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Contents

README

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CY8CMBR3108-LQXIT

Infineon Cypress Semicon · Touch Sensors · QFN-16-EP(3x3)

CY8CMBR3108-LQXIT from Infineon Cypress Semicon, in a QFN-16-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CS0/PS0 input CapSense button or proximity sensor input; controls GPO0.
2 CS1/PS1 input CapSense button or proximity sensor input; controls GPO1.
3 CMOD passive External modulating capacitor (connect 2.2 nF, 5 V, X7R or NPO type).
4 VCC power_in Internal regulator output; connect 0.1-µF decoupling capacitor if VDD > 1.8 V, short to VDD if 1.71 V ≤ VDD ≤ 1.89 V.
5 VDDIO power_in Power supply for I2C and HI lines (1.71 V to VDD).
6 VDD power_in Primary power supply (1.8 V to 5.5 V).
7 VSS power_in Ground.
8 CS4/GPO0 bidirectional CapSense button input or General Purpose Output; configurable via I2C.
9 CS5/GPO1 bidirectional CapSense button input or General Purpose Output; configurable via I2C.
10 CS6/GPO2 bidirectional CapSense button input or General Purpose Output; configurable via I2C.
11 CS7/GPO3/SH bidirectional CapSense button, General Purpose Output, or shield electrode (SPO1); configurable via I2C.
12 CS2/GUARD input CapSense button or guard sensor; functions as AXRES during boot-up.
13 CS3 input CapSense button input; controls GPO3.
14 I2C SDA bidirectional I2C serial data line (open-drain); pull-up resistor required.
15 I2C SCL bidirectional I2C serial clock line (open-drain); pull-up resistor required.
16 HI/BUZ output Host interrupt output or buzzer output (SPO0); supply voltage should equal VDDIO.
17 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer Infineon Cypress Semicon
Package QFN-16-EP(3x3)
Category Sensors
Pins 17

CAD (KiCad official)

  • Symbol: CY8CMBR3108-LQXIT
  • Footprint: Package_DFN_QFN:QFN-16-1EP_3x3mm_P0.5mm_EP1.7x1.7mm
  • 3D model: QFN-16-EP(3x3) (KiCad packages3D, STEP)
  • 3D model files: cy8cmbr3108-lqxit-etched.step / cy8cmbr3108-lqxit-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); cy8cmbr3108-lqxit.step / cy8cmbr3108-lqxit.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Infineon Cypress Semicon datasheet (42 pp, sha256 c922377abc0466b1, retrieved 2026-09-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-4-6 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF