component
CYTLP2362
Public Made by Adomby adom
OCIC Optocouplers - Phototransistor Output, SOP-5. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
CYTLP2362
OCIC · Optocouplers - Phototransistor Output · SOP-5
CYTLP2362 from OCIC, in a SOP-5. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Anode | passive | LED anode; recommended forward on-current IF(ON) is 7.5 to 14 mA, absolute maximum forward current 25 mA. |
| 3 | Cathode | passive | LED cathode; pins 1 and 3 are shorted together for isolation testing, reverse voltage max 5 V. |
| 4 | GND | power_in | Ground of the photo IC output side; a 0.1 µF ceramic bypass capacitor must be connected between pins 6 and 4. |
| 5 | VO | output | Open-collector inverting output (low when LED on), max output voltage 7 V and output current 50 mA. |
| 6 | VCC | power_in | Supply voltage pin, recommended 4.5 to 5.5 V, absolute maximum 7 V, with 0.1 µF bypass capacitor to GND within 1 cm. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | OCIC |
| Package | SOP-5 |
| Category | Optocoupler/LED/Digital Tube/Photoelectric Device |
| Pins | 5 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Forward current | IF | 25 | mA | 2 | |||
| Forward current derating | ΔIF/ΔTa | -0.67 | mA/°C | Ta ≥110°C | 2 | ||
| Pulsed forward current | IFP | 40 | mA | PW ≤ 1 ms, duty = 50% (Note 1) | 2 | ||
| Pulsed forward current derating | ΔIFP/ΔTa | -1 | mA/°C | Ta ≥110°C | 2 | ||
| Transient peak forward current | IFPT | 1 | A | PW ≤ 1 µs, 300 pps (Note 2) | 2 | ||
| Transient peak forward current derating | ΔIFPT/ΔTa | -25 | mA/°C | Ta ≥110°C | 2 | ||
| Input power dissipation | PD | 40 | mW | 2 | |||
| Input power dissipation derating | ΔPD/ΔTa | -1 | mW/°C | Ta ≥110°C | 2 | ||
| Reverse voltage | VR | 5 | V | 2 | |||
| Output current | IO | 50 | mA | 2 | |||
| Output voltage | VO | 7 | V | 2 | |||
| Supply voltage | VCC | 7 | V | 2 | |||
| Output power dissipation | PO | 85 | mW | 2 | |||
| Output power dissipation derating | ΔPO/ΔTa | -1.5 | mW/°C | Ta ≥110°C | 2 | ||
| Isolation voltage | BViso | 3750 | Vrms | AC, 1 min., R.H.≤ 60% (Note 3) | 2 | ||
| Operating temperature | Topr | -40 | 85 | °C | 2 | ||
| Storage temperature | Tstg | -55 | 125 | °C | 2 | ||
| Soldering temperature (reflow) | Tsol | 260 | °C | Reflow, 10 s | 2 | ||
| Input on-state current | IF(ON) | 7.5 | 14 | mA | Note 1: input current rise and fall times < 0.5 µs | 3 | |
| Off-state input voltage | VF(OFF) | 0 | 0.8 | V | 3 | ||
| Supply voltage | VCC | 4.5 | 5.5 | V | Note 2 (operating range, not a recommended condition) | 3 | |
| Operating temperature | TOPR | -40 | 85 | °C | Note 2 (operating range, not a recommended condition) | 3 | |
| Forward voltage | VF | 1.35 | 1.8 | V | IF=10mA, Ta=25°C | 3 | |
| Reverse current | IR | 10 | µA | VR=5V, Ta=25°C | 3 | ||
| High-level output current | IOH | 100 | µA | VF=0.8V, VO=5.5V, VCC=5.5V | 3 | ||
| Low-level output voltage | VOL | 0.35 | 0.6 | V | IF=10mA, IO=13mA (Sinking) | 3 | |
| High-level supply current | ICCH | 6 | 10 | mA | IF=0mA | 3 | |
| Low-level supply current | ICCL | 8 | 13 | mA | IF=0mA | 3 | |
| Threshold input current (H/L) | IFHL | 2.5 | 5 | IO=13mA (Sinking), VO<0.6V | 3 | ||
| Total capacitance is in isolation table; isolation voltage (AC, 60 s) | BVS | 3750 | Vrms | AC, 60 s (Note 1) | 3 | ||
| High-to-low propagation delay time | tpHL | 100 | ns | IF=0→7.5 mA, RL=350 Ω, CL=15 pF | 4 | ||
| Low-to-high propagation delay time | tpLH | 100 | ns | IF=7.5→0 mA, RL=350 Ω, CL=15 pF | 4 | ||
| Pulse width distortion | /tpHL−tpLH/ | 35 | ns | IF=7.5 mA, RL=350 Ω, CL=15 pF | 4 | ||
| Propagation delay skew (device to device) | tpsk | -40 | 40 | ns | IF=7.5 mA, RL=350 Ω, CL=15 pF | 4 | |
| High-level common-mode transient immunity | CMH | -10 | 15 | kV/µs | VCM=1000Vp-p, IF=0 mA, VCC=3.3V/5V, Ta=25°C | 4 | |
| Low-level common-mode transient immunity | CML | -10 | 15 | kV/µs | VCM=1000Vp-p, IF=10mA, VCC=3.3V/5V, Ta=25°C | 4 |
CAD (KiCad official)
- Symbol:
CYTLP2362 - Footprint:
Package_SO:SOIC-5-6_4.4x3.6mm_P1.27mm - 3D model: SOP-5 (KiCad packages3D, STEP)
- 3D model files:
cytlp2362-etched.step/cytlp2362-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);cytlp2362.step/cytlp2362.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: OCIC datasheet (9 pp, sha256
4332bb34ea9f6139, retrieved 2026-11-05, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).