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Contents

README

markdown

DESD3V3S1BL-7B

Diodes Incorporated · TVS · DFN1006-2

DESD3V3S1BL-7B from Diodes Incorporated, in a DFN1006-2. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive Bidirectional TVS terminal identified by the bar on the bottom view as Pin #1, protecting one channel to ±25kV contact / ±30kV air per IEC 61000-4-2 with VRWM 3.3V max.
2 2 passive Second bidirectional TVS terminal, interchangeable with pin 1 for the single protected channel (VRWM 3.3V max, VBR 3.8V to 6.5V at 1mA).

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package DFN1006-2
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Standoff Voltage VRWM 3.3 V 2
Channel Leakage Current IRM 10 100 nA VRWM = 3.3V 2
Clamping Voltage, Positive Transients VCL 4.5 5.4 V IPP = 1A, tP = 8/20μs 2
Clamping Voltage, Positive Transients VCL 5.8 7 V IPP = 5A, tP = 8/20μs 2
Breakdown Voltage VBR 3.8 6.5 V IR = 1mA 2
Channel Input Capacitance CT 10 13 pF VR = 0V, f = 1MHz 2
Differential Resistance RDIF 0.3 Ω IR = 1A 2
Peak Pulse Power Dissipation PPP 35 W 8/20μs, Per Figure 3 2
Peak Pulse Current IPP 5 A 8/20μs, Per Figure 3 2
ESD Protection, Contact Discharge VESD_CONTACT -25 25 kV IEC 61000-4-2 Standard 2
ESD Protection, Air Discharge VESD_AIR -30 30 kV IEC 61000-4-2 Standard 2
Package Power Dissipation PD 250 mW Note 5 2
Thermal Resistance, Junction to Ambient RθJA 500 °C/W Note 5 2
Operating and Storage Temperature Range TJ, TSTG -65 150 °C 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts Copper  Terminals: NiPdAu over Copper Leadframe. Solderable per MIL￾STD-202, Method 208 1

CAD (KiCad official)

  • Symbol: DESD3V3S1BL-7B
  • Footprint: Diode_SMD:D_SOD-882
  • 3D model: DFN1006-2 (KiCad packages3D, STEP)
  • 3D model files: desd3v3s1bl-7b-etched.step / desd3v3s1bl-7b-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); desd3v3s1bl-7b.step / desd3v3s1bl-7b.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (6 pp, sha256 9c7eeddba810d7a1, retrieved 2026-10-22, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF