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DMC2450UV-7

Diodes Incorporated · MOSFETs · SOT-563

DMC2450UV-7 from Diodes Incorporated, in a SOT-563. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 S1 passive Source of Q1 N-channel MOSFET (20V BVDSS, 1030mA max ID at VGS = 4.5V).
2 G1 input ESD-protected gate of Q1 N-channel MOSFET with gate threshold 0.5V to 0.9V and VGSS of ±12V.
3 D2 passive Drain of Q2 P-channel MOSFET (-20V BVDSS, -700mA max ID at VGS = -4.5V).
4 S2 passive Source of Q2 P-channel MOSFET.
5 G2 input ESD-protected gate of Q2 P-channel MOSFET with gate threshold -0.5V to -1.0V and VGSS of ±12V.
6 D1 passive Drain of Q1 N-channel MOSFET (20V VDSS, pulsed drain current 3A).

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOT-563
Category Transistors
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Q1 Drain-Source Breakdown Voltage BVDSS 20 V VGS = 0V, ID = 1mA 3
Q1 Zero Gate Voltage Drain Current IDSS 100 nA VDS = 20V, VGS = 0V, TJ = +25°C 3
Q1 Gate-Source Leakage IGSS -1 1 µA VGS = ±5V, VDS = 0V 3
Q1 Gate-Source Leakage IGSS -10 10 µA VGS = ±8V, VDS = 0V 3
Q1 Gate Threshold Voltage VGS(TH) 0.5 0.9 V VDS = VGS, ID = 250μA 3
Q1 Static On-Resistance RDS(ON) 0.3 0.48 Ω VGS = 5.0V, ID = 200mA 3
Q1 Static On-Resistance RDS(ON) 0.35 0.5 Ω VGS = 4.5V, ID = 200mA 3
Q1 Static On-Resistance RDS(ON) 0.45 0.7 Ω VGS = 2.5V, ID = 200mA 3
Q1 Static On-Resistance RDS(ON) 0.55 0.9 Ω VGS = 1.8V, ID = 100mA 3
Q1 Static On-Resistance RDS(ON) 0.65 1.5 Ω VGS = 1.5V, ID = 50mA 3
Q1 Diode Forward Voltage VSD 0.7 1.2 V VGS = 0V, IS = 500mA 3
Q2 Drain-Source Breakdown Voltage BVDSS -20 V VGS = 0V, ID = -1mA 6
Q2 Zero Gate Voltage Drain Current IDSS -100 nA VDS = -20V, VGS = 0V, TJ = 25°C 6
Q2 Gate-Source Leakage IGSS -1 1 µA VGS = ±5V, VDS = 0V 6
Q2 Gate-Source Leakage IGSS -10 10 µA VGS = ±8V, VDS = 0V 6
Q2 Gate Threshold Voltage VGS(TH) -0.5 -1 V VDS = VGS, ID = -250μA 6
Q2 Static On-Resistance RDS(ON) 0.67 0.97 Ω VGS = -5V, ID = -100mA 6
Q2 Static On-Resistance RDS(ON) 0.7 1 Ω VGS = -4.5V, ID = -100mA 6
Q2 Static On-Resistance RDS(ON) 0.9 1.5 Ω VGS = -2.5V, ID = -80mA 6
Q2 Static On-Resistance RDS(ON) 1.2 2 Ω VGS = -1.8V, ID = -40mA 6
Q2 Static On-Resistance RDS(ON) 1.5 3 Ω VGS = -1.5V, ID = -30mA 6
Q2 Diode Forward Voltage VSD -0.75 -1.2 V VGS = 0V, IS = -330mA 6
Q1 Drain-Source Voltage VDSS 20 V TA = +25°C 2
Q1 Gate-Source Voltage VGSS -12 12 V TA = +25°C 2
Q1 Continuous Drain Current ID 1030 mA VGS = 4.5V, Steady State, TA = +25°C 2
Q1 Continuous Drain Current ID 740 mA VGS = 1.8V, Steady State, TA = +25°C 2
Q1 Pulsed Drain Current IDM 3 A 10μs Pulse, Duty Cycle = 1% 2
Q1 Body Diode Continuous Current IS 800 mA TA = +25°C 2
Q2 Drain-Source Voltage VDSS -20 V TA = +25°C 2
Q2 Gate-Source Voltage VGSS -12 12 V TA = +25°C 2
Q2 Continuous Drain Current ID -700 mA VGS = -4.5V, Steady State, TA = +25°C 2
Q2 Continuous Drain Current ID -460 mA VGS = -1.8V, Steady State, TA = +25°C 2
Q2 Pulsed Drain Current IDM -2 A 10μs Pulse, Duty Cycle = 1% 2
Q2 Body Diode Continuous Current IS -800 mA TA = +25°C 2
Total Power Dissipation PD 0.45 W Note 6, minimum recommended pad layout 2
Total Power Dissipation PD 1 W Note 7, 1inch square copper plate 2
Operating and Storage Temperature Range TJ, TSTG -55 150 °C 2
Thermal Resistance, Junction to Ambient RθJA 281 °C/W Note 6, Steady State 2
Thermal Resistance, Junction to Ambient RθJA 210 °C/W Note 6, t<10s 2
Thermal Resistance, Junction to Ambient RθJA 129 °C/W Note 7, Steady State 2
Thermal Resistance, Junction to Ambient RθJA 97 °C/W Note 7, t<10s 2
Q1 Static On-Resistance RDS(ON) 2 Ω VGS = 1.2V, ID = 1mA 3
Q1 Input Capacitance Ciss 37.1 pF VDS = 10V, VGS = 0V, f = 1.0MHz 3
Q1 Output Capacitance Coss 6.5 pF VDS = 10V, VGS = 0V, f = 1.0MHz 3
Q1 Reverse Transfer Capacitance Crss 4.8 pF VDS = 10V, VGS = 0V, f = 1.0MHz 3
Q1 Gate Resistance Rg 68 Ω VDS = 0V, VGS = 0V 3
Q1 Total Gate Charge Qg 0.5 nC VGS = 4.5V, VDS = 10V, ID = 250mA 3
Q2 Input Capacitance Ciss 46.1 pF VDS = -10V, VGS = 0V, f = 1.0MHz 6
Q2 Output Capacitance Coss 7.2 pF VDS = -10V, VGS = 0V, f = 1.0MHz 6
Q2 Reverse Transfer Capacitance Crss 4.9 pF VDS = -10V, VGS = 0V, f = 1.0MHz 6
Q2 Gate Resistance Rg 14.3 Ω VDS = 0V, VGS = 0V 6
Q1 Turn-On Delay Time tD(ON) 4.06 ns VDD = 10V, VGS = 4.5V, RL = 47Ω, RG = 10Ω, ID = 200mA 3
Q1 Turn-Off Delay Time tD(OFF) 13.74 ns VDD = 10V, VGS = 4.5V, RL = 47Ω, RG = 10Ω, ID = 200mA 3
Q2 Turn-On Delay Time tD(ON) 8.5 ns VDD = -3V, VGS = -2.5V, RL = 300Ω, RG = 25Ω, ID = -100mA 6
Q2 Turn-Off Delay Time tD(OFF) 20.2 ns VDD = -3V, VGS = -2.5V, RL = 300Ω, RG = 25Ω, ID = -100mA 6

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts Copper tin  Terminal Connections: See Diagram  Terminals: Finish, Matte Tin Annealed over Copper 1

CAD (KiCad official)

  • Symbol: DMC2450UV-7
  • Footprint: Package_TO_SOT_SMD:SOT-563
  • 3D model: SOT-563 (KiCad packages3D, STEP)
  • 3D model files: dmc2450uv-7-etched.step / dmc2450uv-7-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); dmc2450uv-7.step / dmc2450uv-7.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (10 pp, sha256 af32362280127a02, retrieved 2026-10-23, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF