady state) ID 9.7 A TA = +25°C, steady state, device mounted on FR-4 PCB with minimum recommended pad layout (Note 5) 2
Continuous Drain Current (steady state) ID 6.3 A TA = +85°C, steady state, device mounted on FR-4 PCB with minimum recommended pad layout (Note 5) 2
Pulsed Drain Current IDM 48 A Repetitive rating, pulse width limited by junction temperature (Note 6) 2
Power Dissipation PD 1.68 W Device mounted on FR-4 PCB, minimum recommended pad layout (Note 5) 2
Thermal Resistance, Junction to Ambient RθJA 74.3 °C/W @TA = +25°C 2
Operating and Storage Temperature Range TJ, TSTG -55 150 °C 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts Copper tin • Terminals Connections: See Diagram • Terminals: Matte Tin Finish annealed over Copper leadframe. 1

CAD (KiCad official)

  • Symbol: DMG4468LK3-13
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252 (KiCad packages3D, STEP)
  • 3D model files: dmg4468lk3-13-etched.step / dmg4468lk3-13-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); dmg4468lk3-13.step / dmg4468lk3-13.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (6 pp, sha256 ca58e629f4bc9fe6, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF