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CY95F636KPMC-G-UNE2

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Cypress Semicon CYPRESS, LQFP-32(7x7). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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CY95F636KPMC-G-UNE2

Cypress Semicon · CYPRESS · LQFP-32(7x7)

CY95F636KPMC-G-UNE2 from Cypress Semicon, in a LQFP-32(7x7). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 PG2/X1A/SNI2 bidirectional General-purpose I/O port that doubles as the subclock I/O oscillation pin (X1A) and the MPG waveform sequencer position-detection trigger input (SNI2), with hysteresis CMOS input.
2 PG1/X0A/SNI1 bidirectional General-purpose I/O port that doubles as the subclock input oscillation pin (X0A) and the MPG waveform sequencer position-detection trigger input (SNI1), with hysteresis CMOS input.
3 VCC power_in Power supply pin; the datasheet requires a minimum of 2.4 V in normal operation and a maximum of 5.5 V.
4 C passive Decoupling capacitor connection pin, which requires a ceramic capacitor of 0.022 µF to 1 µF (CS) connected to VSS.
5 P67/PPG21/TRG1/OPT5 bidirectional High-current general-purpose I/O port that also serves as 8/16-bit PPG ch.2 output, 16-bit PPG timer ch.1 trigger input and MPG waveform sequencer output, with hysteresis CMOS input.
6 P66/PPG20/PPG1/OPT4 bidirectional High-current general-purpose I/O port that also serves as 8/16-bit PPG ch.2 output, 16-bit PPG timer ch.1 output and MPG waveform sequencer output, with hysteresis CMOS input.
7 P65/PPG11/OPT3 bidirectional High-current general-purpose I/O port that also serves as 8/16-bit PPG ch.1 output and MPG waveform sequencer output, with hysteresis CMOS input.
8 P64/EC1/PPG10/OPT2 bidirectional High-current general-purpose I/O port that also serves as 8/16-bit composite timer ch.1 clock input (EC1), 8/16-bit PPG ch.1 output and MPG waveform sequencer output, with hysteresis CMOS input.
9 P63/TO11/PPG01/OPT1 bidirectional High-current general-purpose I/O port that also serves as 8/16-bit composite timer ch.1 output (TO11), 8/16-bit PPG ch.0 output and MPG waveform sequencer output, with hysteresis CMOS input.
10 P62/TO10/PPG00/OPT0 bidirectional High-current general-purpose I/O port that also serves as 8/16-bit composite timer ch.1 output (TO10), 8/16-bit PPG ch.0 output and MPG waveform sequencer output, with hysteresis CMOS input.
11 P61/INT09/SCL/TI1 bidirectional General-purpose I/O port that also serves as external interrupt input INT09, I2C bus interface ch.0 clock I/O (SCL) and 16-bit reload timer ch.1 input (TI1), with CMOS input level.
12 P60/INT08/SDA/DTTI bidirectional General-purpose I/O port that also serves as external interrupt input INT08, I2C bus interface ch.0 data I/O (SDA) and MPG waveform sequencer input (DTTI), with CMOS input level.
13 P00/INT00/AN00/CMP0_P bidirectional General-purpose I/O port that also serves as external interrupt input INT00, 8/10-bit A/D converter analog input AN00 and comparator non-inverting input CMP0_P, with hysteresis/analog input.
14 P01/INT01/AN01/CMP0_N bidirectional General-purpose I/O port that also serves as external interrupt input INT01, 8/10-bit A/D converter analog input AN01 and comparator inverting input CMP0_N, with hysteresis/analog input.
15 P02/INT02/AN02/SCK bidirectional General-purpose I/O port that also serves as external interrupt input INT02, 8/10-bit A/D converter analog input AN02 and LIN-UART clock I/O (SCK), with hysteresis/analog input.
16 P03/INT03/AN03/SOT bidirectional General-purpose I/O port that also serves as external interrupt input INT03, 8/10-bit A/D converter analog input AN03 and LIN-UART data output (SOT), with hysteresis/analog input.
17 P04/INT04/AN04/SIN/EC0 bidirectional General-purpose I/O port that also serves as external interrupt input INT04, 8/10-bit A/D converter analog input AN04, LIN-UART data input (SIN) and 8/16-bit composite timer ch.0 clock input (EC0), with CMOS/analog input.
18 P05/INT05/AN05/TO00 bidirectional General-purpose I/O port that also serves as external interrupt input INT05, 8/10-bit A/D converter analog input AN05 and 8/16-bit composite timer ch.0 output (TO00), with hysteresis/analog input.
19 P06/INT06/AN06/TO01 bidirectional General-purpose I/O port that also serves as external interrupt input INT06, 8/10-bit A/D converter analog input AN06 and 8/16-bit composite timer ch.0 output (TO01), with hysteresis/analog input.
20 P07/INT07/AN07 bidirectional General-purpose I/O port that also serves as external interrupt input INT07 and 8/10-bit A/D converter analog input AN07, with hysteresis/analog input.
21 P10/PPG10/CMP0_O bidirectional General-purpose I/O port that also serves as 8/16-bit PPG ch.1 output (PPG10) and comparator digital output (CMP0_O), with hysteresis CMOS input.
22 P11/PPG11 bidirectional General-purpose I/O port that also serves as 8/16-bit PPG ch.1 output (PPG11), with hysteresis CMOS input.
23 P12/DBG/EC0 bidirectional N-ch open-drain general-purpose I/O port that also serves as the DBG debug input pin and 8/16-bit composite timer ch.0 clock input (EC0), and requires an external pull-up of 2 kΩ or above.
24 P13/PPG00 bidirectional General-purpose I/O port that also serves as 8/16-bit PPG ch.0 output (PPG00), with hysteresis CMOS input.
25 P14/UCK0/PPG01 bidirectional General-purpose I/O port that also serves as UART/SIO ch.0 clock I/O (UCK0) and 8/16-bit PPG ch.0 output (PPG01), with hysteresis CMOS input.
26 P15/UO0/PPG20 bidirectional General-purpose I/O port that also serves as UART/SIO ch.0 data output (UO0) and 8/16-bit PPG ch.2 output (PPG20), with hysteresis CMOS input.
27 P16/UI0/PPG21 bidirectional General-purpose I/O port that also serves as UART/SIO ch.0 data input (UI0) and 8/16-bit PPG ch.2 output (PPG21), with CMOS input level.
28 P17/TO1/SNI0 bidirectional General-purpose I/O port that also serves as 16-bit reload timer ch.1 output (TO1) and MPG waveform sequencer position-detection trigger input (SNI0), with hysteresis CMOS input.
29 PF2/RST bidirectional N-ch open-drain pin that functions as the reset input/output after power-on, with reset output enabled by the RSTOE bit and reset input or general-purpose I/O selected by the RSTEN bit in the SYSC register, and requires an external pull-up of 2 kΩ or above.
30 PF0/X0 input General-purpose I/O port that serves as the main clock input oscillation pin (X0), with hysteresis CMOS input.
31 PF1/X1 bidirectional General-purpose I/O port that serves as the main clock I/O oscillation pin (X1), with hysteresis CMOS input.
32 VSS power_in Ground pin (GND) that must be connected to the power supply ground with low impedance.

Key specifications

Parameter Value
Manufacturer Cypress Semicon
Package LQFP-32(7x7)
Category Embedded Processors & Controllers
Pins 32

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Operating temperature TA -40 85 C Other than on-chip debug mode 63
Operating temperature (on-chip debug) TA 5 35 C On-chip debug mode 63
Power supply voltage VCC 2.4 5.5 V In normal operation 63
Power supply voltage (hold in stop mode) VCC 2.3 5.5 V Hold condition in stop mode 63
Decoupling capacitor CS 0.022 1 µF 63
Power supply voltage VCC 6 V VSS-0.3 V to VSS+6 V; VSS = 0.0 V 61
Input voltage VI 6 V VSS-0.3 V to VSS+6 V 61
Output voltage VO 6 V VSS-0.3 V to VSS+6 V 61
Maximum clamp current ICLAMP 2 mA Applicable to specific pins 61
Total maximum clamp current /ICLAMP/ 20 mA Applicable to specific pins 61
L level maximum output current IOL 15 mA 61
L level average current (other than P62 to P67) IOLAV1 4 mA Other than P62 to P67; average output current = operating current x operating ratio (1 pin) 61
L level average output current (P62 to P67) IOLAV2 12 mA P62 to P67; average output current = operating current x operating ratio (1 pin) 61
L level total maximum output current IOL 100 mA 61
L level total average output current IOLAV 37 mA Total average output current = operating current x operating ratio (total number of pins) 61
H level maximum output current IOH 15 mA 61
H level average current (other than P62 to P67) IOHAV1 4 mA Other than P62 to P67; average output current = operating current x operating ratio (1 pin) 61
H level average output current (P62 to P67) IOHAV2 8 mA P62 to P67; average output current = operating current x operating ratio (1 pin) 61
H level total maximum output current IOH 100 mA 61
H level total average output current IOHAV 47 mA Total average output current = operating current x operating ratio (total number of pins) 61
Power consumption Pd 320 mW 61
Operating temperature TA -40 85 C 61
Storage temperature Tstg -55 150 C 61
Input leak current ILI -5 5 µA 0.0 V < VI < VCC; when the internal pull-up resistor is disabled 64
Open-drain output application voltage VD 5.5 V P12, P60, P61, PF2; VCC = 5.0 V ±10% 64
Internal pull-up resistor RPULL 25 50 100 kΩ VI = 0 V; when the internal pull-up resistor is enabled 64
Input capacitance CIN 5 15 pF Other than VCC and VSS; f = 1 MHz 64
Power supply current (external clock, main clock mode) ICC 3.6 5.8 mA FCH = 32 MHz, FMP = 16 MHz, divided by 2; except during Flash programming and erasing 65
Power supply current (during Flash programming/erasing) ICC 7.5 13.8 mA FCH = 32 MHz, FMP = 16 MHz; during Flash memory programming and erasing 65
Power supply current (at A/D conversion) ICC 4.1 9.1 mA At A/D conversion 65
Power supply current (main sleep mode) ICCS 1.3 3 mA FCH = 32 MHz, FMP = 16 MHz; main sleep mode (divided by 2) 65
Power supply current (subclock mode) ICCL 49 145 µA FCL = 32 kHz, FMPL = 16 kHz; TA = 25°C 65
Power supply current (subsleep mode, deep standby) ICCLS 10 15 µA FCL = 32 kHz, FMPL = 16 kHz; TA = 25°C; in deep standby mode 65
Power supply current (watch mode, deep standby) ICCT 7 13 µA FCL = 32 kHz; TA = 25°C; in deep standby mode 65
Power supply current (main CR PLL clock mode) ICCMPLL 4.7 6.8 mA FMCRPLL = 16 MHz, FMP = 16 MHz; multiplied by 4; TA = 25°C 65
Power supply current (main CR clock mode) ICCMCR 1.1 4.6 mA FCRH = 4 MHz, FMP = 4 MHz 65
Power supply current (sub-CR clock mode) ICCSCR 58.1 230 µA Sub-CR clock mode (divided by 2); TA = 25°C 65
Power supply current (time-base timer mode, deep standby) ICCTS 345 395 µA FCH = 32 MHz; time-base timer mode; TA = 25°C; in deep standby mode 65
Current consumption of the comparator IV 60 160 µA 66
Current consumption of the low-voltage detection circuit ILVD 4 7 µA 66
Current consumption of the main CR oscillator ICRH 240 320 µA 66
Current consumption of the sub-CR oscillator ICRL 7 20 µA Oscillating at 100 kHz 66
Current consumption difference between normal standby and deep standby INSTBY 20 30 µA TA = 25°C 66
Clock frequency (main oscillation, crystal/resonator) FCH 1 16.25 MHz When the main oscillation circuit is used 67
Clock frequency (main external clock) FCH 1 32.5 MHz When the main external clock is used 67
Clock frequency (main CR clock, 0°C to 70°C) FCRH 3.92 4 4.08 MHz Main CR clock used; 0°C ≤ TA ≤ 70°C 67
Clock frequency (main CR clock, -40°C to 85°C) FCRH 3.8 4 4.2 MHz Main CR clock used; -40°C ≤ TA ≤ 0°C, 70°C ≤ TA ≤ 85°C 67
Clock frequency (sub-CR clock) FCRL 50 100 150 kHz When the sub-CR clock is used 67
Clock cycle time (main oscillation circuit) tHCYL 61.5 1000 ns When the main oscillation circuit is used 68
Clock cycle time (external clock) tHCYL 30.8 1000 ns When an external clock is used 68
Source clock frequency (main oscillation clock) FSP 0.5 16.25 MHz When the main oscillation clock is used 70
Resolution 10 bit A/D converter 85
Total error -3 3 LSB A/D converter 85
Linearity error -2.5 2.5 LSB A/D converter 85
Differential linearity error -1.9 1.9 LSB A/D converter 85
Flash sector erase time (2 Kbyte sector) 0.3 1.6 s Time of writing 0x00 prior to erasure excluded; max at VCC = 2.4 V, TA = 85°C, 100000 cycles 89
Flash sector erase time (32 Kbyte sector) 0.6 3.1 s Time of writing 0x00 prior to erasure excluded; max at VCC = 2.4 V, TA = 85°C, 100000 cycles 89
Byte writing time 17 272 µs System-level overhead excluded 89
Program/erase cycle 100000 cycle 89
Power supply voltage at program/erase VCC 2.4 5.5 V 89
Flash memory data retention time 20 year Average TA = 85°C; number of program/erase cycles 1000 or below 89

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin  Lead-Free Packaging CAUTION: When ball grid array (BGA) packages with Sn-Ag-Cu balls are mounted using Sn-Pb eutectic soldering, 16

CAD (KiCad official)

  • Symbol: CY95F636KPMC-G-UNE2
  • Footprint: Package_QFP:LQFP-32_7x7mm_P0.8mm
  • 3D model: LQFP-32(7x7) (KiCad packages3D, STEP)
  • 3D model files: cy95f636kpmc-g-une2-etched.step / cy95f636kpmc-g-une2-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); cy95f636kpmc-g-une2.step / cy95f636kpmc-g-une2.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Cypress Semicon datasheet (102 pp, sha256 4e2eab7c3ba8c56e, retrieved 2026-10-27, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF