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DMC6040SSD-13
Public Made by Adomby adom
Diodes Incorporated MOSFETs, SO-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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dmc6040ssd-13: specified limits as data (metadata.characteristics, 44 rows from the datasheet)
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DMC6040SSD-13
Diodes Incorporated · MOSFETs · SO-8
DMC6040SSD-13 from Diodes Incorporated, in a SO-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | S1 | passive | Source of Q1 N-channel MOSFET (60V VDSS device). |
| 2 | G1 | input | Gate of Q1 N-channel MOSFET, rated for VGSS of ±20V. |
| 3 | S2 | passive | Source of Q2 P-channel MOSFET (-60V VDSS device). |
| 4 | G2 | input | Gate of Q2 P-channel MOSFET, rated for VGSS of ±20V. |
| 5 | D2 | passive | Drain of Q2 P-channel MOSFET, tied to pin 6 (-60V VDSS). |
| 6 | D2 | passive | Drain of Q2 P-channel MOSFET, tied to pin 5 (-60V VDSS). |
| 7 | D1 | passive | Drain of Q1 N-channel MOSFET, tied to pin 8 (60V VDSS). |
| 8 | D1 | passive | Drain of Q1 N-channel MOSFET, tied to pin 7 (60V VDSS). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Diodes Incorporated |
| Package | SO-8 |
| Category | Transistors/Thyristors |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage (Q1 N-Channel) | VDSS | 60 | V | 2 | |||
| Drain-Source Voltage (Q2 P-Channel) | VDSS | -60 | V | 2 | |||
| Gate-Source Voltage (Q1 N-Channel) | VGSS | -20 | 20 | V | 2 | ||
| Gate-Source Voltage (Q2 P-Channel) | VGSS | -20 | 20 | V | 2 | ||
| Continuous Drain Current Q1, steady state, TA=+25°C | ID | 5.1 | A | VGS = -10V, steady state, TA = +25°C (Note 5) | 2 | ||
| Continuous Drain Current Q1, steady state, TA=+70°C | ID | 4.1 | A | VGS = -10V, steady state, TA = +70°C (Note 5) | 2 | ||
| Continuous Drain Current Q1, t<10s, TA=+25°C | ID | 6.5 | A | VGS = -10V, t < 10s, TA = +25°C (Note 5) | 2 | ||
| Continuous Drain Current Q1, t<10s, TA=+70°C | ID | 5.2 | A | VGS = -10V, t < 10s, TA = +70°C (Note 5) | 2 | ||
| Continuous Drain Current Q2, steady state, TA=+25°C | ID | -3.1 | A | VGS = -10V, steady state, TA = +25°C (Note 5) | 2 | ||
| Continuous Drain Current Q2, steady state, TA=+70°C | ID | -2.5 | A | VGS = -10V, steady state, TA = +70°C (Note 5) | 2 | ||
| Continuous Drain Current Q2, t<10s, TA=+25°C | ID | -3.9 | A | VGS = -10V, t < 10s, TA = +25°C (Note 5) | 2 | ||
| Continuous Drain Current Q2, t<10s, TA=+70°C | ID | -3.1 | A | VGS = -10V, t < 10s, TA = +70°C (Note 5) | 2 | ||
| Maximum Body Diode Forward Current (Q1) | IS | 2.1 | A | Note 5 | 2 | ||
| Maximum Body Diode Forward Current (Q2) | IS | -2.1 | A | Note 5 | 2 | ||
| Pulsed Drain Current (Q1) | IDM | 28 | A | 10µs pulse, duty cycle = 1% | 2 | ||
| Pulsed Drain Current (Q2) | IDM | -19 | A | 10µs pulse, duty cycle = 1% | 2 | ||
| Avalanche Current (Q1) | IAS | 17.2 | A | L = 0.1mH | 2 | ||
| Avalanche Current (Q2) | IAS | -17.6 | A | L = 0.1mH | 2 | ||
| Avalanche Energy (Q1) | EAS | 14.7 | mJ | L = 0.1mH | 2 | ||
| Avalanche Energy (Q2) | EAS | 15.4 | mJ | L = 0.1mH | 2 | ||
| Total Power Dissipation, TA=+25°C (Note 7) | PD | 1.24 | W | TA = +25°C, Note 7 | 2 | ||
| Total Power Dissipation, TA=+70°C (Note 7) | PD | 0.8 | W | TA = +70°C, Note 7 | 2 | ||
| Total Power Dissipation, TA=+25°C (Note 5) | PD | 1.56 | W | TA = +25°C, Note 5 | 2 | ||
| Total Power Dissipation, TA=+70°C (Note 5) | PD | 1 | W | TA = +70°C, Note 5 | 2 | ||
| Thermal Resistance, Junction to Ambient, steady state (Note 7) | RθJA | 101 | °C/W | Steady state, Note 7 | 2 | ||
| Thermal Resistance, Junction to Ambient, t<10s (Note 7) | RθJA | 61 | °C/W | t < 10s, Note 7 | 2 | ||
| Thermal Resistance, Junction to Ambient, steady state (Note 5) | RθJA | 80 | °C/W | Steady state, Note 5 | 2 | ||
| Thermal Resistance, Junction to Ambient, t<10s (Note 5) | RθJA | 49 | °C/W | t < 10s, Note 5 | 2 | ||
| Thermal Resistance, Junction to Case (Note 5) | RθJC | 14.7 | °C/W | Note 5 | 2 | ||
| Operating and Storage Temperature Range | TJ, TSTG | -55 | 150 | °C | 2 | ||
| Drain-Source Breakdown Voltage (Q1) | BVDSS | 60 | V | VGS = 0V, ID = 250µA | 2 | ||
| Drain-Source Breakdown Voltage (Q2) | BVDSS | -60 | V | VGS = 0V, ID = -250µA | 5 | ||
| Zero Gate Voltage Drain Current (Q1) | IDSS | 1 | µA | VDS = 48V, VGS = 0V | 2 | ||
| Zero Gate Voltage Drain Current (Q2) | IDSS | -1 | µA | VDS = -48V, VGS = 0V | 5 | ||
| Gate-Source Leakage (Q1) | IGSS | 100 | nA | VGS = ±20V, VDS = 0V | 2 | ||
| Gate-Source Leakage (Q2) | IGSS | 100 | nA | VGS = ±16V, VDS = 0V | 5 | ||
| Gate Threshold Voltage (Q1) | VGS(TH) | 1 | 3 | V | VDS = VGS, ID = 250µA | 2 | |
| Gate Threshold Voltage (Q2) | VGS(TH) | -1 | -3 | V | VDS = VGS, ID = -250µA | 5 | |
| Static Drain-Source On-Resistance (Q1, VGS=10V) | RDS(ON) | 33 | 40 | mΩ | VGS = 10V, ID = 8A | 2 | |
| Static Drain-Source On-Resistance (Q1, VGS=4.5V) | RDS(ON) | 37 | 55 | mΩ | VGS = 4.5V, ID = 5A | 2 | |
| Static Drain-Source On-Resistance (Q2, VGS=-10V) | RDS(ON) | 86 | 110 | mΩ | VGS = -10V, ID = -4.5A | 5 | |
| Static Drain-Source On-Resistance (Q2, VGS=-4.5V) | RDS(ON) | 98 | 130 | mΩ | VGS = -4.5V, ID = -3.5A | 5 | |
| Diode Forward Voltage (Q1) | VSD | 0.7 | 1.2 | V | VGS = 0V, IS = 1A | 2 | |
| Diode Forward Voltage (Q2) | VSD | -0.7 | -1.2 | V | VGS = 0V, IS = -1A | 5 |
CAD (KiCad official)
- Symbol:
DMC6040SSD-13 - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SO-8 (KiCad packages3D, STEP)
- 3D model files:
dmc6040ssd-13-etched.step/dmc6040ssd-13-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);dmc6040ssd-13.step/dmc6040ssd-13.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Diodes Incorporated datasheet (9 pp, sha256
9b44588d83a16d40, retrieved 2026-10-09, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# DMC6040SSD-13
**Diodes Incorporated** · MOSFETs · SO-8
DMC6040SSD-13 from Diodes Incorporated, in a SO-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | S1 | passive | Source of Q1 N-channel MOSFET (60V VDSS device). |
| 2 | G1 | input | Gate of Q1 N-channel MOSFET, rated for VGSS of ±20V. |
| 3 | S2 | passive | Source of Q2 P-channel MOSFET (-60V VDSS device). |
| 4 | G2 | input | Gate of Q2 P-channel MOSFET, rated for VGSS of ±20V. |
| 5 | D2 | passive | Drain of Q2 P-channel MOSFET, tied to pin 6 (-60V VDSS). |
| 6 | D2 | passive | Drain of Q2 P-channel MOSFET, tied to pin 5 (-60V VDSS). |
| 7 | D1 | passive | Drain of Q1 N-channel MOSFET, tied to pin 8 (60V VDSS). |
| 8 | D1 | passive | Drain of Q1 N-channel MOSFET, tied to pin 7 (60V VDSS). |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Diodes Incorporated |
| Package | SO-8 |
| Category | Transistors/Thyristors |
| Pins | 8 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage (Q1 N-Channel) | VDSS | | | 60 | V | | 2 |
| Drain-Source Voltage (Q2 P-Channel) | VDSS | -60 | | | V | | 2 |
| Gate-Source Voltage (Q1 N-Channel) | VGSS | -20 | | 20 | V | | 2 |
| Gate-Source Voltage (Q2 P-Channel) | VGSS | -20 | | 20 | V | | 2 |
| Continuous Drain Current Q1, steady state, TA=+25°C | ID | | | 5.1 | A | VGS = -10V, steady state, TA = +25°C (Note 5) | 2 |
| Continuous Drain Current Q1, steady state, TA=+70°C | ID | | | 4.1 | A | VGS = -10V, steady state, TA = +70°C (Note 5) | 2 |
| Continuous Drain Current Q1, t<10s, TA=+25°C | ID | | | 6.5 | A | VGS = -10V, t < 10s, TA = +25°C (Note 5) | 2 |
| Continuous Drain Current Q1, t<10s, TA=+70°C | ID | | | 5.2 | A | VGS = -10V, t < 10s, TA = +70°C (Note 5) | 2 |
| Continuous Drain Current Q2, steady state, TA=+25°C | ID | -3.1 | | | A | VGS = -10V, steady state, TA = +25°C (Note 5) | 2 |
| Continuous Drain Current Q2, steady state, TA=+70°C | ID | -2.5 | | | A | VGS = -10V, steady state, TA = +70°C (Note 5) | 2 |
| Continuous Drain Current Q2, t<10s, TA=+25°C | ID | -3.9 | | | A | VGS = -10V, t < 10s, TA = +25°C (Note 5) | 2 |
| Continuous Drain Current Q2, t<10s, TA=+70°C | ID | -3.1 | | | A | VGS = -10V, t < 10s, TA = +70°C (Note 5) | 2 |
| Maximum Body Diode Forward Current (Q1) | IS | | | 2.1 | A | Note 5 | 2 |
| Maximum Body Diode Forward Current (Q2) | IS | -2.1 | | | A | Note 5 | 2 |
| Pulsed Drain Current (Q1) | IDM | | | 28 | A | 10µs pulse, duty cycle = 1% | 2 |
| Pulsed Drain Current (Q2) | IDM | -19 | | | A | 10µs pulse, duty cycle = 1% | 2 |
| Avalanche Current (Q1) | IAS | | | 17.2 | A | L = 0.1mH | 2 |
| Avalanche Current (Q2) | IAS | -17.6 | | | A | L = 0.1mH | 2 |
| Avalanche Energy (Q1) | EAS | | | 14.7 | mJ | L = 0.1mH | 2 |
| Avalanche Energy (Q2) | EAS | | | 15.4 | mJ | L = 0.1mH | 2 |
| Total Power Dissipation, TA=+25°C (Note 7) | PD | | | 1.24 | W | TA = +25°C, Note 7 | 2 |
| Total Power Dissipation, TA=+70°C (Note 7) | PD | | | 0.8 | W | TA = +70°C, Note 7 | 2 |
| Total Power Dissipation, TA=+25°C (Note 5) | PD | | | 1.56 | W | TA = +25°C, Note 5 | 2 |
| Total Power Dissipation, TA=+70°C (Note 5) | PD | | | 1 | W | TA = +70°C, Note 5 | 2 |
| Thermal Resistance, Junction to Ambient, steady state (Note 7) | RθJA | | | 101 | °C/W | Steady state, Note 7 | 2 |
| Thermal Resistance, Junction to Ambient, t<10s (Note 7) | RθJA | | | 61 | °C/W | t < 10s, Note 7 | 2 |
| Thermal Resistance, Junction to Ambient, steady state (Note 5) | RθJA | | | 80 | °C/W | Steady state, Note 5 | 2 |
| Thermal Resistance, Junction to Ambient, t<10s (Note 5) | RθJA | | | 49 | °C/W | t < 10s, Note 5 | 2 |
| Thermal Resistance, Junction to Case (Note 5) | RθJC | | | 14.7 | °C/W | Note 5 | 2 |
| Operating and Storage Temperature Range | TJ, TSTG | -55 | | 150 | °C | | 2 |
| Drain-Source Breakdown Voltage (Q1) | BVDSS | 60 | | | V | VGS = 0V, ID = 250µA | 2 |
| Drain-Source Breakdown Voltage (Q2) | BVDSS | -60 | | | V | VGS = 0V, ID = -250µA | 5 |
| Zero Gate Voltage Drain Current (Q1) | IDSS | | | 1 | µA | VDS = 48V, VGS = 0V | 2 |
| Zero Gate Voltage Drain Current (Q2) | IDSS | | | -1 | µA | VDS = -48V, VGS = 0V | 5 |
| Gate-Source Leakage (Q1) | IGSS | | | 100 | nA | VGS = ±20V, VDS = 0V | 2 |
| Gate-Source Leakage (Q2) | IGSS | | | 100 | nA | VGS = ±16V, VDS = 0V | 5 |
| Gate Threshold Voltage (Q1) | VGS(TH) | 1 | | 3 | V | VDS = VGS, ID = 250µA | 2 |
| Gate Threshold Voltage (Q2) | VGS(TH) | -1 | | -3 | V | VDS = VGS, ID = -250µA | 5 |
| Static Drain-Source On-Resistance (Q1, VGS=10V) | RDS(ON) | | 33 | 40 | mΩ | VGS = 10V, ID = 8A | 2 |
| Static Drain-Source On-Resistance (Q1, VGS=4.5V) | RDS(ON) | | 37 | 55 | mΩ | VGS = 4.5V, ID = 5A | 2 |
| Static Drain-Source On-Resistance (Q2, VGS=-10V) | RDS(ON) | | 86 | 110 | mΩ | VGS = -10V, ID = -4.5A | 5 |
| Static Drain-Source On-Resistance (Q2, VGS=-4.5V) | RDS(ON) | | 98 | 130 | mΩ | VGS = -4.5V, ID = -3.5A | 5 |
| Diode Forward Voltage (Q1) | VSD | | 0.7 | 1.2 | V | VGS = 0V, IS = 1A | 2 |
| Diode Forward Voltage (Q2) | VSD | | -0.7 | -1.2 | V | VGS = 0V, IS = -1A | 5 |
## CAD (KiCad official)
- Symbol: `DMC6040SSD-13`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SO-8 (KiCad packages3D, STEP)
- 3D model files: `dmc6040ssd-13-etched.step` / `dmc6040ssd-13-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `dmc6040ssd-13.step` / `dmc6040ssd-13.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Diodes Incorporated datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588879841999933440) (9 pp, sha256 `9b44588d83a16d40`, retrieved 2026-10-09, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/dmc6040ssd-13-datasheet.pdf)