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DAC7552IRGTR

Texas Instruments · Digital To Analog Converters (DACs) · TQFN-16-EP(3x3)

DAC7552IRGTR from Texas Instruments, in a TQFN-16-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin	Name	Type	Function
1	VOUTA	output	Analog voltage output from DAC A; the output swings rail-to-rail over 0 V to VREF.
2	VDD	power_in	Analog supply input, 2.7 V to 5.5 V.
3	GND	power_in	Ground; the thermal pad should be connected to GND.
4	VOUTB	output	Analog voltage output from DAC B; the output swings rail-to-rail over 0 V to VREF.
5	VFBB	input	DAC B amplifier sense input; for voltage output operation, connect to VOUTB externally.
6	VREFB	input	Positive reference voltage input for DAC B; input range 0 V to VDD.
7	PD	input	Power-down control input; the datasheet gives no polarity or threshold for this pin in the pin table.
8	DCEN	input	Daisy-chain enable input.
9	SDO	output	Serial data output for daisy-chaining; SDO is valid 10 ns max after the SCLK falling edge at VDD = 2.7 V to 3.6 V (t9).
10	IOVDD	power_in	I/O voltage supply input; for single-supply operation, connect to VDD externally.
11	SYNC	input	Frame synchronization input; the falling edge of SYNC indicates the start of a serial data frame shifted into the DAC7552.
12	SCLK	input	Serial clock input, up to 50 MHz.
13	SDIN	input	Serial data input.
14	CLR	input	Asynchronous clear input; when low, the DAC registers are set to 000H and the output voltage to 0 V.
15	VREFA	input	Positive reference voltage input for DAC A; input range 0 V to VDD.
16	VFBA	input	DAC A amplifier sense input; for voltage output operation, connect to VOUTA externally.
17	EP	passive	Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter	Value
Manufacturer	Texas Instruments
Package	TQFN-16-EP(3x3)
Category	ADC/DAC/Data Conversion
Pins	17

CAD (KiCad official)

Symbol: DAC7552IRGTR
Footprint: Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm
3D model: TQFN-16-EP(3x3) (KiCad packages3D, STEP)
3D model files: dac7552irgtr-etched.step / dac7552irgtr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); dac7552irgtr.step / dac7552irgtr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

Datasheet: Texas Instruments datasheet (27 pp, sha256 f62e540c826e1ba2, retrieved 2026-10-08, tier: lcsc)
Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF