# CUS08F30

**DOWO** · Schottky Diodes · SOD-323

CUS08F30 from DOWO, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode, the end marked by the color band; the diode blocks up to VRRM 30 V and conducts up to 1 A average forward current. |
| 2 | A | passive | Anode; forward voltage is 0.550 V at IF = 1.0 A and 0.875 V at IF = 3.0 A. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | DOWO |
| Package | SOD-323 |
| Category | Diodes |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum forward voltage | VF |  |  | 0.55 | V | IF = 1.0A | 2 |
| Maximum forward voltage | VF |  |  | 0.875 | V | IF = 3.0A | 2 |
| Maximum reverse breakdown voltage | VR |  |  | 30 | V | IR=1mA | 2 |
| Maximum reverse current | IR |  |  | 1 | mA | VR=30V | 2 |
| Maximum repetitive peak reverse voltage | VRRM |  |  | 30 | V |  | 1 |
| Maximum RMS voltage | VRMS |  |  | 21 | V |  | 1 |
| Maximum DC blocking voltage | VDC |  |  | 30 | V |  | 1 |
| Maximum average forward rectified current | IFM |  |  | 1 | A |  | 1 |
| Peak forward surge current | IFSM |  |  | 9 | A | 8.3ms single half sine-wave | 1 |
| Power Dissipation | PD |  |  | 400 | mW |  | 1 |
| Operating junction temperature | Tj |  |  | 125 | ℃ |  | 1 |
| Storage temperature range | TSTG | -50 |  | 150 | ℃ |  | 1 |
| Typical thermal resistance | RθJA |  | 250 |  | ℃/W |  | 1 |
| Type junction capacitance | Cj |  | 120 |  | pF | VR = 4.0V, f = 1MHz | 2 |

## CAD (KiCad official)

- Symbol: `CUS08F30`
- Footprint: `Diode_SMD:D_SOD-323`
- 3D model: SOD-323 (KiCad packages3D, STEP)
- 3D model files: `cus08f30-etched.step` / `cus08f30-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `cus08f30.step` / `cus08f30.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [DOWO datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8603395477581025280) (3 pp, sha256 `209e810bf656aab0`, retrieved 2026-10-23, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/cus08f30-datasheet.pdf)