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Contents

README

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DAC53202RTER

Texas Instruments · Digital To Analog Converters (DAC) · WQFN-16(3x3)

DAC53202RTER from Texas Instruments, in a WQFN-16(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 FB0 input Voltage feedback pin for channel 0; in voltage-output mode connect to OUT0 for closed-loop amplifier output, and in current-output mode leave unconnected to minimize leakage current.
2 OUT0 output Analog output voltage from DAC channel 0.
3 NC unconnected No connection; leave the pin unconnected.
4 NC unconnected No connection; leave the pin unconnected.
5 GPIO/SDO bidirectional General-purpose input/output configurable as LDAC, PD, PROTECT, RESET, SDO, or STATUS; for STATUS and SDO connect to IO voltage with an external pullup, if unused connect to VDD or AGND through an external resistor, and the pin can ramp up before VDD.
6 SCL/SYNC output I2C serial interface clock or SPI chip select input; must be connected to the IO voltage through an external pullup resistor and can ramp up before VDD.
7 A0/SDI input Address configuration pin for I2C (connect to VDD, AGND, SDA, or SCL) or serial data input for SPI; SDI needs no pullup or pulldown and the pin can ramp up before VDD.
8 SDA/SCLK bidirectional Bidirectional I2C serial data bus or SPI clock input; must be connected to the IO voltage through an external pullup resistor in I2C mode and can ramp up before VDD.
9 NC unconnected No connection; leave the pin unconnected.
10 NC unconnected No connection; leave the pin unconnected.
11 OUT1 output Analog output voltage from DAC channel 1.
12 FB1 input Voltage feedback pin for channel 1; in voltage-output mode connect to OUT1 for closed-loop amplifier output, and in current-output mode leave unconnected to minimize leakage current.
13 CAP power_out External bypass capacitor for the internal LDO; connect approximately 1.5 µF between CAP and AGND (CCAP range 0.5 µF to 15 µF per recommended operating conditions).
14 AGND power_in Ground reference point for all circuitry on the device.
15 VDD power_in Supply voltage (1.7 V to 5.5 V recommended, referenced to AGND).
16 VREF power_in External reference input; connect approximately 0.1 µF between VREF and AGND, use a pullup to VDD when the external reference is not used, and the pin must not ramp up before VDD.
17 Thermal Pad passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package WQFN-16(3x3)
Category Data Acquisition
Pins 17

CAD (KiCad official)

  • Symbol: DAC53202RTER
  • Footprint: Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm
  • 3D model: WQFN-16(3x3) (KiCad packages3D, STEP)
  • 3D model files: dac53202rter-etched.step / dac53202rter-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); dac53202rter.step / dac53202rter.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (83 pp, sha256 c5474701e67fa840, retrieved 2026-10-08, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF