← Commit history

Initial commit: component/dac63204rter

Ray ·08ad5d74b8 ·23h ago
2 files changed +268
README.mdadded+54
@@ -0,0 +1,54 @@+# DAC63204RTER++**Texas Instruments** · Digital To Analog Converters (DAC) · WQFN-16(3x3)++DAC63204RTER from Texas Instruments, in a WQFN-16(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.++## Pinout++| Pin | Name | Type | Function |+|---|---|---|---|+| 1 | FB3 | input | Channel 3 voltage feedback input; connect to OUT3 in voltage mode, leave unconnected in current mode to minimize leakage current. |+| 2 | OUT3 | output | DAC channel 3 analog output voltage or current depending on programmed configuration. |+| 3 | OUT2 | output | DAC channel 2 analog output voltage or current depending on programmed configuration. |+| 4 | FB2 | input | Channel 2 voltage feedback input; connect to OUT2 in voltage mode, leave unconnected in current mode to minimize leakage current. |+| 5 | GPIO/SDO | bidirectional | General purpose input/output configurable as LDAC, PD, PROTECT, RESET, SDO or STATUS; requires external pull-up resistor for output functions; requires pull to VDD or AGND when unused. |+| 6 | SCL/SYNC | tri_state | I2C serial clock input (open-drain) or SPI chip select input; requires external pull-up resistor; can be pulled high before VDD rises. |+| 7 | A0/SDI | input | I2C address configuration input or SPI serial data input; connect to VDD, AGND, SDA or SCL for I2C address selection; no pull-up/pull-down required for SPI. |+| 8 | SDA/SCLK | bidirectional | I2C bidirectional serial data line (open-drain) or SPI serial clock input; requires external pull-up resistor for I2C mode; can be pulled high before VDD rises. |+| 9 | FB1 | input | Channel 1 voltage feedback input; connect to OUT1 in voltage mode, leave unconnected in current mode to minimize leakage current. |+| 10 | OUT1 | output | DAC channel 1 analog output voltage or current depending on programmed configuration. |+| 11 | OUT0 | output | DAC channel 0 analog output voltage or current depending on programmed configuration. |+| 12 | FB0 | input | Channel 0 voltage feedback input; connect to OUT0 in voltage mode, leave unconnected in current mode to minimize leakage current. |+| 13 | CAP | power_in | External bypass capacitor connection for internal LDO; connect 1.5μF capacitor between this pin and AGND. |+| 14 | AGND | power_in | Analog ground reference for all device circuits. |+| 15 | VDD | power_in | Supply voltage input 1.7V to 5.5V range; requires 0.1μF decoupling capacitor to AGND. |+| 16 | VREF | power_in | External reference voltage input or internal reference connection; connect 0.1μF capacitor to AGND; must not rise before VDD when external reference used. |+| 17 | Thermal Pad | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |++## Key specifications++| Parameter | Value |+|---|---|+| Manufacturer | Texas Instruments |+| Package | WQFN-16(3x3) |+| Category | Data Acquisition |+| Pins | 17 |++## CAD (KiCad official)++- Symbol: `DAC63204RTER`+- Footprint: `Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm`+- 3D model: WQFN-16(3x3) (KiCad packages3D, STEP)+- 3D model files: `dac63204rter-etched.step` / `dac63204rter-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `dac63204rter.step` / `dac63204rter.glb` are the bare package body.++## Provenance++Data extracted from the manufacturer datasheet, not a distributor listing:++- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/cn/lit/gpn/dac53204) (86 pp, sha256 `bafd26ceef14bae6`, retrieved 2026-10-05, tier: lcsc)+- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.+- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-4-5-20251001` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.+- **CAD:** KiCad official libraries (CC-BY-SA 4.0).++[Datasheet PDF](docs/dac63204rter-datasheet.pdf)
page.jsonadded+214
@@ -0,0 +1,214 @@+{+  "slug": "dac63204rter",+  "version": "0.1.0",+  "type": "component",+  "description": "Texas Instruments Digital To Analog Converters (DAC), WQFN-16(3x3). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.",+  "tags": [+    "component",+    "data acquisition",+    "dac63204rter",+    "factory-2.0.0",+    "extractor-text"+  ],+  "dependencies": {},+  "hero": {+    "type": "image",+    "path": "docs/hero.png"+  },+  "files": [+    "page.json",+    "README.md",+    "dac63204rter.kicad_sym",+    "dac63204rter.kicad_mod",+    "dac63204rter.glb",+    "dac63204rter.step",+    "dac63204rter.lbr",+    "docs/hero.png",+    "docs/dac63204rter-datasheet.pdf",+    "viewers/symbol.html",+    "viewers/footprint.html",+    "dac63204rter-hero.glb",+    "dac63204rter-hero.overlay.json"+  ],+  "component": {+    "mpn": "DAC63204RTER",+    "manufacturer": "Texas Instruments",+    "package": "WQFN-16(3x3)",+    "pin_count": 17,+    "category": "Data Acquisition",+    "subcategory": "Digital To Analog Converters (DAC)",+    "datasheet": "https://www.ti.com/cn/lit/gpn/dac53204",+    "parts": {+      "symbol": "dac63204rter.kicad_sym",+      "footprint": "dac63204rter.kicad_mod",+      "model_3d": "dac63204rter-hero.glb",+      "model_3d_plain": "dac63204rter.glb",+      "model_3d_step": "dac63204rter-etched.step",+      "model_3d_step_plain": "dac63204rter.step",+      "lbr": "dac63204rter.lbr"+    },+    "distributor_links": {+      "lcsc": 5215473,+      "digikey": "296-DAC63204RTERTR-ND",+      "mouser": "595-DAC63204RTER"+    },+    "distributor_check": {+      "checked_at": "2026-10-05T21:20:20Z",+      "source": "Component Ocean /api/assign-pns",+      "digikey": {+        "pn": "296-DAC63204RTERTR-ND",+        "status": "found"+      },+      "mouser": {+        "pn": "595-DAC63204RTER",+        "status": "found"+      }+    },+    "pins": [+      {+        "number": "1",+        "name": "FB3",+        "type": "input",+        "description": "Channel 3 voltage feedback input; connect to OUT3 in voltage mode, leave unconnected in current mode to minimize leakage current."+      },+      {+        "number": "2",+        "name": "OUT3",+        "type": "output",+        "description": "DAC channel 3 analog output voltage or current depending on programmed configuration."+      },+      {+        "number": "3",+        "name": "OUT2",+        "type": "output",+        "description": "DAC channel 2 analog output voltage or current depending on programmed configuration."+      },+      {+        "number": "4",+        "name": "FB2",+        "type": "input",+        "description": "Channel 2 voltage feedback input; connect to OUT2 in voltage mode, leave unconnected in current mode to minimize leakage current."+      },+      {+        "number": "5",+        "name": "GPIO/SDO",+        "type": "bidirectional",+        "description": "General purpose input/output configurable as LDAC, PD, PROTECT, RESET, SDO or STATUS; requires external pull-up resistor for output functions; requires pull to VDD or AGND when unused."+      },+      {+        "number": "6",+        "name": "SCL/SYNC",+        "type": "tri_state",+        "description": "I2C serial clock input (open-drain) or SPI chip select input; requires external pull-up resistor; can be pulled high before VDD rises."+      },+      {+        "number": "7",+        "name": "A0/SDI",+        "type": "input",+        "description": "I2C address configuration input or SPI serial data input; connect to VDD, AGND, SDA or SCL for I2C address selection; no pull-up/pull-down required for SPI."+      },+      {+        "number": "8",+        "name": "SDA/SCLK",+        "type": "bidirectional",+        "description": "I2C bidirectional serial data line (open-drain) or SPI serial clock input; requires external pull-up resistor for I2C mode; can be pulled high before VDD rises."+      },+      {+        "number": "9",+        "name": "FB1",+        "type": "input",+        "description": "Channel 1 voltage feedback input; connect to OUT1 in voltage mode, leave unconnected in current mode to minimize leakage current."+      },+      {+        "number": "10",+        "name": "OUT1",+        "type": "output",+        "description": "DAC channel 1 analog output voltage or current depending on programmed configuration."+      },+      {+        "number": "11",+        "name": "OUT0",+        "type": "output",+        "description": "DAC channel 0 analog output voltage or current depending on programmed configuration."+      },+      {+        "number": "12",+        "name": "FB0",+        "type": "input",+        "description": "Channel 0 voltage feedback input; connect to OUT0 in voltage mode, leave unconnected in current mode to minimize leakage current."+      },+      {+        "number": "13",+        "name": "CAP",+        "type": "power_in",+        "description": "External bypass capacitor connection for internal LDO; connect 1.5μF capacitor between this pin and AGND."+      },+      {+        "number": "14",+        "name": "AGND",+        "type": "power_in",+        "description": "Analog ground reference for all device circuits."+      },+      {+        "number": "15",+        "name": "VDD",+        "type": "power_in",+        "description": "Supply voltage input 1.7V to 5.5V range; requires 0.1μF decoupling capacitor to AGND."+      },+      {+        "number": "16",+        "name": "VREF",+        "type": "power_in",+        "description": "External reference voltage input or internal reference connection; connect 0.1μF capacitor to AGND; must not rise before VDD when external reference used."+      },+      {+        "number": "17",+        "name": "Thermal Pad",+        "type": "passive",+        "description": "Exposed pad (from the footprint; not named in the datasheet pin table)."+      }+    ],+    "provenance": {+      "extractor": "extract_pins 0.3",+      "factory_chain": {+        "factory": "2.0.0",+        "extractor": "extract_pins 0.3",+        "primary_model": "claude-haiku-4-5-20251001",+        "primary_mode": "text",+        "consensus_model": "claude-sonnet-5-5",+        "consensus": "agreed",+        "guards": "pin_guards 0.1: passed",+        "guard_notes": [+          "exposed pad 17 added from the footprint",+          "dropped thermal pad ['TP'] absent from footprint"+        ],+        "pages_sent": 59,+        "cost_usd": 0.4369,+        "at": "2026-10-05T21:20:07"+      },+      "datasheet": {+        "url": "https://www.ti.com/cn/lit/gpn/dac53204",+        "pages": 86,+        "sha256": "bafd26ceef14bae6",+        "source_tier": "lcsc"+      },+      "cad": "KiCad official (CC-BY-SA 4.0)",+      "pins": {+        "total": 17,+        "described": 17,+        "cites_pages": true,+        "refuses_to_fabricate": true+      }+    },+    "viewers": {+      "symbol": "viewers/symbol.html",+      "footprint": "viewers/footprint.html"+    }+  },+  "visibility": "public",+  "org": "adom",+  "author": {+    "name": "Ray",+    "email": "[email protected]"+  }+}\ No newline at end of file