component
CS32F030F6P6-RA
Public Made by Adomby adom
CHIPSEA Microcontrollers (MCU/MPU/SOC), TSSOP-20. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
CS32F030F6P6-RA
CHIPSEA · Microcontrollers (MCU/MPU/SOC) · TSSOP-20
CS32F030F6P6-RA from CHIPSEA, in a TSSOP-20. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | BOOT0 | input | Boot mode selection input; low selects boot from Flash, high selects system memory or SRAM depending on the nBOOT1 bit. |
| 2 | PF0/HXT_IN | bidirectional | General-purpose I/O PF0 that also serves as the HXT (4~32MHz crystal oscillator) input. |
| 3 | PF1/HXT_OUT | bidirectional | General-purpose I/O PF1 that also serves as the HXT (4~32MHz crystal oscillator) output. |
| 4 | NRST | bidirectional | Active-low reset input / internal reset output with a permanent pull-up; after POR exit it must be held for at least 9 ms or the FWDT may be enabled. |
| 5 | VDDA | power_in | Analog supply powering the ADC, HRC, HRC14, PLL, POR/PDR and LVD; range from VDD to 5.5V, above 2.4V when the ADC operates. |
| 6 | PA0 | bidirectional | General-purpose I/O PA0 with USART2_CTS alternate function and ADC_IN0 / WKUP1 special functions. |
| 7 | PA1 | bidirectional | General-purpose I/O PA1 with EVENTOUT and USART2_RTS alternate functions and ADC_IN1 special function. |
| 8 | PA2 | bidirectional | General-purpose I/O PA2 with USART2_TX and TIM15_CH1 alternate functions and ADC_IN2 special function. |
| 9 | PA3 | bidirectional | General-purpose I/O PA3 with USART2_RX and TIM15_CH2 alternate functions and ADC_IN3 special function. |
| 10 | PA4 | bidirectional | General-purpose I/O PA4 with SPI1_NSS, TIM14_CH1 and USART2_CK alternate functions and ADC_IN4 special function. |
| 11 | PA5 | bidirectional | General-purpose I/O PA5 with SPI1_SCK alternate function and ADC_IN5 special function. |
| 12 | PA6 | bidirectional | General-purpose I/O PA6 with SPI1_MISO, TIM3_CH1, TIM1_BKIN, TIM16_CH1 and EVENTOUT alternate functions and ADC_IN6 special function. |
| 13 | PA7 | bidirectional | General-purpose I/O PA7 with SPI1_MOSI, TIM3_CH2, TIM14_CH1, TIM1_CH1N, TIM17_CH1 and EVENTOUT alternate functions and ADC_IN7 special function. |
| 14 | PB1 | bidirectional | General-purpose I/O PB1 with TIM3_CH4, TIM14_CH1 and TIM1_CH3N alternate functions and ADC_IN9 special function. |
| 15 | GND | power_in | Chip ground pin. |
| 16 | VDD | power_in | Digital supply for I/O, regulator and HXT, range 2.0V to 5.5V. |
| 17 | PA9 | bidirectional | General-purpose I/O PA9 with USART1_TX, TIM1_CH2, I2C1_SCL and CKO alternate functions; I2C port supporting Fast-mode Plus. |
| 18 | PA10 | bidirectional | General-purpose I/O PA10 with USART1_RX, TIM1_CH3, TIM17_BKIN and I2C1_SDA alternate functions; I2C port supporting Fast-mode Plus. |
| 19 | PA13 | bidirectional | General-purpose I/O PA13 configured as SWDIO after reset (internal pull-up active), with IR_OUT alternate function. |
| 20 | PA14 | bidirectional | General-purpose I/O PA14 configured as SWCLK after reset (internal pull-down active), with USART2_TX alternate function. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | CHIPSEA |
| Package | TSSOP-20 |
| Category | Embedded Processors & Controllers |
| Pins | 20 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| VDD 和 GND 之间的电压 | VDD | -0.3 | 6 | V | 28 | ||
| VDDA 和 GND 之间的电压 | VDDA | -0.3 | 6 | V | 28 | ||
| VDD 和 VDDA 之间的电压 | VDD-VDDA | 0.4 | V | 28 | |||
| I/O 管脚电压 | Vi/o | 6 | V | 28 | |||
| 存储温度 | Tstorage | -65 | 150 | ℃ | 28 | ||
| 结温 | Tjunction | 150 | ℃ | 28 | |||
| 流入 VDD 电源线的总电流 | Itotal-pwr | 120 | mA | 28 | |||
| 流出 GND 接地线的总电流 | Itotal-GND | -120 | mA | 28 | |||
| 流入每个电源管脚的电流 | Ipwr-pin | 100 | mA | 28 | |||
| 流入每个地管脚的电流 | IGND-pin | -100 | mA | 28 | |||
| 流入所有 I/O 管脚的总电流 | Itotal-sunk | 80 | mA | 28 | |||
| 流出所有 I/O 管脚的总电流 | Itotal-source | -80 | mA | 28 | |||
| 流入任意一个 I/O 管脚的电流 | Isunk-pin | 25 | mA | 28 | |||
| 流出任意一个 I/O 管脚的总电流 | Isource-pin | -25 | mA | 28 | |||
| VDD 的工作电压范围 | VVDD-range | 2 | 5.5 | V | 28 | ||
| VDDA 的工作电压范围 | VVDDA-range | 2 | 5.5 | V | 28 | ||
| 芯片环境温度 | Trange | -40 | 85 | ℃ | 28 | ||
| 芯片结温范围 | Tjunction-range | -40 | 125 | ℃ | 28 | ||
| 内部 AHB 时钟频率 | fAHB-clock | 0 | 48 | MHz | 28 | ||
| 内部 APB 时钟频率 | fAPB-clock | 0 | 48 | MHz | 28 | ||
| I/O 输入电压范围 | VIO-range | -0.3 | 5.5 | V | 28 | ||
| VDD/VDDA 上升时间速率 | Tsupply-rise | 0 | μS/V | 28 | |||
| VDD/VDDA 下降时间速率 | Tsupply-fall | 20 | μS/V | 28 | |||
| VDD 上电复位阈值 | TVDD-POR | 1.84 | 1.92 | 2 | V | 28 | |
| VDD 掉电复位阈值 | TVDD-fall | 1.8 | 1.88 | 1.96 | V | 28 | |
| VDDA 掉电复位阈值 | TVDDA-fall | 1.8 | 1.88 | 1.96 | V | 28 | |
| VDD 复位持续时间 | Treset-tempo | 4.2 | 10 | mS | VVDD-range≤5.5V | 28 | |
| VDD 复位持续时间 | Treset-tempo | 4.2 | 7.5 | mS | VVDD-range≤3.6V | 28 | |
| LVD 上升阈值电压 0 | VLVD | 2.11 | 2.18 | 2.25 | V | LVD 上升阈值电压 0 | 28 |
| LVD 下降阈值电压 0 | VLVD | 2.01 | 2.08 | 2.15 | V | LVD 下降阈值电压 0 | 28 |
| LVD 上升阈值电压 1 | VLVD | 2.2 | 2.28 | 2.36 | V | LVD 上升阈值电压 1 | 28 |
| LVD 下降阈值电压 1 | VLVD | 2.1 | 2.18 | 2.26 | V | LVD 下降阈值电压 1 | 28 |
| LVD 上升阈值电压 2 | VLVD | 2.29 | 2.38 | 2.47 | V | LVD 上升阈值电压 2 | 28 |
| LVD 下降阈值电压 2 | VLVD | 2.19 | 2.28 | 2.37 | V | LVD 下降阈值电压 2 | 28 |
| LVD 上升阈值电压 3 | VLVD | 2.39 | 2.48 | 2.57 | V | LVD 上升阈值电压 3 | 28 |
| LVD 下降阈值电压 3 | VLVD | 2.29 | 2.38 | 2.47 | V | LVD 下降阈值电压 3 | 28 |
| LVD 上升阈值电压 4 | VLVD | 2.48 | 2.58 | 2.68 | V | LVD 上升阈值电压 4 | 28 |
| LVD 下降阈值电压 4 | VLVD | 2.38 | 2.48 | 2.58 | V | LVD 下降阈值电压 4 | 28 |
CAD (KiCad official)
- Symbol:
CS32F030F6P6-RA - Footprint:
Package_SO:TSSOP-20_4.4x6.5mm_P0.65mm - 3D model: TSSOP-20 (KiCad packages3D, STEP)
- 3D model files:
cs32f030f6p6-ra-etched.step/cs32f030f6p6-ra-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);cs32f030f6p6-ra.step/cs32f030f6p6-ra.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: CHIPSEA datasheet (48 pp, sha256
dbe20e12d3c88e3c, retrieved 2026-11-07, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).