component
CY62158EV30LL-45ZSXI
Public Made by Adomby adom
Cypress Semicon Pre-ordered Products, TSOP-44. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
CY62158EV30LL-45ZSXI
Cypress Semicon · Pre-ordered Products · TSOP-44
CY62158EV30LL-45ZSXI from Cypress Semicon, in a TSOP-44. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | A4 | input | Address input A4 selecting one of the 1024K word locations. |
| 2 | A3 | input | Address input A3 selecting one of the 1024K word locations. |
| 3 | A2 | input | Address input A2 selecting one of the 1024K word locations. |
| 4 | A1 | input | Address input A1 selecting one of the 1024K word locations. |
| 5 | A0 | input | Address input A0 selecting one of the 1024K word locations. |
| 6 | CE1 | input | Active-low chip enable 1; LOW with CE2 HIGH selects the device, HIGH deselects it and enters standby. |
| 7 | NC | unconnected | No connect; not connected on the die. |
| 8 | NC | unconnected | No connect; not connected on the die. |
| 9 | I/O0 | bidirectional | Data input/output bit 0, high impedance when deselected, outputs disabled or during a write. |
| 10 | I/O1 | bidirectional | Data input/output bit 1, high impedance when deselected, outputs disabled or during a write. |
| 11 | VCC | power_in | Power supply, 2.20 V to 3.60 V operating range. |
| 12 | VSS | power_in | Ground. |
| 13 | I/O2 | bidirectional | Data input/output bit 2, high impedance when deselected, outputs disabled or during a write. |
| 14 | I/O3 | bidirectional | Data input/output bit 3, high impedance when deselected, outputs disabled or during a write. |
| 15 | NC | unconnected | No connect; not connected on the die. |
| 16 | NC | unconnected | No connect; not connected on the die. |
| 17 | WE | input | Active-low write enable; LOW with CE1 LOW and CE2 HIGH writes I/O data to the addressed location. |
| 18 | A19 | input | Address input A19 selecting one of the 1024K word locations. |
| 19 | A18 | input | Address input A18 selecting one of the 1024K word locations. |
| 20 | A17 | input | Address input A17 selecting one of the 1024K word locations. |
| 21 | A16 | input | Address input A16 selecting one of the 1024K word locations. |
| 22 | A15 | input | Address input A15 selecting one of the 1024K word locations. |
| 23 | A14 | input | Address input A14 selecting one of the 1024K word locations. |
| 24 | A13 | input | Address input A13 selecting one of the 1024K word locations. |
| 25 | A12 | input | Address input A12 selecting one of the 1024K word locations. |
| 26 | A11 | input | Address input A11 selecting one of the 1024K word locations. |
| 27 | A10 | input | Address input A10 selecting one of the 1024K word locations. |
| 28 | A9 | input | Address input A9 selecting one of the 1024K word locations. |
| 29 | NC | unconnected | No connect; not connected on the die. |
| 30 | NC | unconnected | No connect; not connected on the die. |
| 31 | I/O4 | bidirectional | Data input/output bit 4, high impedance when deselected, outputs disabled or during a write. |
| 32 | I/O5 | bidirectional | Data input/output bit 5, high impedance when deselected, outputs disabled or during a write. |
| 33 | VCC | power_in | Power supply, 2.20 V to 3.60 V operating range. |
| 34 | VSS | power_in | Ground. |
| 35 | I/O6 | bidirectional | Data input/output bit 6, high impedance when deselected, outputs disabled or during a write. |
| 36 | I/O7 | bidirectional | Data input/output bit 7, high impedance when deselected, outputs disabled or during a write. |
| 37 | NC | unconnected | No connect; not connected on the die. |
| 38 | NC | unconnected | No connect; not connected on the die. |
| 39 | A8 | input | Address input A8 selecting one of the 1024K word locations. |
| 40 | CE2 | input | Active-high chip enable 2; HIGH with CE1 LOW selects the device, LOW deselects it and enters standby. |
| 41 | OE | input | Active-low output enable; LOW with the device selected and WE HIGH drives data onto the I/O pins, HIGH puts outputs in high impedance. |
| 42 | A7 | input | Address input A7 selecting one of the 1024K word locations. |
| 43 | A6 | input | Address input A6 selecting one of the 1024K word locations. |
| 44 | A5 | input | Address input A5 selecting one of the 1024K word locations. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Cypress Semicon |
| Package | TSOP-44 |
| Category | Electronic Tools/Instruments/Consumables |
| Pins | 44 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Output HIGH voltage | VOH | 2 | V | IOH = -0.1 mA | 5 | ||
| Output HIGH voltage | VOH | 2.4 | V | IOH = -1.0 mA, VCC > 2.70 V | 5 | ||
| Output LOW voltage | VOL | 0.4 | V | IOL = 0.1 mA | 5 | ||
| Input HIGH voltage | VIH | 1.8 | V | VCC = 2.2 V to 2.7 V (max VCC + 0.3 V) | 5 | ||
| Input HIGH voltage | VIH | 2.2 | V | VCC = 2.7 V to 3.6 V (max VCC + 0.3 V) | 5 | ||
| Input LOW voltage | VIL | -0.3 | 0.6 | V | VCC = 2.2 V to 2.7 V | 5 | |
| Input LOW voltage | VIL | -0.3 | 0.8 | V | VCC = 2.7 V to 3.6 V | 5 | |
| Input leakage current | IIX | -1 | 1 | µA | GND < VI < VCC | 5 | |
| Output leakage current | IOZ | -1 | 1 | µA | GND < VO < VCC, Output Disabled | 5 | |
| VCC operating supply current | ICC | 18 | 25 | mA | f = fmax = 1/tRC, VCC = VCCmax, IOUT = 0 mA, CMOS levels | 5 | |
| VCC operating supply current | ICC | 6 | 7 | mA | f = 1 MHz | 5 | |
| Automatic CE power down current, CMOS inputs | ISB1 | 2 | 8 | µA | CE1 > VCC, 0.2 V, CE2 < 0.2 V, VIN > VCC, 0.2 V, VIN < 0.2 V, f = fmax (Address and Data Only), f = 0 (OE and WE), VCC = 3.60 V | 5 | |
| VCC for data retention | VDR | 1.5 | V | 7 | |||
| Data retention current | ICCDR | 3.2 | 8 | µA | VCC = 1.5 V, CE1 > VCC, 0.2 V or CE2 < 0.2 V, VIN > VCC, 0.2 V or VIN < 0.2 V | 7 | |
| Chip deselect to data retention time | tCDR | 0 | ns | 7 | |||
| Operation recovery time | tR | 45 | ns | 7 | |||
| Read cycle time | tRC | 45 | ns | 8 | |||
| Address to data valid | tAA | 45 | ns | 8 | |||
| Data hold from address change | tOHA | 10 | ns | 8 | |||
| CE1 LOW and CE2 HIGH to data valid | tACE | 45 | ns | 8 | |||
| OE LOW to data valid | tDOE | 22 | ns | 8 | |||
| OE LOW to Low Z | tLZOE | 5 | ns | 8 | |||
| OE HIGH to High Z | tHZOE | 18 | ns | 8 | |||
| CE1 LOW and CE2 HIGH to Low Z | tLZCE | 10 | ns | 8 | |||
| CE1 HIGH or CE2 LOW to High Z | tHZCE | 18 | ns | 8 | |||
| CE1 LOW and CE2 HIGH to Power Up | tPU | 0 | ns | 8 | |||
| CE1 HIGH or CE2 LOW to Power Down | tPD | 45 | ns | 8 | |||
| Write cycle time | tWC | 45 | ns | 8 | |||
| CE1 LOW and CE2 HIGH to Write End | tSCE | 35 | ns | 8 | |||
| Address setup to Write End | tAW | 35 | ns | 8 | |||
| Address Hold from Write End | tHA | 0 | ns | 8 | |||
| Address setup to Write Start | tSA | 0 | ns | 8 | |||
| WE pulse width | tPWE | 35 | ns | 8 | |||
| Data setup to Write End | tSD | 25 | ns | 8 | |||
| Data Hold from Write End | tHD | 0 | ns | 8 | |||
| WE LOW to High Z | tHZWE | 18 | ns | 8 | |||
| WE HIGH to Low Z | tLZWE | 10 | ns | 8 | |||
| Storage Temperature | -65 | 150 | °C | 5 | |||
| Ambient Temperature with Power Applied | -55 | 125 | °C | 5 | |||
| Supply Voltage to Ground Potential | -0.3 | V | to VCC(max) + 0.3 V | 5 | |||
| DC Voltage Applied to Outputs in High Z State | -0.3 | V | to VCC(max) + 0.3 V | 5 | |||
| DC Input Voltage | -0.3 | V | to VCC(max) + 0.3 V | 5 | |||
| Output Current into Outputs (LOW) | 20 | mA | 5 | ||||
| Static Discharge Voltage | 2001 | V | MIL-STD-883, Method 3015, > 2001 V | 5 | |||
| Latch up Current | 200 | mA | > 200 mA | 5 | |||
| Operating ambient temperature (Industrial) | TA | -40 | 85 | °C | Industrial | 5 | |
| Supply voltage | VCC | 2.2 | 3.6 | V | 5 | ||
| Input capacitance | CIN | 10 | pF | TA = 25 °C, f = 1 MHz, VCC = VCC(typ) | 6 | ||
| Output capacitance | COUT | 10 | pF | TA = 25 °C, f = 1 MHz, VCC = VCC(typ) | 6 | ||
| Thermal resistance (junction to ambient), 44-pin TSOP II | ΘJA | 65.91 | °C/W | Still Air, soldered on a 3 × 4.5 inch, two-layer printed circuit board | 6 | ||
| Thermal resistance (junction to case), 44-pin TSOP II | ΘJC | 13.96 | °C/W | Still Air, soldered on a 3 × 4.5 inch, two-layer printed circuit board | 6 |
CAD (KiCad official)
- Symbol:
CY62158EV30LL-45ZSXI - Footprint:
Package_SO:TSOP-II-44_10.16x18.41mm_P0.8mm - 3D model: TSOP-44 (KiCad packages3D, STEP)
- 3D model files:
cy62158ev30ll-45zsxi-etched.step/cy62158ev30ll-45zsxi-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);cy62158ev30ll-45zsxi.step/cy62158ev30ll-45zsxi.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Cypress Semicon datasheet (20 pp, sha256
c41410c1365fd607, retrieved 2026-10-31, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).