Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

CS32F030K6T6

CHIPSEA · Microcontroller Units (MCUs/MPUs/SOCs) · LQFP-32(7x7)

CS32F030K6T6 from CHIPSEA, in a LQFP-32(7x7). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VDD power_in Digital power supply for I/O, Regulator and HXT, specified at 2.0V to 5.5V with respect to GND.
2 PF0/HXT_IN bidirectional General-purpose I/O PF0, also the HXT high-speed crystal oscillator input (HXT_IN).
3 PF1/HXT_OUT bidirectional General-purpose I/O PF1, also the HXT high-speed crystal oscillator output (HXT_OUT).
4 NRST bidirectional Active-low reset input and internal reset output.
5 VDDA power_in Analog power supply for ADC, HRC, HRC14, PLL, POR/PDR and LVD, ranging from VDD up to 5.5V; ADC operation requires VDDA above 2.4V.
6 PA0 bidirectional General-purpose I/O PA0 with USART1_CTS, USART2_CTS, ADC_IN0, RTC_TAMP2 and WKUP1 functions.
7 PA1 bidirectional General-purpose I/O PA1 with EVENTOUT, USART1_RTS, USART2_RTS and ADC_IN1 functions.
8 PA2 bidirectional General-purpose I/O PA2 with TIM15_CH1, USART1_TX, USART2_TX and ADC_IN2 functions.
9 PA3 bidirectional General-purpose I/O PA3 with TIM15_CH2, USART1_RX, USART2_RX and ADC_IN3 functions.
10 PA4 bidirectional General-purpose I/O PA4 with SPI1_NSS, I2S1_WS, TIM14_CH1, USART1_CK, USART2_CK and ADC_IN4 functions.
11 PA5 bidirectional General-purpose I/O PA5 with SPI1_SCK, I2S1_CK and ADC_IN5 functions.
12 PA6 bidirectional General-purpose I/O PA6 with SPI1_MISO, I2S1_MCK, TIM3_CH1, TIM1_BKIN, TIM16_CH1, EVENTOUT and ADC_IN6 functions.
13 PA7 bidirectional General-purpose I/O PA7 with SPI1_MOSI, I2S1_SD, TIM3_CH2, TIM1_CH1N, TIM14_CH1, TIM17_CH1, EVENTOUT and ADC_IN7 functions.
14 PB0 bidirectional General-purpose I/O PB0 with TIM3_CH3, TIM1_CH2N, EVENTOUT and ADC_IN8 functions.
15 PB1 bidirectional General-purpose I/O PB1 with TIM3_CH4, TIM14_CH1, TIM1_CH3N and ADC_IN9 functions.
16 GND power_in Chip ground reference for the digital domain.
17 VDD power_in Digital power supply pin, specified at 2.0V to 5.5V with respect to GND.
18 PA8 bidirectional General-purpose I/O PA8 with USART1_CK, TIM1_CH1, EVENTOUT and CKO functions.
19 PA9 bidirectional General-purpose I/O PA9 with USART1_TX, TIM1_CH2, TIM15_BKIN, I2C1_SCL (fast-mode-plus capable) functions.
20 PA10 bidirectional General-purpose I/O PA10 with USART1_RX, TIM1_CH3, TIM17_BKIN and I2C1_SDA (fast-mode-plus capable) functions.
21 PA11 bidirectional General-purpose I/O PA11 with USART1_CTS, TIM1_CH4 and EVENTOUT functions.
22 PA12 bidirectional General-purpose I/O PA12 with USART1_RTS, TIM1_ETR and EVENTOUT functions.
23 PA13 bidirectional General-purpose I/O PA13 with IR_OUT and SWDIO functions; after reset the SWDIO internal pull-up is enabled.
24 PA14 bidirectional General-purpose I/O PA14 with USART1_TX, USART2_TX and SWCLK functions; after reset the SWCLK internal pull-down is enabled.
25 PA15 bidirectional General-purpose I/O PA15 with SPI1_NSS, I2S1_WS, EVENTOUT, USART1_RX and USART2_RX functions.
26 PB3 bidirectional General-purpose I/O PB3 with SPI1_SCK, I2S1_CK and EVENTOUT functions.
27 PB4 bidirectional General-purpose I/O PB4 with SPI1_MISO, I2S1_MCK, TIM3_CH1 and EVENTOUT functions.
28 PB5 bidirectional General-purpose I/O PB5 with SPI1_MOSI, I2S1_SD, I2C1_SMBA, TIM16_BKIN and TIM3_CH2 functions.
29 PB6 bidirectional General-purpose I/O PB6 with I2C1_SCL (fast-mode-plus capable), USART1_TX and TIM16_CH1N functions.
30 PB7 bidirectional General-purpose I/O PB7 with I2C1_SDA (fast-mode-plus capable), USART1_RX and TIM17_CH1N functions.
31 BOOT0 input Boot memory selection input; BOOT0 low selects Flash, high with nBOOT1 selects system memory or SRAM.
32 GND power_in Chip ground reference pin.

Key specifications

Parameter Value
Manufacturer CHIPSEA
Package LQFP-32(7x7)
Category Embedded Processors & Controllers
Pins 32

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
VDD 和 GND 之间的电压 VDD -0.3 6 V 31
VDDA 和 GND 之间的电压 VDDA -0.3 6 V 31
VBAT 和 GND 之间的电压 VBAT -0.3 6 V 31
VDD 和 VDDA 之间的电压 VDD-VDDA 0.4 V 31
I/O 管脚电压 Vi/o -0.3 6 V 31
存储温度 Tstorage -65 150 ℃ 31
结温 Tjunction 150 ℃ 31
流入 VDD 电源线的总电流 Itotal-pwr 120 mA 31
流入每个电源管脚的电流 Ipwr-pin 100 mA 31
流入每个地管脚的电流 IGND-pin -100 mA 31
流入所有 I/O 管脚的总电流 Itotal-sunk 80 mA 31
流入任意一个 I/O 管脚的电流 Isunk-pin 25 mA 31
VDD 的工作电压范围 VVDD-range 2 5.5 V 31
VDDA 的工作电压范围 VVDDA-range 2 5.5 V 31
VBAT 的工作电压范围 VVBAT-range 1.65 5.5 V 31
芯片环境温度(第一类) Trange -40 85 ℃ 31
芯片环境温度(第二类) Trange -40 105 ℃ 31
芯片结温范围(第一类) Tjunction-range -40 105 ℃ 31
芯片结温范围(第二类) Tjunction-range -40 125 ℃ 31
内部 AHB 时钟频率 fAHB-clock 0 48 MHz 31
内部 APB 时钟频率 fAPB-clock 0 48 MHz 31
I/O 输入电压范围 VIO-range -0.3 5.5 V 31
LQFP32 功率耗散 Pdissipation 484 mW Trange=85℃ 或者 Trange=105℃ 31
VDD/VDDA 下降时间速率 Tsupply-fall 20 uS/V 31
VDD 上电复位阈值 TVDD-POR 1.84 1.92 2 V 31
VDD 掉电复位阈值 TVDD-fall 1.8 1.88 1.96 V 31
VDDA 掉电复位阈值 TVDDA-fall 1.8 1.88 1.96 V 31
复位持续时间 Treset-tempo 4.2 10 mS VVDD-range≤5.5V 31
复位持续时间 Treset-tempo 4.2 7.5 mS VVDD-range≤3.6V 31
LVD 上升阈值电压 VLVD 2.11 2.18 2.25 V 31
Internal reference voltage Vrefint 1.19 1.22 1.25 V 38
Internal reference voltage variation over the temperature range deltVrefint 11 mV 38
Temperature coefficient Tc -60 60 ppm/0C 38
ADC 正常工作时 VDDA 电压范围 VDDA 2.4 5.5 V 38
ADC 时钟频率 fADC 0.6 14 MHz 38
ADC 采样时间 Tsample 1.5 236.5 1/ fADC 38
ADC 输入电压范围 Vrange-input 0 V max = VDDA 38
ADC 输入电容 Cinput-ADC 8 pF 38
外部输入阻抗 Rext-input 50 kΩ 38
输入信号隔离 Isoinput -100 dB 38
ADC 分辨率(可设置) Resolution 6 12 Bit 38
ADC 绝对误差 ERRabsolute -4 3.3 4 LSB 38
ADC INL INL -2.3 1.2 2.3 LSB fADC=14MHz, Rext-input<10kΩ, VDDA≥2.7V 38
ADC INL INL -3.5 1.5 3.5 LSB fADC=14MHz, Rext-input<10kΩ, VDDA=2.4V 38
ADC DNL DNL -1.3 0.7 1.3 LSB fADC=14MHz, Rext-input<10kΩ, VDDA≥2.7V 38
ADC DNL DNL -3 2.8 3 LSB fADC=14MHz, Rext-input<10kΩ, VDDA=2.4V 38
ADC offset Offset -2.8 1.9 2.8 LSB fADC=14MHz, Rext-input<10kΩ, VDDA≥2.7V 38
ADC offset Offset -3.5 2 3.5 LSB fADC=14MHz, Rext-input<10kΩ, VDDA=2.4V 38
ADC 增益误差 ERRGain -3 2.8 3 LSB fADC=14MHz, Rext-input<10kΩ, VDDA≥2.7V 38
温度传感器的线性度(0~105℃) Ltemp -2 1 2 ℃ 39
温度传感器的线性度(-40~0℃) Ltemp -4 2 4 ℃ 39
温度传感器电压的平均斜率 Stemp 4.35 4.47 4.6 mV/℃ 39
在 30±5℃时温度传感器电压 Vtemp30 1.37 1.43 1.5 V 在 30±5℃ 39
VBAT 的比例误差 Err -1 1 % 39
16 位编程时间 Tprog 33.6 35 36.4 uS 39
32 位编程时间 Tprog 67.2 70 72.8 uS 39
页(1 kbytes) 擦除时间 Terase 17.6 18.3 19.1 mS 39
整体擦除时间 Tmass-erase 29.1 30.3 31.6 mS 39
可擦写次数 Cycendurance 20000 Cycles 39
数据保存期限 Tretention 100 Year Trange =25℃ 39

CAD (KiCad official)

  • Symbol: CS32F030K6T6
  • Footprint: Package_QFP:LQFP-32_7x7mm_P0.8mm
  • 3D model: LQFP-32(7x7) (KiCad packages3D, STEP)
  • 3D model files: cs32f030k6t6-etched.step / cs32f030k6t6-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); cs32f030k6t6.step / cs32f030k6t6.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: CHIPSEA datasheet (56 pp, sha256 67cc68977c3daacc, retrieved 2026-10-27, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF