component
CY8C4125LQS-S433
Public Made by Adomby adom
Infineon/Cypress Semicon Microcontrollers (MCU/MPU/SOC), QFN-40(6x6). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownCY8C4125LQS-S433
Infineon/Cypress Semicon · Microcontrollers (MCU/MPU/SOC) · QFN-40(6x6)
CY8C4125LQS-S433 from Infineon/Cypress Semicon, in a QFN-40(6x6). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | P2.0 | bidirectional | GPIO port 2 bit 0 with SAR mux pad 0, smart I/O prgio[0].io[0], TCPWM line[4], csd.comp, LCD com[16]/seg[16] and SCB1 I2C SCL/SPI MOSI options. |
| 2 | P2.1 | bidirectional | GPIO port 2 bit 1 with SAR mux pad 1, smart I/O prgio[0].io[1], TCPWM line_compl[4], LCD com[17]/seg[17] and SCB1 I2C SDA/SPI MISO options. |
| 3 | P2.2 | bidirectional | GPIO port 2 bit 2 with SAR mux pad 2, smart I/O prgio[0].io[2], LCD com[18]/seg[18] and SCB1 SPI clock option. |
| 4 | P2.3 | bidirectional | GPIO port 2 bit 3 with SAR mux pad 3, smart I/O prgio[0].io[3], LCD com[19]/seg[19] and SCB1 SPI select0 option. |
| 5 | P2.4 | bidirectional | GPIO port 2 bit 4 with SAR mux pad 4, smart I/O prgio[0].io[4], TCPWM line[0], LCD com[20]/seg[20] and SCB1 SPI select1 option. |
| 6 | P2.5 | bidirectional | GPIO port 2 bit 5 with SAR mux pad 5, smart I/O prgio[0].io[5], TCPWM line_compl[0], LCD com[21]/seg[21] and SCB1 SPI select2 option. |
| 7 | P2.6 | bidirectional | GPIO port 2 bit 6 with SAR mux pad 6, smart I/O prgio[0].io[6], TCPWM line[1], LCD com[22]/seg[22] and SCB1 SPI select3 option. |
| 8 | P2.7 | bidirectional | GPIO port 2 bit 7 with SAR mux pad 7, smart I/O prgio[0].io[7], TCPWM line_compl[1], LCD com[23]/seg[23], lpcomp.comp[0] and SCB2 SPI MOSI options. |
| 9 | VSSD | power_in | Digital ground pin. |
| 10 | P3.0 | bidirectional | GPIO port 3 bit 0 with smart I/O prgio[1].io[0], TCPWM line[0], SCB1 UART RX, LCD com[24]/seg[24] and SCB1 I2C SCL/SPI MOSI options. |
| 11 | P3.1 | bidirectional | GPIO port 3 bit 1 with smart I/O prgio[1].io[1], TCPWM line_compl[0], SCB1 UART TX, LCD com[25]/seg[25] and SCB1 I2C SDA/SPI MISO options. |
| 12 | P3.2 | bidirectional | GPIO port 3 bit 2 with smart I/O prgio[1].io[2], TCPWM line[1], SCB1 UART CTS, LCD com[26]/seg[26], SWD data (cpuss.swd_data) and SCB1 SPI clock options. |
| 13 | P3.3 | bidirectional | GPIO port 3 bit 3 with smart I/O prgio[1].io[3], TCPWM line_compl[1], SCB1 UART RTS, LCD com[27]/seg[27], SWD clock (cpuss.swd_clk) and SCB1 SPI select0 options. |
| 14 | P3.4 | bidirectional | GPIO port 3 bit 4 with smart I/O prgio[1].io[4], TCPWM line[2], tcpwm.tr_in[6], LCD com[28]/seg[28] and SCB1 SPI select1 option. |
| 15 | P3.5 | bidirectional | GPIO port 3 bit 5 with smart I/O prgio[1].io[5], TCPWM line_compl[2], LCD com[29]/seg[29] and SCB1 SPI select2 option. |
| 16 | P3.6 | bidirectional | GPIO port 3 bit 6 with smart I/O prgio[1].io[6], TCPWM line[3], LCD com[30]/seg[30] and SCB1 SPI select3 option. |
| 17 | P3.7 | bidirectional | GPIO port 3 bit 7 with smart I/O prgio[1].io[7], TCPWM line_compl[3], LCD com[31]/seg[31], lpcomp.comp[1] and SCB2 SPI MISO options. |
| 18 | P4.0 | bidirectional | GPIO port 4 bit 0 with CAPSENSE external Vref (csd.vref_ext), SCB0 UART RX, LCD com[32]/seg[32] and SCB0 I2C SCL/SPI MOSI options. |
| 19 | P4.1 | bidirectional | GPIO port 4 bit 1 with CAPSENSE shield/Cmod (csd.cshield/csd.cmod), SCB0 UART TX, LCD com[33]/seg[33] and SCB0 I2C SDA/SPI MISO options. |
| 20 | P4.2 | bidirectional | GPIO port 4 bit 2 with CAPSENSE Cmod and CintA (csd.cmod/csd.CintA), SCB0 UART CTS, LCD com[34]/seg[34], lpcomp.comp[0] and SCB0 SPI clock options. |
| 21 | P4.3 | bidirectional | GPIO port 4 bit 3 with CAPSENSE shield tank and CintB (csd.csh_tank/csd.csh_CintB), SCB0 UART RTS, LCD com[35]/seg[35], lpcomp.comp[1] and SCB0 SPI select0 options. |
| 22 | P0.0 | bidirectional | GPIO port 0 bit 0 with low-power comparator input lpcomp.in_p[0], SCB2 UART CTS, tcpwm.tr_in[0], LCD com[0]/seg[0] and SCB2 I2C SCL/SCB0 SPI select1 options. |
| 23 | P0.1 | bidirectional | GPIO port 0 bit 1 with low-power comparator input lpcomp.in_n[0], SCB2 UART RTS, tcpwm.tr_in[1], LCD com[1]/seg[1] and SCB2 I2C SDA/SCB0 SPI select2 options. |
| 24 | P0.2 | bidirectional | GPIO port 0 bit 2 with low-power comparator input lpcomp.in_p[1], LCD com[2]/seg[2] and SCB0 SPI select3 option. |
| 25 | P0.3 | bidirectional | GPIO port 0 bit 3 with low-power comparator input lpcomp.in_n[1], LCD com[3]/seg[3] and SCB2 SPI select0 option. |
| 26 | P0.4 | bidirectional | GPIO port 0 bit 4 with watch crystal oscillator input (wco_in), SCB1/SCB2 UART RX, LCD com[4]/seg[4] and SCB1 I2C SCL/SPI MOSI options. |
| 27 | P0.5 | bidirectional | GPIO port 0 bit 5 with watch crystal oscillator output (wco_out), SCB1/SCB2 UART TX, LCD com[5]/seg[5] and SCB1 I2C SDA/SPI MISO options. |
| 28 | P0.6 | bidirectional | GPIO port 0 bit 6 with external clock input (srss.ext_clk), SCB1 UART CTS, SCB2 UART TX, LCD com[6]/seg[6] and SCB1 SPI clock options. |
| 29 | P0.7 | bidirectional | GPIO port 0 bit 7 with TCPWM line[0], SCB1 UART RTS, LCD com[7]/seg[7] and SCB1 SPI select0 options. |
| 30 | XRES | input | External reset input pin. |
| 31 | VCCD | power_out | Regulated digital supply (1.8 V ± 5%); bypass to ground with a 0.1 µF X5R ceramic capacitor and connect nothing else in the 1.8 V to 5.5 V supply mode. |
| 32 | VSSD | power_in | Digital ground pin. |
| 33 | VDD | power_in | Combined VDDA/VDDD supply, shorted internally; 1.8 V to 5.5 V with 0.1 µF and 1 µF decoupling (1.71 V to 1.89 V in externally regulated mode). |
| 34 | VSSA | power_in | Analog ground pin. |
| 35 | P1.0 | bidirectional | GPIO port 1 bit 0 with opamp pad pass.ctb0_pads[0], TCPWM line[2], SCB0 UART RX, LCD com[8]/seg[8] and SCB0 I2C SCL/SPI MOSI options. |
| 36 | P1.1 | bidirectional | GPIO port 1 bit 1 with opamp pad pass.ctb0_pads[1], TCPWM line_compl[2], SCB0 UART TX, LCD com[9]/seg[9] and SCB0 I2C SDA/SPI MISO options. |
| 37 | P1.2 | bidirectional | GPIO port 1 bit 2 with opamp pad pass.ctb0_pads[2], opamp0 10x output (ctb0_oa0_out_10x), TCPWM line[3], SCB0 UART CTS, LCD com[10]/seg[10] and SCB2 I2C SCL/SCB0 SPI clock options. |
| 38 | P1.3 | bidirectional | GPIO port 1 bit 3 with opamp pad pass.ctb0_pads[3], opamp1 10x output (ctb0_oa1_out_10x), TCPWM line_compl[3], SCB0 UART RTS, LCD com[11]/seg[11] and SCB2 I2C SDA/SCB0 SPI select0 options. |
| 39 | P1.4 | bidirectional | GPIO port 1 bit 4 with opamp pad pass.ctb0_pads[4], LCD com[12]/seg[12] and SCB0 SPI select1 option. |
| 40 | P1.7/VREF | bidirectional | GPIO port 1 bit 7 with opamp pad pass.ctb0_pads[7], SAR ADC external Vref (pass.sar_ext_vref0/1), LCD com[15]/seg[15] and SCB2 SPI clock option. |
| 41 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Infineon/Cypress Semicon |
| Package | QFN-40(6x6) |
| Category | Embedded Processors & Controllers |
| Pins | 41 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Digital supply relative to VSS | VDDD_ABS | -0.5 | 6 | V | 27 | ||
| Direct digital core voltage input relative to VSS | VCCD_ABS | -0.5 | 1.95 | V | 27 | ||
| Maximum current per GPIO | IGPIO_ABS | -25 | 25 | mA | 27 | ||
| GPIO injection current | IGPIO_injection | -0.5 | 0.5 | mA | Current injected per pin; Max for VIH > VDDD, Min for VIL < VSS | 27 | |
| ESD human body model | ESD_HBM | 2200 | V | 27 | |||
| ESD charged device model | ESD_CDM | 500 | V | 27 | |||
| Pin current for latch-up | LU | -140 | 140 | mA | 27 | ||
| Power supply input voltage (internally regulated) | VDD | 1.8 | 5.5 | V | Internally regulated supply | 27 | |
| Power supply input voltage (unregulated) | VDD | 1.71 | 1.89 | V | Internally unregulated supply, VCCD = VDDD = VDDA | 27 | |
| Output voltage for core logic | VCCD | 1.8 | V | 27 | |||
| External regulator voltage bypass | CEFC | 0.1 | µF | X5R ceramic or better | 28 | ||
| Power supply bypass capacitor | CEXC | 1 | µF | X5R ceramic or better | 28 | ||
| Active mode current, CPU at 6 MHz | IDD5 | 1.8 | 2.7 | mA | Execute from flash; CPU at 6 MHz; Max is at 125°C and 5.5 V | 28 | |
| Active mode current, CPU at 24 MHz | IDD8 | 3 | 4.75 | mA | Execute from flash; CPU at 24 MHz; Max is at 125°C and 5.5 V | 28 | |
| Active mode current, CPU at 48 MHz | IDD11 | 5.4 | 6.85 | mA | Execute from flash; CPU at 48 MHz; Max is at 125°C and 5.5 V | 28 | |
| Sleep current 6 MHz (regulator on) | IDD17 | 1.7 | 2.2 | mA | I2C wakeup, WDT, and Comparators on; 6 MHz; Max is at 125°C and 5.5 V | 28 | |
| Sleep current 12 MHz (regulator on) | IDD20 | 2.2 | 2.5 | mA | I2C wakeup, WDT, and Comparators on; 12 MHz; Max is at 125°C and 5.5 V | 28 | |
| Sleep current 6 MHz (regulator bypassed) | IDD23 | 0.7 | 0.9 | mA | I2C wakeup, WDT, and Comparators on; 6 MHz; Max is at 125°C and 5.5 V | 28 | |
| Sleep current 12 MHz (regulator bypassed) | IDD23A | 1 | 1.2 | mA | I2C wakeup, WDT, and Comparators on; 12 MHz; Max is at 125°C and 5.5 V | 28 | |
| Deep Sleep current, VDD 1.8 V to 3.6 V | IDD26 | 2.5 | 150 | µA | I2C wakeup and WDT on; Max is at 3.6 V and 125°C | 28 | |
| Deep Sleep current, VDD 3.6 V to 5.5 V | IDD29 | 2.5 | 150 | µA | I2C wakeup and WDT on; Max is at 5.5 V and 125°C | 28 | |
| Deep Sleep current, regulator bypassed | IDD32 | 2.5 | 160 | µA | I2C wakeup and WDT on; Max is at 1.89 V and 125°C | 28 | |
| Supply current while XRES asserted | IDD_XR | 2 | 5 | mA | 28 | ||
| CPU frequency | FCPU | 48 | MHz | 1.71 V ≤ VDD ≤ 5.5 V | 28 | ||
| BOD trip voltage in Active and Sleep modes | VFALLPPOR | 1.48 | 1.62 | V | 48 | ||
| BOD trip voltage in Deep Sleep mode | VFALLDPSLP | 1.11 | 1.5 | V | 48 | ||
| SWDCLK frequency | FSWDCLK1 | 14 | MHz | 3.3 V ≤ VDD ≤ 5.5 V; SWDCLK ≤ 1/3 CPU clock frequency | 48 | ||
| SWDCLK frequency | FSWDCLK2 | 7 | MHz | 1.71 V ≤ VDD ≤ 3.3 V; SWDCLK ≤ 1/3 CPU clock frequency | 48 | ||
| SWDI setup time | TSWDI_SETUP | 0.25 | ns | T = 1/fSWDCLK; min is 0.25 × T | 48 | ||
| SWDI hold time | TSWDI_HOLD | 0.25 | ns | T = 1/fSWDCLK; min is 0.25 × T | 48 | ||
| SWDO valid time | TSWDO_VALID | 0.5 | ns | T = 1/fSWDCLK; max is 0.5 × T | 48 | ||
| SWDO hold time | TSWDO_HOLD | 1 | ns | T = 1/fSWDCLK | 48 | ||
| IMO operating current at 48 MHz | IIMO1 | 250 | µA | 48 | |||
| IMO operating current at 24 MHz | IIMO2 | 180 | µA | 48 | |||
| IMO frequency variation at 24, 32, and 48 MHz (trimmed) | FIMOTOL1 | -2 | 2 | % | −40°C ≤ TA ≤ 125°C | 48 | |
| IMO frequency variation at 24, 32, and 48 MHz (trimmed) | FIMOTOL1 | -4 | 4 | % | 125°C ≤ TA ≤ 150°C | 48 | |
| IMO startup time | TSTARTIMO | 7 | µs | 48 | |||
| IMO RMS jitter at 24 MHz | TJITRMSIMO2 | 145 | ps | 48 | |||
| ILO operating current | IILO1 | 0.3 | 1.05 | µA | 49 | ||
| ILO startup time | TSTARTILO1 | 2 | ms | 49 | |||
| ILO duty cycle | TILODUTY | 40 | 50 | 60 | % | 49 | |
| ILO frequency range | FILOTRIM1 | 20 | 40 | 80 | kHz | 49 | |
| WCO crystal frequency | FWCO | 32.768 | kHz | 49 | |||
| WCO frequency tolerance | FTOL | 50 | 250 | ppm | With 20-ppm crystal | 49 | |
| WCO equivalent series resistance | ESR | 50 | kΩ | 49 | |||
| WCO drive level | PD | 1 | µW | 49 | |||
| WCO startup time | TSTART | 500 | ms | 49 | |||
| WCO crystal load capacitance | CL | 6 | 12.5 | pF | 49 | ||
| WCO crystal shunt capacitance | C0 | 1.35 | pF | 49 | |||
| WCO operating current (high power mode) | IWCO1 | 8 | µA | 49 | |||
| WCO operating current (low power mode) | IWCO2 | 1 | µA | 49 | |||
| External clock input frequency | ExtClkFreq | 0 | 48 | MHz | 49 | ||
| External clock duty cycle | ExtClkDuty | 45 | 55 | % | Measured at VDD/2 | 50 | |
| System clock source switching time | TCLKSWITCH | 3 | 4 | Periods | 50 | ||
| Max delay added by PRGIO in bypass mode | PRG_BYPASS | 1.6 | ns | 50 | |||
| Operating ambient temperature (S-grade) | TA | -40 | 25 | 105 | °C | For S-grade devices | 56 |
| Operating junction temperature (S-grade) | TJ | -40 | 120 | °C | For S-grade devices | 56 | |
| Package thermal resistance junction-to-ambient, 40-pin QFN | TJA | 25 | °C/W | 40-pin QFN | 56 | ||
| Package thermal resistance junction-to-case, 40-pin QFN | TJC | 3 | °C/W | 40-pin QFN | 56 |
CAD (KiCad official)
- Symbol:
CY8C4125LQS-S433 - Footprint:
Package_DFN_QFN:QFN-40-1EP_6x6mm_P0.5mm_EP4.6x4.6mm - 3D model: QFN-40(6x6) (KiCad packages3D, STEP)
- 3D model files:
cy8c4125lqs-s433-etched.step/cy8c4125lqs-s433-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);cy8c4125lqs-s433.step/cy8c4125lqs-s433.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Infineon/Cypress Semicon datasheet (68 pp, sha256
4c3cc0528eecb677, retrieved 2026-10-23, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).