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Contents

README

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CY8C21534-24PVXIT

Infineon Cypress Semicon · Microcontrollers (MCU/MPU/SOC) · SSOP-28-208mil

CY8C21534-24PVXIT from Infineon Cypress Semicon, in a SSOP-28-208mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 P0[7] bidirectional Analog column mux input; every port pin is capable of digital I/O and connection to the common analog bus.
2 P0[5] bidirectional Analog column mux input and column output; every port pin is capable of digital I/O and connection to the common analog bus.
3 P0[3] bidirectional Analog column mux input and column output, with integrating input; every port pin is capable of digital I/O and connection to the common analog bus.
4 P0[1] bidirectional Analog column mux input with integrating input; every port pin is capable of digital I/O and connection to the common analog bus.
5 P2[7] bidirectional General-purpose port pin with analog mux connection; every port pin is capable of digital I/O and connection to the common analog bus.
6 P2[5] bidirectional General-purpose port pin with analog mux connection; every port pin is capable of digital I/O and connection to the common analog bus.
7 P2[3] bidirectional Direct switched capacitor block input; every port pin is capable of digital I/O and connection to the common analog bus.
8 P2[1] bidirectional Direct switched capacitor block input; every port pin is capable of digital I/O and connection to the common analog bus.
9 VSS power_in Ground connection; all VSS pins should be brought out to one common GND plane.
10 P1[7] bidirectional I2C SCL function on a digital I/O pin that is also connected to the analog mux bus.
11 P1[5] bidirectional I2C SDA function on a digital I/O pin that is also connected to the analog mux bus.
12 P1[3] bidirectional General-purpose digital I/O pin that is also connected to the analog mux bus.
13 P1[1] bidirectional I2C SCL and ISSP-SCLK pin; ISSP pins are not High Z at POR per the PSoC Technical Reference Manual.
14 VSS power_in Ground connection; all VSS pins should be brought out to one common GND plane.
15 P1[0] bidirectional I2C SDA and ISSP-SDATA pin; ISSP pins are not High Z at POR per the PSoC Technical Reference Manual.
16 P1[2] bidirectional General-purpose digital I/O pin that is also connected to the analog mux bus.
17 P1[4] bidirectional Optional external clock input (EXTCLK) on a digital I/O pin that is also connected to the analog mux bus.
18 P1[6] bidirectional General-purpose digital I/O pin that is also connected to the analog mux bus.
19 XRES input Active high external reset with internal pull-down.
20 P2[0] bidirectional Direct switched capacitor block input; every port pin is capable of digital I/O and connection to the common analog bus.
21 P2[2] bidirectional Direct switched capacitor block input; every port pin is capable of digital I/O and connection to the common analog bus.
22 P2[4] bidirectional General-purpose port pin with analog mux connection; every port pin is capable of digital I/O and connection to the common analog bus.
23 P2[6] bidirectional General-purpose port pin with analog mux connection; every port pin is capable of digital I/O and connection to the common analog bus.
24 P0[0] bidirectional Analog column mux input; every port pin is capable of digital I/O and connection to the common analog bus.
25 P0[2] bidirectional Analog column mux input; every port pin is capable of digital I/O and connection to the common analog bus.
26 P0[4] bidirectional Analog column mux input; every port pin is capable of digital I/O and connection to the common analog bus.
27 P0[6] bidirectional Analog column mux input; every port pin is capable of digital I/O and connection to the common analog bus.
28 VDD power_in Supply voltage pin.

Key specifications

Parameter Value
Manufacturer Infineon Cypress Semicon
Package SSOP-28-208mil
Category Embedded Processors & Controllers
Pins 28

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Storage temperature TSTG -55 25 100 °C 20
Bake time tBAKETIME 72 Hours 20
Ambient temperature with power applied TA -40 85 °C 20
Supply voltage on VDD relative to VSS VDD -0.5 6 V 20
Maximum current into any port pin IMIO -25 50 mA 20
Electrostatic discharge voltage ESD 2000 V Human body model ESD. 20
Latch-up current LU 200 mA 20
Ambient temperature TA -40 85 °C 20
Junction temperature TJ -40 100 °C 20
Supply voltage VDD 2.4 5.25 V 21
Supply current, IMO = 24 MHz IDD 3 4 mA Conditions are VDD = 5.0 V, TA = 25 °C, CPU = 3 MHz, 48 MHz disabled. VC1 = 1.5 MHz, VC2 = 93.75 kHz, VC3 = 0.366 kHz 21
Supply current, IMO = 6 MHz using SLIMO mode IDD3 1.2 2 mA Conditions are VDD = 3.3 V, TA = 25 °C, CPU = 3 MHz, clock doubler disabled. VC1 = 375 kHz, VC2 = 23.4 kHz, VC3 = 0.091 kHz 21
Supply current, IMO = 6 MHz using SLIMO mode (2.7 V) IDD27 1.1 1.5 mA Conditions are VDD = 2.55 V, TA = 25 °C, CPU = 3 MHz, clock doubler disabled. VC1 = 375 kHz, VC2 = 23.4 kHz, VC3 = 0.091 kHz 21
Sleep (mode) current with POR, LVD, sleep timer, WDT, and internal slow oscillator active, mid temperature range ISB27 2.6 4 µA VDD = 2.55 V, 0 °C TA 40 °C 21
Sleep (mode) current with POR, LVD, Sleep Timer, WDT, and internal slow oscillator active ISB 2.8 5 µA VDD = 3.3 V, -40 °C TA 85 °C 21
Reference voltage (Bandgap) VREF 1.28 1.3 1.32 V Trimmed for appropriate VDD, VDD = 3.0 V to 5.25 V 21
Reference voltage (Bandgap), 2.4 V to 3.0 V VREF27 1.16 1.3 1.33 V Trimmed for appropriate VDD, VDD = 2.4 V to 3.0 V 21
Pull-up resistor (5 V and 3.3 V GPIO) RPU 4 5.6 8 k 22
Pull-down resistor (5 V and 3.3 V GPIO) RPD 4 5.6 8 k 22
Low output level (5 V and 3.3 V GPIO) VOL 0.75 V IOL = 25 mA, VDD = 4.75 to 5.25 V (8 total loads) 22
High level source current (5 V and 3.3 V GPIO) IOH 10 mA VOH = VDD, 1.0 V 22
Low level sink current (5 V and 3.3 V GPIO) IOL 25 mA VOL = 0.75 V 22
Input low level (5 V and 3.3 V GPIO) VIL 0.8 V VDD = 3.0 to 5.25 22
Input high level (5 V and 3.3 V GPIO) VIH 2.1 V VDD = 3.0 to 5.25 22
Capacitive load on pins as input (5 V and 3.3 V GPIO) CIN 3.5 10 pF Package and pin dependent, Temp = 25 °C 22
Capacitive load on pins as output (5 V and 3.3 V GPIO) COUT 3.5 10 pF Package and pin dependent, Temp = 25 °C 22
Pull-up resistor (2.7 V GPIO) RPU 4 5.6 8 k 22
Pull-down resistor (2.7 V GPIO) RPD 4 5.6 8 k 22
Low output level (2.7 V GPIO) VOL 0.75 V IOL = 10 mA, VDD = 2.4 to 3.0 V (90 mA maximum combined IOL budget) 22
High level source current (2.7 V GPIO) IOH 2.5 mA VOH = VDD, 0.4 V 22
Low level sink current (2.7 V GPIO) IOL 10 mA VOL = 0.75 V 22
Input low level (2.7 V GPIO) VIL 0.75 V VDD = 2.4 to 3.0 22
Input high level (2.7 V GPIO) VIH 2 V VDD = 2.4 to 3.0 22
Capacitive load on pins as input (2.7 V GPIO) CIN 3.5 10 pF Package and pin dependent, Temp = 25 °C 22
Capacitive load on pins as output (2.7 V GPIO) COUT 3.5 10 pF Package and pin dependent, Temp = 25 °C 22
IMO frequency for 24 MHz FIMO24 23.4 24 24.6 MHz Trimmed for 5 V or 3.3 V operation using factory trim values. SLIMO mode = 0 27
IMO frequency for 6 MHz (5 V and 3.3 V) FIMO6 5.52 6 6.48 MHz Trimmed for 5 V or 3.3 V operation using factory trim values. SLIMO mode = 1 27
CPU frequency (5 V nominal) FCPU1 0.091 24 24.6 MHz 27
CPU frequency (3.3 V nominal) FCPU2 0.091 12 12.3 MHz SLIMO mode = 0 27
Digital PSoC block frequency (5 V nominal) FBLK5 0 48 49.2 MHz 27
Digital PSoC block frequency (3.3 V nominal) FBLK33 0 24 24.6 MHz 27
ILO frequency F32K1 15 32 64 kHz 27
ILO untrimmed frequency F32K_U 5 100 kHz After a reset and before the M8C starts to run, the ILO is not trimmed 27
External reset pulse width tXRST 10 s 27
24 MHz duty cycle DC24M 40 50 60 % 27
ILO duty cycle (5 V and 3.3 V) DCILO 20 50 80 % 27
48 MHz output frequency Fout48M 46.8 48 49.2 MHz Trimmed. Using factory trim values 27
Maximum frequency of signal on row input or row output FMAX 12.3 MHz 27
Power supply slew rate SRPOWER_UP 250 V/ms VDD slew rate during power-up 27
Time from end of POR to CPU executing code tPOWERUP 16 100 ms Power-up from 0 V 27
Frequency with CPU clock divide by 1 (3.3 V) FOSCEXT 0.093 12.3 MHz 32
Frequency with CPU clock divide by 2 or greater (3.3 V) FOSCEXT 0.186 24.6 MHz 32
High period with CPU clock divide by 1 (3.3 V) 41.7 5300 ns 32
Low period with CPU clock divide by 1 (3.3 V) 41.7 ns 32
Power-up IMO to switch (3.3 V) 150 µs 32
IMO frequency for 12 MHz FIMO12 11.04 120 12.96 MHz Trimmed for 2.7 V operation using factory trim values. SLIMO mode = 1 28
CPU frequency (2.7 V nominal) FCPU1 0.093 3 3.15 MHz 28
Digital PSoC block frequency (2.7 V nominal) FBLK27 0 12 12.5 MHz 28
SCL clock frequency (Standard Mode, 2.7 V) FSCLI2C 0 100 kHz Standard Mode, 2.4 V to 3.0 V (Fast Mode not supported) 34
SCL clock frequency (Fast Mode, 3.0 V) FSCLI2C 0 400 kHz Fast Mode, VDD 3.0 V 33

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing PC The emulator consists of a base unit that connects to the PC 7

CAD (KiCad official)

  • Symbol: CY8C21534-24PVXIT
  • Footprint: Package_SO:SSOP-28_5.3x10.2mm_P0.65mm
  • 3D model: SSOP-28-208mil (KiCad packages3D, STEP)
  • 3D model files: cy8c21534-24pvxit-etched.step / cy8c21534-24pvxit-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); cy8c21534-24pvxit.step / cy8c21534-24pvxit.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Infineon Cypress Semicon datasheet (60 pp, sha256 7db3409733a84c2e, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF