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DAC6571IDBVT

Texas Instruments · Digital To Analog Converters (DACs) · SOT-23-6

DAC6571IDBVT from Texas Instruments, in a SOT-23-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VOUT output Analog output voltage from the DAC, swinging from 0 V to VDD.
2 GND power_in Ground reference point for all circuitry on the part.
3 VDD power_in Analog voltage supply input, specified from +2.7 V to +5.5 V.
4 SDA bidirectional Serial data input for the I2C two-wire interface, operating at clock rates up to 3.4 MBPS.
5 SCL input Serial clock input for the I2C two-wire interface, operating at clock rates up to 3.4 MBPS.
6 A0 input Device address select, allowing up to two DAC6571 devices to share the same data bus.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOT-23-6
Category Data Converters
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
VDD to GND VDD -0.3 6 V 2
Digital input voltage to GND -0.3 V max printed as +VDD + 0.3 V 2
VOUT to GND VOUT -0.3 V max printed as +VDD + 0.3 V 2
Operating temperature range TA -40 105 °C 2
Storage temperature range -65 150 °C 2
Junction temperature range (TJ max) TJ 150 °C 2
Thermal impedance RθJA 240 °C/W 2
Lead temperature, soldering vapor phase 215 °C Vapor phase (60 s) 2
Lead temperature, soldering infrared 220 °C Infrared (15 s) 2
Supply voltage VDD 2.7 5.5 V 3
Relative accuracy -2 2 LSB 3
Differential nonlinearity -0.5 0.5 LSB Assured monotonic by design 3
Zero code error 5 20 mV 3
Full-scale error -0.15 -1.25 % of FSR All ones loaded to DAC register 3
Gain error -1.25 1.25 % of FSR 3
Zero code error drift -7 7 µV/°C 3
Gain temperature coefficient -3 3 ppm of FSR/°C 3
Output voltage range VOUT 0 V max printed as VDD 3
Output voltage settling time 7 9 µs 1/4 scale to 3/4 scale change (400H to C00H); RL = ∞ 3
Slew rate 1 V/µs RL = ∞ 3
Capacitive load stability CL 470 pF RL = ∞ 3
Capacitive load stability CL 1000 pF RL = 2 kΩ 3
Code change glitch impulse 20 nV-s 1 LSB change around major carry 3
Digital feedthrough 0.5 nV-s 3
DC output impedance 1 Ω 3
Short-circuit current 50 mA VDD = +5 V 3
Short-circuit current 20 mA VDD = +3 V 3
Power-up time 2.5 µs Coming out of power-down mode, VDD = +5 V 3
Power-up time 5 µs Coming out of power-down mode, VDD = +3 V 3
Input current -1 1 µA 3
Input low voltage VINL 0.3 V VDD = +3 V; printed as 0.3 × VDD 3
Input high voltage VINH 0.7 V VDD = +5 V; printed as 0.7 × VDD 3
Pin capacitance 3 pF 3
IDD (normal operation) IDD 155 200 µA VDD = +3.6 V to +5.5 V; VIH = VDD and VIL = GND; DAC active, excluding load current 3
IDD (normal operation) IDD 125 160 µA VDD = +2.7 V to +3.6 V; VIH = VDD and VIL = GND; DAC active, excluding load current 3
IDD (all power-down modes) IDD 0.2 1 µA VDD = +3.6 V to +5.5 V; VIH = VDD and VIL = GND 3
IDD (all power-down modes) IDD 0.05 1 µA VDD = +2.7 V to +3.6 V; VIH = VDD and VIL = GND 3
Power efficiency IOUT/IDD 93 % ILOAD = 2 mA, VDD = +5 V 3
SCL clock frequency, standard mode fSCL 100 kHz Standard mode 4
SCL clock frequency, fast mode fSCL 400 kHz Fast mode 4
SCL clock frequency, high-speed mode fSCL 3.4 MHz High-speed mode, CB = 100 pF max 4
SCL clock frequency, high-speed mode fSCL 1.7 MHz High-speed mode, CB = 400 pF max 4
Data hold time tHD; tDAT 0 3.45 µs Standard mode 4
Data hold time tHD; tDAT 0 0.9 µs Fast mode 4
Data setup time tSU; tDAT 250 ns Standard mode 4
Data setup time tSU; tDAT 100 ns Fast mode 4
Data setup time tSU; tDAT 10 ns High-speed mode 4
Bus free time between STOP and START tBUF 4.7 µs Standard mode 4
Bus free time between STOP and START tBUF 1.3 µs Fast mode 4
Setup time for STOP condition tSU; tSTO 4 µs Standard mode 5
Capacitive load for SDA and SCL CB 400 pF 5

CAD (KiCad official)

  • Symbol: DAC6571IDBVT
  • Footprint: Package_TO_SOT_SMD:SOT-23-6
  • 3D model: SOT-23-6 (KiCad packages3D, STEP)
  • 3D model files: dac6571idbvt-etched.step / dac6571idbvt-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); dac6571idbvt.step / dac6571idbvt.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (26 pp, sha256 aa2db9271760619b, retrieved 2026-11-02, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF