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Contents

README

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DHE1M

FUXINSEMI · Fast Recovery / High Efficiency Diodes · SOD-123

DHE1M from FUXINSEMI, in a SOD-123. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CATHODE passive Cathode terminal of the DHE1M rectifier, marked by the color band at the cathode end of the package; device VRRM is 1000 V and average rectified current is 1.0 A.
2 ANODE passive Anode terminal of the DHE1M rectifier, which conducts forward current toward the cathode (pin 1) within the device ratings of 1000 V VRRM and 1.0 A average forward current.

Key specifications

Parameter Value
Manufacturer FUXINSEMI
Package SOD-123
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum repetitive peak reverse voltage VRRM 1000 V 1
Maximum RMS voltage VRMS 700 V 1
Maximum DC blocking voltage VDC 1000 V 1
Maximum average forward rectified current I(AV) 1 A at TL=100 C 1
Peak forward surge current IFSM 25 A 8.3ms single half sine-wave superimposed on rated load 1
Maximum instantaneous forward voltage VF 1.7 V at 1.0A 1
Maximum DC reverse current IR 5 µA TA=25 C at rated DC blocking voltage 1
Maximum DC reverse current IR 50 µA TA=100 C at rated DC blocking voltage 1
Maximum reverse recovery time trr 50 75 ns NOTE 1: IF=0.5A, IR=1.0A, Irr=0.25A 1
Typical junction capacitance CJ 20 pF NOTE 2: measured at 1MHz and applied reverse voltage of 4.0V D.C. 1
Typical thermal resistance RθJA 85 C/W NOTE 3: P.C.B. mounted with 0.2x0.2in (5.0x5.0mm) copper pad areas 1
Operating junction and storage temperature range TJ,TSTG -55 150 C 1

CAD (KiCad official)

  • Symbol: DHE1M
  • Footprint: Diode_SMD:D_SOD-123F
  • 3D model: SOD-123 (KiCad packages3D, STEP)
  • 3D model files: dhe1m-etched.step / dhe1m-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); dhe1m.step / dhe1m.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: FUXINSEMI datasheet (4 pp, sha256 7d088f93f1031992, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF