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DK2649CB
Public Made by Adomby adom
Shenzhen DongKe Semicon AC-DC Controllers And Regulators, SOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownDK2649CB
Shenzhen DongKe Semicon · AC-DC Controllers And Regulators · SOP-8
DK2649CB from Shenzhen DongKe Semicon, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Ground reference pin for the controller; the datasheet gives no electrical limit for this pin. |
| 2 | VDD | power_in | Supply pin with a stated AC-input operating range of 9 V to 34 V, UVLO turn-on at 7.0 to 8.4 V, and VDD overvoltage protection at 35 to 38 V. |
| 3 | FB | input | Feedback input with a 4.8 to 6.2 V open-loop voltage, where FB falling below 1.6 V enters skip (burst) mode and the short-circuit current is 0.24 mA. |
| 4 | CS | input | Current-sense input with an overcurrent threshold of 0.71 to 0.80 V, 270 ns leading-edge blanking and 40 kΩ input impedance, so no external RC filter is required. |
| 5 | DRAIN | passive | Drain of the internal 650 V power MOSFET (RDS(ON) 1.8 to 2 Ω); enlarge and tin the copper area for heat dissipation and keep at least 1.5 mm clearance from low-voltage parts. |
| 6 | DRAIN | passive | Drain of the internal 650 V power MOSFET (RDS(ON) 1.8 to 2 Ω); enlarge and tin the copper area for heat dissipation and keep at least 1.5 mm clearance from low-voltage parts. |
| 7 | DRAIN | passive | Drain of the internal 650 V power MOSFET (RDS(ON) 1.8 to 2 Ω); enlarge and tin the copper area for heat dissipation and keep at least 1.5 mm clearance from low-voltage parts. |
| 8 | DRAIN | passive | Drain of the internal 650 V power MOSFET (RDS(ON) 1.8 to 2 Ω); enlarge and tin the copper area for heat dissipation and keep at least 1.5 mm clearance from low-voltage parts. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Shenzhen DongKe Semicon |
| Package | SOP-8 |
| Category | Power Management (PMIC) |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| 功率管漏源电压 | VDRAIN_MAX | 650 | 700 | V | 3 | ||
| VDD供电电压 | VDD | 40 | V | 3 | |||
| IDD供电电流 | IDD | 10 | mA | 3 | |||
| 储存温度范围 | TSTG | -55 | 155 | ℃ | 3 | ||
| 结温 | TJ | 150 | ℃ | 3 | |||
| 焊接温度 | TW | 280 | ℃ | 5S | 3 | ||
| VDD工作电压 | VDD | 9 | 17 | 34 | V | AC 输入 85V-265V | 3 |
| 启动电流 | IDD_ST | 5 | 20 | uA | VDD=11V,测试 VDD 端电流 | 3 | |
| 工作电流 | IOP | 0.83 | mA | VDD=17V, VFB=3V, VCS=0V | 3 | ||
| 欠压保护开启电压 | Vuvlo(ON) | 7 | 7.7 | 8.4 | V | VDD 下降至 IC 关闭 | 3 |
| 欠压保护关断电压 | Vuvlo (OFF) | 15.5 | 16 | 17 | V | VDD 上升至 IC 开启 | 3 |
| 跳频保护电压 | VDD_ET | 7.7 | 8.2 | 8.7 | V | FB=0V,CS=0V | 3 |
| 过压保护 | VOVP | 35 | 35.7 | 38 | V | VDD=17V, VCS=0V, VFB=3V, VDD 上升直到 DRAIN 端频率消失 | 3 |
| FB 开环电压 | VFB_OPEN | 4.8 | 5.55 | 6.2 | V | 3 | |
| FB 短路电流 | IFB_SHORT | 0.24 | mA | VDD=17V, FB 短路到地 | 3 | ||
| 绿色模式阈值 | VTH_GREEN | 2.2 | V | VDD=17V, VCS=0V, VFB=3V, FB 下降,当 DRAIN 端频率小于 35KHZ 时 | 3 | ||
| 跳频模式阈值 | VTH_BM | 1.6 | V | VDD=17V, FB 下降 | 3 | ||
| 前沿消隐时间 | TLEB | 270 | ns | 3 | |||
| CS 脚输入阻抗 | ZCS_IN | 40 | kΩ | 3 | |||
| CS 脚过流保护阈值 | VTH_OC | 0.71 | 0.77 | 0.8 | V | VDD=17V, VFB=3V, CS 上升至关断功率管 | 3 |
| 过流保护延迟时间 | TD_OC | 120 | ns | 从过流保护至功率管开始关断的延迟时间 | 3 | ||
| 振荡频率 | FOSC | 60 | 65 | 70 | KHz | VDD=17V, VFB=3V, VCS=0V | 3 |
| 最大占空比 | DMAX | 65 | 70 | 85 | % | VDD=17V, VFB=3.3V, VCS=0V | 3 |
| 跳频频率 | FBURST | 25 | KHz | 3 | |||
| 抖频范围 | ΔFOSC | -4 | 4 | % | 3 | ||
| 功率管导通内阻 | RDS(ON) | 1.8 | 2 | Ω | 3 | ||
| 过温保护 | TOTP | 150 | ℃ | 3 |
CAD (KiCad official)
- Symbol:
DK2649CB - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files:
dk2649cb-etched.step/dk2649cb-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);dk2649cb.step/dk2649cb.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Shenzhen DongKe Semicon datasheet (9 pp, sha256
272ea9fe50f29bf3, retrieved 2026-10-19, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).