component
CSA231LASOIC8
Public Made by Adomby adom
analogysemi Current-Sensing Amplifiers, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownCSA231LASOIC8
analogysemi · Current-Sensing Amplifiers · SOIC-8
CSA231LASOIC8 from analogysemi, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | RS- | input | External sense resistor load-side connection; input common-mode range 0V to 76V (abs max 80V). |
| 2 | GND | power_in | Ground. |
| 3 | REF2 | input | Reference voltage input 2, typically connected to GND; must stay within GND to VDD. |
| 4 | NC | unconnected | No internal connection; do not connect. |
| 5 | OUT | output | Output voltage referenced to 1/2 (REF1 + REF2). |
| 6 | VDD | power_in | Supply voltage 2.7V to 5.5V, bypass with at least 100nF capacitor to GND. |
| 7 | REF1 | input | Reference voltage input 1, typically connected to VDD; must stay within GND to VDD. |
| 8 | RS+ | input | External sense resistor power-side connection; input common-mode range 0V to 76V (abs max 80V). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | analogysemi |
| Package | SOIC-8 |
| Category | Operational Amplifier/Comparator |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Voltage | VDD | 2.7 | 5.5 | V | Guaranteed by PSRR | 6 | |
| Supply Current | IDD | 560 | 800 | µA | TA = 25°C | 6 | |
| Supply Current | IDD | 850 | µA | -40°C < TA < 125°C | 6 | ||
| Power-Supply Rejection Ratio | PSRR | 105 | 108 | dB | 2.7V ≤ VDD ≤ 5.5V | 6 | |
| Input Common-Mode Voltage Range | VCM | 0 | 76 | V | Guaranteed by CMRR | 6 | |
| Input Bias Current at VRS+ and VRS- | IRS+, IRS- | 0.003 | 0.1 | µA | 6 | ||
| Input Offset Current | IRS+, IRS- | 0.2 | µA | 6 | |||
| Input Leakage Current | IRS+, IRS- | 0.2 | µA | VDD = 0V, VRS+ = VRS- = 76V | 6 | ||
| Common-Mode Rejection Ratio | CMRR | 130 | 159 | dB | 0V < VRS+ < 76V | 6 | |
| Input Offset Voltage | VOS | -60 | 8 | 60 | µV | TA = 25°C; typ ±8 | 6 |
| Input Offset Voltage | VOS | -150 | 50 | 150 | µV | -40°C ≤ TA ≤ 125°C; typ ±50 | 6 |
| Gain Error | GE | 0.02 | 0.1 | % | TA = 25°C | 6 | |
| Gain Error | GE | 0.25 | % | -40°C ≤ TA ≤ 85°C | 6 | ||
| Gain Error | GE | 0.3 | % | -40°C ≤ TA ≤ 125°C | 6 | ||
| Input Offset Voltage Drift | TCVOS | 160 | nV/°C | 6 | |||
| Gain | G | 10 | V/V | CSA231-10 | 6 | ||
| VREF Resistor | RREF | 22.6 | kΩ | 6 | |||
| VREF Resistor Match | 0.1 | % | 6 | ||||
| VREF Resistor Temperature Drift | TCRREF | 180 | Ω/°C | 6 | |||
| Reference Voltage Rejection Ratio (Input-Referred) | RVRR | 10 | µV/V | 6 | |||
| Output Low Voltage | VOL | 15 | mV | Sink 500µA | 6 | ||
| Output Low Voltage | VOL | 4 | mV | No load | 6 | ||
| Signal Bandwidth | BW | 90 | kHz | -3dB, All gain configurations, VSENSE > 5mV | 6 | ||
| Slew Rate | SR | 0.4 | V/µs | 6 | |||
| AC Power-Supply Rejection Ratio | AC PSRR | 47 | dB | f = 200kHz | 6 | ||
| AC CMRR | AC CMRR | 90 | dB | f = 200kHz | 6 | ||
| Input Voltage-Noise Density | en | 70 | nV/√Hz | f = 1kHz | 6 | ||
| Power-Up Time | 80 | µs | 6 | ||||
| Saturation Recovery Time | 5 | µs | 6 | ||||
| Supply voltage VDD to GND | VDD | -0.3 | 6 | V | 4 | ||
| RS+, RS- to GND | -0.3 | 80 | V | 4 | |||
| RS+ to RS- | -80 | 80 | V | 1s maximum duration due to package thermal dissipation | 4 | ||
| Continuous input current (any pin) | -20 | 20 | mA | 4 | |||
| Operating temperature | TA | -40 | 125 | °C | 4 | ||
| Junction temperature | TJ | 150 | °C | 4 | |||
| Storage temperature | Tstg | -65 | 150 | °C | 4 | ||
| Lead temperature (soldering, 10s) | 300 | °C | 4 | ||||
| Soldering (reflow) | 260 | °C | 4 | ||||
| Power supply VDD to GND | VDD | 2.7 | 3.3 | 5.5 | V | 5 | |
| VRS+ and VRS- to GND | 0 | 76 | V | 5 | |||
| VRS+, VRS- | -1 | 1 | V | 5 | |||
| Operating ambient temperature | TA | -40 | 125 | °C | 5 | ||
| Junction-to-Ambient Thermal Resistance | RθJA | 90.6 | °C/W | SOIC-8 | 5 | ||
| Junction-to-Board Thermal Resistance | RθJB | 47.6 | °C/W | SOIC-8 | 5 | ||
| Junction-to-Top Characterization Parameter | ψJT | 3.6 | °C/W | SOIC-8 | 5 | ||
| Junction-to-Board Characterization Parameter | ψJB | 47 | °C/W | SOIC-8 | 5 | ||
| Junction-to-Case (Top) Thermal Resistance | RθJC(top) | 35 | °C/W | SOIC-8 | 5 | ||
| Junction-to-Case (Bottom) Thermal Resistance | RθJC(bot) | 50.8 | °C/W | SOIC-8 | 5 |
CAD (KiCad official)
- Symbol:
CSA231LASOIC8 - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
csa231lasoic8-etched.step/csa231lasoic8-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);csa231lasoic8.step/csa231lasoic8.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: analogysemi datasheet (18 pp, sha256
b25417d92b02a132, retrieved 2026-10-23, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).