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CY22393FXE
Public Made by Adomby adom
Cypress Semicon Pre-Ordered Products, TSSOP-16. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownCY22393FXE
Cypress Semicon · Pre-Ordered Products · TSSOP-16
CY22393FXE from Cypress Semicon, in a TSSOP-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CLKC | output | Configurable clock output C. |
| 2 | VDD | power_in | Power supply. |
| 3 | AGND | power_in | Analog ground. |
| 4 | XTALIN | input | Reference crystal input or external reference clock input; for driven clock inputs the on-die load capacitors can be bypassed to accept frequencies up to 166 MHz. |
| 5 | XTALOUT | passive | Reference crystal feedback; if the application uses a driven input, XTALOUT is to be left floating. |
| 6 | XBUF | output | Buffered reference clock output. |
| 7 | CLKD | output | Configurable clock output D. |
| 8 | CLKE | output | Configurable clock output E, which also carries the PLL1 output through a /2, /3, or /4 synchronous post-divider. |
| 9 | CLKB | output | Configurable clock output B. |
| 10 | CLKA | output | Configurable clock output A. |
| 11 | GND | power_in | Ground. |
| 12 | SDAT (S0) | bidirectional | Serial port data; the S0 value is latched during start-up and used as a frequency-select index. |
| 13 | SCLK (S1) | input | Serial port clock; the S1 value is latched during start-up and used as a frequency-select index. |
| 14 | AVDD | power_in | Analog power supply. |
| 15 | S2/SUSPEND | input | General-purpose input for frequency control (bit 2) that can optionally act as the Suspend mode control input. |
| 16 | SHUTDOWN/OE | input | Places outputs in tristate condition and shuts down the chip when LOW; optionally, it only places outputs in tristate and does not shut down the chip when LOW. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Cypress Semicon |
| Package | TSSOP-16 |
| Category | Electronic Tools/Instruments/Consumables |
| Pins | 16 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage | VDD/AVDD | 3.135 | 3.3 | 3.465 | V | 14 | |
| Automotive-E Grade operating temperature, ambient | TA | -40 | 125 | °C | Automotive-E Grade, ambient | 14 | |
| Maximum load capacitance | CLOAD_OUT | 15 | pF | 14 | |||
| External reference crystal frequency | fREF | 8 | 30 | MHz | External reference crystal | 14 | |
| External reference clock frequency, Automotive | fREF | 1 | 150 | MHz | External reference clock, Automotive | 14 | |
| Nominal crystal frequency | FNOM | 8 | 30 | MHz | Parallel resonance, fundamental mode | 14 | |
| Nominal load capacitance | CLNOM | 8 | 20 | pF | 14 | ||
| Equivalent series resistance (ESR) | R1 | 50 | Ω | Fundamental mode | 14 | ||
| Crystal drive level | DL | 0.5 | 2 | mW | No external series resistor assumed | 14 | |
| Supply voltage (absolute maximum) | -0.5 | 7 | V | 14 | |||
| DC input voltage | -0.5 | V | Upper limit printed as AVDD + 0.5 V | 14 | |||
| Storage temperature | -65 | 125 | °C | 14 | |||
| Junction temperature, Automotive-E Grade | TJ | 150 | °C | Automotive-E Grade | 14 | ||
| Package power dissipation, Automotive-E Grade | 217 | mW | Automotive-E Grade | 14 | |||
| Data retention | 2 | years | TJ = 150 °C; printed as > 2 years | 14 | |||
| Maximum programming cycles | 100 | 14 | |||||
| Static discharge voltage | 2000 | V | Per MIL-STD-883, Method 3015; printed as > 2000 V | 14 | |||
| Latch-up | -200 | 200 | mA | Per JEDEC 17; printed as > ±200 mA | 14 | ||
| Output high current | IOH | 12 | 24 | mA | VOH = VDD, 0.5 V, VDD = 3.3 V | 15 | |
| Output low current | IOL | 12 | 24 | mA | VOL = 0.5 V, VDD = 3.3 V | 15 | |
| High-level input voltage | VIH | 70 | % of AVDD | CMOS levels | 15 | ||
| Low-level input voltage | VIL | 30 | % of AVDD | CMOS levels | 15 | ||
| Input high current | IIH | 10 | µA | VIN = AVDD, 0.3 V | 15 | ||
| Input low current | IIL | 10 | µA | VIN = +0.3 V | 15 | ||
| Output leakage current | IOZ | 10 | µA | Three-state outputs (OE = Low) | 15 | ||
| Total power supply current in shutdown mode | IDDS | 5 | 20 | µA | Shutdown active | 15 | |
| Output frequency | 1/t1 | 166 | MHz | Clock output limit, CMOS, Automotive | 16 | ||
| Output duty cycle (Fout < 100 MHz, divider > 2) | t2 | 45 | 50 | 55 | % | Fout < 100 MHz, divider > 2, measured at VDD/2 | 16 |
| Output duty cycle (Fout > 100 MHz or divider = 1) | t2 | 40 | 50 | 60 | % | Fout > 100 MHz or divider = 1, measured at VDD/2 | 16 |
| Rising edge slew rate | t3 | 0.75 | 1.4 | V/ns | Output clock rise time, 20% to 80% of VDD | 16 | |
| Falling edge slew rate | t4 | 0.75 | 1.4 | V/ns | Output clock fall time, 20% to 80% of VDD | 16 | |
| Output three-state timing | t5 | 150 | 300 | ns | Time for output to enter or leave three-state mode after SHUTDOWN/OE switches | 16 | |
| Lock time | t7 | 1 | 3 | ms | PLL lock time from power-up | 16 | |
| Frequency of SCLK | fSCLK | 400 | kHz | 13 | |||
| Hold time START condition | tHD:STA | 0.6 | µs | 13 | |||
| Low period of the SCLK clock | tLOW | 1.3 | µs | 13 | |||
| High period of the SCLK clock | tHIGH | 0.6 | µs | 13 | |||
| Setup time for a repeated START condition | tSU:STA | 0.6 | µs | 13 | |||
| Data hold time | tHD:DAT | 100 | ns | 13 | |||
| Data setup time | tSU:DAT | 100 | ns | 13 | |||
| Rise time | tR | 300 | ns | 13 | |||
| Fall time | tF | 300 | ns | 13 | |||
| Setup time for STOP condition | tSU:STO | 0.6 | µs | 13 | |||
| Bus-free time between STOP and START conditions | tBUF | 1.3 | µs | 13 | |||
| Package thermal resistance, junction to ambient | JA | 115 | °C/W | Package JA as stated in Junction Temperature Limitations | 6 |
CAD (KiCad official)
- Symbol:
CY22393FXE - Footprint:
Package_SO:TSSOP-16_4.4x5mm_P0.65mm - 3D model: TSSOP-16 (KiCad packages3D, STEP)
- 3D model files:
cy22393fxe-etched.step/cy22393fxe-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);cy22393fxe.step/cy22393fxe.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Cypress Semicon datasheet (22 pp, sha256
829513a130aa9517, retrieved 2026-10-20, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).