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DESD2FLEX2SOQ-7

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Diodes Incorporated Electrostatic And Surge Protection (TVS/ESD), SOT-23-3. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componenttvs-fuse-board level protectiondesd2flex2soq-7factory-2.0.0extractor-text
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3D Model

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Symbol & Footprint

Schematic Symbol

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PCB Footprint

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Datasheet

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Contents

README

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DESD2FLEX2SOQ-7

Diodes Incorporated · Electrostatic And Surge Protection (TVS/ESD) · SOT-23-3

DESD2FLEX2SOQ-7 from Diodes Incorporated, in a SOT-23-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 PIN1 passive ESD protection channel 1 (FlexRay bus line), TVS diode to common pin 3; VRWM 24V max, VBR 25.4V min.
2 PIN2 passive ESD protection channel 2 (FlexRay bus line), TVS diode to common pin 3; VRWM 24V max, VBR 25.4V min.
3 PIN3 passive Common node of the two back-to-back TVS diode channels, shown in the schematic as joining pins 1 and 2 through the diodes; connect to ground reference.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOT-23-3
Category TVS/Fuse/Board Level Protection
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Standoff Voltage VRWM 24 V 2
Channel Leakage Current IRM 10 nA VRWM = 24V 2
Clamping Voltage, Positive Transients VCL 34 V IPP = 1A, tP = 8/20μs, Figure 1 2
Clamping Voltage, Positive Transients VCL 41 V IPP = 5A, tP = 8/20μs, Figure 1 2
Breakdown Voltage VBR 25.4 28 30.3 V IR = 1mA 2
Channel Input Capacitance CT 25 30 pF VR = 0V, f = 5MHz 2
Differential Resistance RDIF 0.4 Ω IR = 1A, tP = 8/20μs 2
Peak Pulse Power Dissipation PPP 230 W 8/20µs, per Figure 1 2
Peak Pulse Current IPP 5 A 8/20µs, per Figure 1 2
ESD Protection, Contact Discharge VESD_Contact -30 30 kV IEC 61000-4-2 Standard 2
ESD Protection, Air Discharge VESD_Air -30 30 kV IEC 61000-4-2 Standard 2
Package Power Dissipation PD 300 mW Device mounted on FR-4 PCB pad layout (2oz copper) 2
Thermal Resistance, Junction to Ambient RθJA 417 °C/W Device mounted on FR-4 PCB pad layout (2oz copper) 2
Operating and Storage Temperature Range TJ, TSTG -65 150 °C 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin  Terminals: Matte Tin Finish Annealed over Alloy 42 Leadframe (Lead-Free Plating). Solderable per MIL-STD-202, Method 208 1

CAD (KiCad official)

  • Symbol: DESD2FLEX2SOQ-7
  • Footprint: Package_TO_SOT_SMD:SOT-23-3
  • 3D model: SOT-23-3 (KiCad packages3D, STEP)
  • 3D model files: desd2flex2soq-7-etched.step / desd2flex2soq-7-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); desd2flex2soq-7.step / desd2flex2soq-7.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (5 pp, sha256 23aef7ebf92d500b, retrieved 2026-10-23, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF