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Contents

README

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DMC62D2SV-7

Diodes Incorporated · MOSFETs · SOT-563

DMC62D2SV-7 from Diodes Incorporated, in a SOT-563. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 S1 passive Source of N-channel MOSFET Q1 (60V BVDSS, 480mA max ID at TA = +25°C).
2 G1 input Gate of N-channel MOSFET Q1 with VGSS rating of ±20V and threshold of 1.0V to 2.5V.
3 D2 passive Drain of P-channel MOSFET Q2 (-60V BVDSS, -320mA max ID at TA = +25°C).
4 S2 passive Source of P-channel MOSFET Q2 (-60V BVDSS, -320mA max ID at TA = +25°C).
5 G2 input Gate of P-channel MOSFET Q2 with VGSS rating of ±20V and threshold of -1V to -3V.
6 D1 passive Drain of N-channel MOSFET Q1 (60V BVDSS, 480mA max ID at TA = +25°C).

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOT-563
Category Transistors/Thyristors
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage (N-ch Q1) VDSS 60 V Q1 N-channel, TA = +25°C 2
Gate-Source Voltage (N-ch Q1) VGSS -20 20 V Q1 N-channel, printed ±20 V 2
Continuous Drain Current (N-ch Q1) ID 480 mA VGS = 10V, steady state, TA = +25°C, Note 5 2
Continuous Drain Current (N-ch Q1) ID 380 mA VGS = 10V, steady state, TA = +70°C, Note 5 2
Maximum Body Diode Forward Current (N-ch Q1) IS 480 mA Note 5 2
Pulsed Drain Current (N-ch Q1) IDM 1.3 A Note 5 2
Pulsed Source Current (N-ch Q1) ISM 1.3 A Note 5 2
Drain-Source Voltage (P-ch Q2) VDSS -60 V Q2 P-channel, TA = +25°C 2
Gate-Source Voltage (P-ch Q2) VGSS -20 20 V Q2 P-channel, printed ±20 V 2
Continuous Drain Current (P-ch Q2) ID -320 mA VGS = -10V, steady state, TA = +25°C, Note 5 2
Continuous Drain Current (P-ch Q2) ID -250 mA VGS = -10V, steady state, TA = +70°C, Note 5 2
Maximum Body Diode Forward Current (P-ch Q2) IS -320 mA Note 5 2
Pulsed Drain Current (P-ch Q2) IDM -1 A Note 5 2
Pulsed Source Current (P-ch Q2) ISM -1 A Note 5 2
Total Power Dissipation PD 0.5 W Note 6, minimum recommended pad layout 2
Thermal Resistance, Junction to Ambient, Steady State RθJA 261 °C/W Note 6, minimum recommended pad layout 2
Total Power Dissipation PD 0.8 W Note 5, 1 inch square copper plate 2
Thermal Resistance, Junction to Ambient, Steady State RθJA 158 °C/W Note 5, 1 inch square copper plate 2
Operating and Storage Temperature Range TJ, TSTG -55 150 °C 2
Drain-Source Breakdown Voltage (N-ch Q1) BVDSS 60 V VGS = 0V, ID = 250μA 3
Zero Gate Voltage Drain Current (N-ch Q1) IDSS 1 µA VDS = 60V, VGS = 0V 3
Gate-Source Leakage (N-ch Q1) IGSS -10 10 µA VGS = ±20V, VDS = 0V 3
Gate Threshold Voltage (N-ch Q1) VGS(TH) 1 2.5 V VDS = VGS, ID = 250μA 3
Static Drain-Source On-Resistance (N-ch Q1) RDS(ON) 1.7 Ω VGS = 10V, ID = 200mA 3
Static Drain-Source On-Resistance (N-ch Q1) RDS(ON) 3 Ω VGS = 4.5V, ID = 200mA 3
Diode Forward Voltage (N-ch Q1) VSD 1.4 V VGS = 0V, IS = 115mA 3
Drain-Source Breakdown Voltage (P-ch Q2) BVDSS -60 V VGS = 0V, ID = -250μA 3
Zero Gate Voltage Drain Current (P-ch Q2) IDSS -1 µA VDS = -60V, VGS = 0V 3
Gate-Source Leakage (P-ch Q2) IGSS -100 100 nA VGS = ±20V, VDS = 0V 3
Gate Threshold Voltage (P-ch Q2) VGS(TH) -1 -3 V VDS = VGS, ID = -250μA 3
Static Drain-Source On-Resistance (P-ch Q2) RDS(ON) 4 Ω VGS = -10V, ID = -200mA 3
Static Drain-Source On-Resistance (P-ch Q2) RDS(ON) 6 Ω VGS = -4.5V, ID = -200mA 3
Diode Forward Voltage (P-ch Q2) VSD -1.4 V VGS = 0V, IS = -115mA 3

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts Copper tin  Terminal Connections Indicator: See Diagram  Terminals: Finish, Matte Tin Annealed over Copper Leadframe. 1

CAD (KiCad official)

  • Symbol: DMC62D2SV-7
  • Footprint: Package_TO_SOT_SMD:SOT-563
  • 3D model: SOT-563 (KiCad packages3D, STEP)
  • 3D model files: dmc62d2sv-7-etched.step / dmc62d2sv-7-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); dmc62d2sv-7.step / dmc62d2sv-7.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (10 pp, sha256 d217cb759693163f, retrieved 2026-10-20, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF