DAC8830IBD from Texas Instruments, in a SO-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	VOUT	output	Analog output of the DAC; for the DAC8830 the unipolar output spans 0 V to +VREF.
2	AGND	power_in	Analog ground for the DAC.
3	VREF	power_in	Voltage reference input; the reference input voltage range is 1.25 V to VDD, and references below 1.25 V reduce accuracy.
4	CS	input	Chip select input, active low; data are not clocked into SDI unless CS is low.
5	SCLK	input	Serial clock input, supporting clock rates up to 50 MHz.
6	SDI	input	Serial data input; data are latched into the input register on the rising edge of SCLK.
7	DGND	power_in	Digital ground.
8	VDD	power_in	Analog power supply, +3 V to +5 V (operating range 2.7 V to 5.5 V).

Key specifications

Parameter	Value
Manufacturer	Texas Instruments
Package	SO-8
Category	Data Acquisition
Pins	8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter	Symbol	Min	Typ	Max	Unit	Conditions	Page
Linearity error			0.5	2	LSB		3
Differential linearity error			0.5	1	LSB	All grades	3
Gain error			1	5	LSB	TA = +25°C	3
Gain error				7	LSB	TA = -40°C to +85°C	3
Zero code error			0.25	1	LSB	TA = +25°C	3
Zero code error				2	LSB	TA = -40°C to +85°C	3
Input low voltage	VIL			0.6	V	VDD = 2.7 V	4
Input low voltage	VIL			0.8	V	VDD = 5 V	4
Input high voltage	VIH	2.1			V	VDD = 2.7 V	4
Input high voltage	VIH	2.4			V	VDD = 5 V	4
Input current		-1		1	μA		4
Power-supply voltage	VDD	2.7		5.5	V		4
Power-supply current	IDD		5	20	μA	VDD = 3 V	4
Power			15	60	μW	VDD = 3 V	4
Power			25	100	μW	VDD = 5 V	4
Specified performance temperature range		-40		85	°C	Specified performance	4
Reference input voltage range		1.25			V	Upper limit VDD	4
VDD to AGND	VDD	-0.3		7	V		2
Digital input voltage to DGND		-0.3			V	Upper limit +VDD + 0.3 V	2
VOUT to AGND	VOUT	-0.3			V	Upper limit +VDD + 0.3 V	2
AGND, AGNDF, AGNDS to DGND		-0.3		0.3	V		2
Operating temperature range		-40		85	°C	Over operating free-air temperature range	2
Storage temperature range		-65		150	°C		2
Junction temperature range	TJ			150	°C		2
Thermal impedance SO-8	θJA		136.9		°C/W	SO-8 package	2
SCLK period	tsck	20			ns	At -40°C to +85°C, VDD = +5 V	7
SCLK high or low time	twsck	10			ns	At -40°C to +85°C, VDD = +5 V	7
Delay from SCLK high to CS low	tDelay	10			ns	At -40°C to +85°C, VDD = +5 V	7
CS enable lead time	tLead	10			ns	At -40°C to +85°C, VDD = +5 V	7
CS enable lag time	tLag	10			ns	At -40°C to +85°C, VDD = +5 V	7
Delay from CS high to SCLK high	tDSCLK	10			ns	At -40°C to +85°C, VDD = +5 V	7
CS high between active period	ttd	30			ns	At -40°C to +85°C, VDD = +5 V	7
Data setup time (input)	tsu	10			ns	At -40°C to +85°C, VDD = +5 V	7
Data hold time (input)	tho	0			ns	At -40°C to +85°C, VDD = +5 V	7
LDAC width	tWLDAC	30			ns	At -40°C to +85°C, VDD = +5 V	7
Delay from CS high to LDAC low	tDLDAC	30			ns	At -40°C to +85°C, VDD = +5 V	7
VDD high to CS low (power-up delay)		10			μs	At -40°C to +85°C, VDD = +5 V	7
Gain drift			0.1		ppm/°C		3
Zero code drift			0.05		ppm/°C		3
Output impedance			6.25		kΩ		3
Settling time			1		μs	To 1/2 LSB of FS, CL = 10 pF	3
Slew rate			25		V/μs	CL = 10 pF	3
Digital-to-analog glitch			35		nV-s	1 LSB change around major carry	3
Digital feedthrough			0.2		nV-s		3
Output noise			10		nV/√Hz	DAC8830, TA = +25°C	3
Power-supply rejection			1		LSB	VDD varies ±10%	3
Reference input impedance			9		kΩ	Unipolar mode	4
Reference -3dB bandwidth	BW		1.3		MHz	Code = FFFFh	4
Reference feedthrough			1		mV	Code = 0000h, VREF = 1 VPP at 100 kHz	4
Signal-to-noise ratio	SNR		92		dB		4
Reference input capacitance			75		pF	Code = 0000h	4
Reference input capacitance			120		pF	Code = FFFFh	4
Input capacitance			10		pF		4
Hysteresis voltage			0.4		V		4

CAD (KiCad official)

Symbol: DAC8830IBD
Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
3D model: SO-8 (KiCad packages3D, STEP)
3D model files: dac8830ibd-etched.step / dac8830ibd-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); dac8830ibd.step / dac8830ibd.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Texas Instruments datasheet (35 pp, sha256 0d278957e743753a, retrieved 2026-11-06, tier: manufacturer)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF

DAC8830IBD

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3D Model

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