# CW32L031F8P6

**CW** · Microcontroller Units (MCUs/MPUs/SOCs) · TSSOP-20

CW32L031F8P6 from CW, in a TSSOP-20. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Vcore | power_out | Core-logic supply node listed for the TSSOP20 package; the datasheet gives no voltage or current limit for this pin. |
| 2 | PF00 | bidirectional | TC-type I/O that also serves as the OSC_IN oscillator input; its high-level input threshold is 0.7×VDDIOx minimum. |
| 3 | PF01 | bidirectional | TC-type I/O that also serves as the OSC_OUT oscillator output, with LSE_OUT as an alternate function. |
| 4 | NRST | input | Chip reset input with internal pull-up of 7 to 9 kΩ; the minimum reset pulse width is 20 µs. |
| 5 | VDDA | power_in | Analog supply for the ADC, reset circuit and RC oscillators, rated 1.65 V to 5.5 V, and must be greater than or equal to VDD. |
| 6 | PA00 | bidirectional | TTa I/O with analog inputs ADC_IN0, VC1_CH0 and LVD_CH1. |
| 7 | PA01 | bidirectional | TTa I/O with analog inputs ADC_IN1 and VC1_CH1. |
| 8 | PA02 | bidirectional | TTa I/O with analog inputs ADC_IN2 and VC1_CH2. |
| 9 | PA03 | bidirectional | TTa I/O with analog inputs ADC_IN3 and VC1_CH3. |
| 10 | PA04 | bidirectional | TTa I/O with analog inputs ADC_IN4 and VC1_CH4. |
| 11 | PA05 | bidirectional | TTa I/O with analog inputs ADC_IN5, VC1_CH5 and VC2_CH0. |
| 12 | PA06 | bidirectional | TTa I/O with analog inputs ADC_IN6, VC1_CH6 and VC2_CH1. |
| 13 | PA07 | bidirectional | TTa I/O with analog inputs ADC_IN7, VC1_CH7 and VC2_CH2. |
| 14 | PB01 | bidirectional | TTa I/O with analog inputs ADC_IN9 and VC2_CH4. |
| 15 | VSS | power_in | Ground reference for the device (Ground). |
| 16 | VDD | power_in | I/O and internal regulator supply, rated 1.65 V to 5.5 V; all VDD pins must be powered at the same voltage. |
| 17 | PA10 | bidirectional | TC standard I/O with alternate functions including I2C_SDA, SPI_SCK and UART1_CTS. |
| 18 | PA13/SWDIO | bidirectional | TC I/O that is configured as SWDIO after reset with its internal pull-up enabled; alternates include I2C_SDA, UART1_RXD and IR_OUT. |
| 19 | PA14/SWCLK | bidirectional | TC I/O that is configured as SWCLK after reset with its internal pull-up enabled; alternates include UART3_TXD and I2C_SCL. |
| 20 | PF03/BOOT | input | Boot pin sampled at startup to select between the internal Bootloader and the user program. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | CW |
| Package | TSSOP-20 |
| Category | Single Chip Microcomputer/Microcontroller |
| Pins | 20 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| 外供主电源电压 | VDD - VSS | -0.3 |  | 6 | V |  | 35 |
| 外供模拟电源电压 | VDDA-VSS | -0.3 |  | 6 | V |  | 35 |
| VDD 大于 VDDA 时允许的最大差值 | VDD-VDDA |  |  | 0.3 | V |  | 35 |
| 全部 VDD 供电线的灌电流总和（流入） | ΣIVDD |  |  | 120 | mA |  | 35 |
| 全部 VSS 供电线的拉电流总和（流出） | ΣIVSS | -120 |  |  | mA |  | 35 |
| 单个 I/O 或控制引脚灌入的电流 | IIO(PIN) |  |  | 25 | mA |  | 35 |
| 单个 I/O 或控制引脚输出的电流 | IIO(PIN) | -25 |  |  | mA |  | 35 |
| 全部 I/O 或控制引脚注入的电流总和 | ΣIINJ(PIN) | -25 |  | 25 | mA |  | 35 |
| 储存温度范围 | TSTG | -65 |  | 150 | ℃ |  | 36 |
| 最大结温 | TJ |  |  | 105 | ℃ |  | 36 |
| 内部 AHB 总线频率 | fHCLK | 0 |  | 48 | MHz | VDD ≥ 1.8V | 37 |
| 内部 APB 总线频率 | fPCLK | 0 |  | 48 | MHz | VDD ≥ 1.8V | 37 |
| 内部 AHB 总线频率 | fHCLK | 0 |  | 24 | MHz | 1.65V ≤ VDD ＜ 1.8V | 37 |
| 内部 APB 总线频率 | fPCLK | 0 |  | 24 | MHz | 1.65V ≤ VDD ＜ 1.8V | 37 |
| 标准工作电压 | VDD | 1.65 |  | 5.5 | V |  | 37 |
| 模拟工作电压 | VDDA | 1.65 |  | 5.5 | V | 须等于 VDD | 37 |
| 环境温度（温度标号 6，最大功率耗散） | TA | -40 |  | 85 | ℃ | 温度标号 6：TA=85℃ 最大功率耗散 | 37 |
| 环境温度（低功率耗散） | TA | -40 |  | 105 | ℃ | 低功率耗散，温度标号 6 | 37 |
| 结温范围 | TJ | -40 |  | 105 | ℃ | 温度标号 6 | 37 |
| 上电/掉电复位门限 下降沿 | VPOR/BOR | 1.451 | 1.5 | 1.552 | V | 下降沿 | 38 |
| 上电/掉电复位门限 上升沿 | VPOR/BOR | 1.502 | 1.55 | 1.6 | V | 上升沿 | 38 |
| 复位持续时间 | tRSTTEMPO | 4 | 6.5 | 13 | ms |  | 38 |
| 内部 1.5V 参考电压 | VREFINT1V5 | 1.485 | 1.5 | 1.515 | V | -40℃ < TA < +85℃ | 38 |
| 内部 2.5V 参考电压 | VREFINT2V5 | 2.475 | 2.5 | 2.525 | V | -40℃ < TA < +85℃ | 38 |
| 全温度范围内的内部参考电压分布 | ΔVREFINT |  |  | 101 | mV | VDDA = 3V | 38 |
| 温度系数 | TCoeff | -601 |  | 601 | ppm/℃ |  | 38 |
| 运行模式供电电流（代码自 FLASH 中运行，全部外设打开，48MHz） | IDD |  | 7.2 | 8.2 | mA | VDD = VDDA = 5.5V，TA = 85℃，HSI 或 HSE 时钟 | 39 |
| 运行模式供电电流（代码自 FLASH 中运行，全部外设关闭，48MHz） | IDD |  | 4.6 | 5.2 | mA | VDD = VDDA = 5.5V，TA = 85℃，HSI 或 HSE 时钟 | 39 |
| 运行模式供电电流（代码自 FLASH 中运行，全部外设打开，24MHz） | IDD |  | 5 | 5.7 | mA | VDD = VDDA = 5.5V，TA = 85℃，HSI 或 HSE 时钟 | 39 |
| 运行模式供电电流（代码自 FLASH 中运行，全部外设关闭，24MHz） | IDD |  | 3.7 | 4.2 | mA | VDD = VDDA = 5.5V，TA = 85℃，HSI 或 HSE 时钟 | 39 |
| DeepSleep 模式供电电流（稳压器运行，全部振荡器关闭） | IDD |  | 0.45 | 3.84 | μA | VDD = VDDA = 3.6V，TA = 85℃ | 40 |
| DeepSleep 模式供电电流（稳压器运行，LSI 和 IWDT 打开） | IDD |  | 1.11 | 4.65 | μA | VDD = VDDA = 3.6V，TA = 85℃ | 40 |
| 从 Sleep 模式唤醒 | tWUSLEEP |  | 4 | 4 | HCLK |  | 42 |
| 从 DeepSleep 模式唤醒（稳压器处于运行模式） | tWUDEEP |  | 4 | 5 | μs | 稳压器处于运行模式 | 42 |
| 用户外部时钟源频率 | fHSE_EXT | 1 |  | 32 | MHz |  | 43 |
| OSC_IN 输入高电平时间 | tW(HSEH) | 15 |  |  | ns |  | 43 |
| 用户外部时钟源频率 | fLSE_EXT |  | 32.768 | 1000 | kHz |  | 44 |
| OSC32_IN 输入高电平时间 | tW(LSEH) | 450 |  |  | ns |  | 44 |
| 振荡器频率 | fOSC_IN | 4 | 8 | 32 | MHz |  | 45 |
| HSE 电流消耗（启动） | IDD |  |  | 900 | μA | 启动 | 45 |
| HSI 占空比 | DutyHSI | 45 |  | 55 | % |  | 46 |
| HSI 工厂校准精度 | ACCHSI | -2 |  | 2 | % | TA = -40℃ ~ +85℃ | 46 |
| HSI 工厂校准精度 | ACCHSI | -0.5 |  | 0.5 | % | TA = +25℃ | 46 |
| LSI 工厂校准精度 | ACCLSI | -3 |  | 3 | % | TA = -40℃ ~ +85℃ | 46 |
| RC10K 出厂精度 | ACCRC10K | -50 |  | 50 | % | TA = -40℃ ~ +85℃ | 46 |
| RC150K 出厂精度 | ACCRC150K | -50 |  | 50 | % | TA = -40℃ ~ +85℃ | 47 |
| 编程电压 | Vprog | 1.65 |  | 5.5 | V |  | 47 |
| 寿命 | NNED | 20000 |  |  | 次 | TA = -40℃ ~ +85℃ | 47 |
| 静电放电电压（人体模型） | VESD(HBM) |  |  | 8 | kV | TA = +25℃，符合 JESD22-A115C | 48 |
| 弱上拉等效电阻 | RPU | 45 | 75 | 220 | kΩ | VIN = VSS | 48 |
| 高电平输出电压（源电流） | VOH | 3.02 |  |  | V | Sourcing 10mA, VDD = 3.3V | 49 |
| 低电平输出电压（灌电流） | VOL |  |  | 0.23 | V | Sinking 10mA, VDD = 3.3V | 49 |
| 高电平输出电压（源电流） | VOH | 2.7 |  |  | V | Sourcing 20mA, VDD = 3.3V | 49 |
| 低电平输出电压（灌电流） | VOL |  |  | 0.45 | V | Sinking 20mA, VDD = 3.3V | 49 |
| 弱上拉等效电阻（NRST） | RPU | 7 | 8 | 9 | kΩ | VIN = VSS | 51 |
| ADC 开启时的供电电压 | VDDA | 1.65 |  | 5.5 | V |  | 52 |
| 总转换时间（含采样保持） | tCONV | 24 |  | 29 | 1/fADC |  | 52 |
| 平均斜率 | Avg_Slope | 2.66 | 2.69 | 2.72 | mV/℃ |  | 54 |
| TS 内置温度传感器跟随器建立时间 | tSTART |  |  | 45 | μs |  | 54 |

## CAD (KiCad official)

- Symbol: `CW32L031F8P6`
- Footprint: `Package_SO:TSSOP-20_4.4x6.5mm_P0.65mm`
- 3D model: TSSOP-20 (KiCad packages3D, STEP)
- 3D model files: `cw32l031f8p6-etched.step` / `cw32l031f8p6-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `cw32l031f8p6.step` / `cw32l031f8p6.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [CW datasheet](docs/cw32l031f8p6-datasheet.pdf) (74 pp, sha256 `0e51efc1f45a11c9`, retrieved 2026-10-27, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/cw32l031f8p6-datasheet.pdf)