component
CS100N03A4-G
Public Made by Adomby adom
CRMICRO MOSFETs, TO-252. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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Publish 0.1.0
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CS100N03A4-G
CRMICRO · MOSFETs · TO-252
CS100N03A4-G from CRMICRO, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; gate-to-source voltage is rated at ±20 V, with a threshold of 0.9 V min to 2.0 V max at ID = 250 µA. |
| 2 | D | passive | Drain; rated at 30 V drain-to-source, with 100 A silicon-limited and 60 A package-limited continuous current at TC = 25 °C. |
| 3 | S | passive | Source; the body diode carries up to 60 A continuous (IS) and 240 A pulsed (ISM). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | CRMICRO |
| Package | TO-252 |
| Category | Triode/MOS Tube/Transistor |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-to-Source Breakdown Voltage | VDSS | 30 | V | VGS=0V, ID=250µA | 2 | ||
| Drain to Source Leakage Current | IDSS | 1 | µA | VDS=30V, VGS=0V, Tj=25℃ | 2 | ||
| Drain to Source Leakage Current | IDSS | 100 | µA | VDS=24V, VGS=0V, Tj=125℃ | 2 | ||
| Gate to Source Forward Leakage | IGSS(F) | 100 | nA | VGS=20V | 2 | ||
| Gate to Source Reverse Leakage | IGSS(R) | -100 | nA | VGS=-20V | 2 | ||
| Drain-to-Source On-Resistance | RDS(ON) | 3.3 | 4.5 | mΩ | VGS=10V, ID=19A | 2 | |
| Drain-to-Source On-Resistance | RDS(ON) | 5.6 | 7.5 | mΩ | VGS=4.5V, ID=19A | 2 | |
| Gate Threshold Voltage | VGS(TH) | 0.9 | 1.4 | 2 | V | VDS=VGS, ID=250µA | 2 |
| Continuous Source Current (Body Diode) | IS | 60 | A | TC=25 °C | 3 | ||
| Maximum Pulsed Current (Body Diode) | ISM | 240 | A | TC=25 °C | 3 | ||
| Diode Forward Voltage | VSD | 1.2 | V | IS=19A, VGS=0V | 3 | ||
| Junction-to-Case Thermal Resistance | RθJC | 1.62 | ℃/W | 3 | |||
| Junction-to-Ambient Thermal Resistance | RθJA | 64 | ℃/W | 3 | |||
| Drain-to-Source Voltage | VDSS | 30 | V | Tj=25℃ | 1 | ||
| Continuous Drain Current (Silicon limited) | ID | 100 | A | TC=25 °C | 1 | ||
| Continuous Drain Current (Package limited) | ID | 60 | A | TC=25 °C | 1 | ||
| Pulsed Drain Current | IDM | 240 | A | TC=25 °C | 1 | ||
| Gate-to-Source Voltage | VGS | -20 | 20 | V | 1 | ||
| Avalanche Energy | EAS | 196 | mJ | L=0.5mH, Ias=28A, Start TJ=25℃ | 1 | ||
| Power Dissipation | PD | 77.1 | W | TC=25 °C | 1 | ||
| Derating Factor above 25°C | 0.617 | W/℃ | 1 | ||||
| Operating Junction and Storage Temperature Range | TJ, Tstg | -55 | 150 | ℃ | 1 | ||
| Gate resistance | Rg | 2.1 | Ω | VGS=0V, VDS=0V, f=1MHz | 2 | ||
| Input Capacitance | Ciss | 2442 | pF | VGS=0V, VDS=15V, f=1.0MHz | 2 | ||
| Output Capacitance | Coss | 352.5 | pF | VGS=0V, VDS=15V, f=1.0MHz | 2 | ||
| Reverse Transfer Capacitance | Crss | 320.8 | pF | VGS=0V, VDS=15V, f=1.0MHz | 2 | ||
| Turn-on Delay Time | td(ON) | 12.8 | ns | VGS=10V, RG=2.5Ω, VDD=15V, ID=19A | 2 | ||
| Rise Time | tr | 9.2 | ns | VGS=10V, RG=2.5Ω, VDD=15V, ID=19A | 2 | ||
| Turn-Off Delay Time | td(OFF) | 54 | ns | VGS=10V, RG=2.5Ω, VDD=15V, ID=19A | 2 | ||
| Fall Time | tf | 10.8 | ns | VGS=10V, RG=2.5Ω, VDD=15V, ID=19A | 2 | ||
| Total Gate Charge | Qg | 48 | nC | ID=19A, VDD=15V, VGS=10V | 2 | ||
| Gate to Source Charge | Qgs | 9.3 | nC | ID=19A, VDD=15V, VGS=10V | 2 | ||
| Gate to Drain (Miller) Charge | Qgd | 10.9 | nC | ID=19A, VDD=15V, VGS=10V | 2 | ||
| Reverse Recovery Time | trr | 40.36 | ns | di/dt=100A/us, IF=19A | 3 | ||
| Reverse Recovery Charge | Qrr | 31.99 | nC | di/dt=100A/us, IF=19A | 3 |
CAD (KiCad official)
- Symbol:
CS100N03A4-G - Footprint:
Package_TO_SOT_SMD:TO-252-2 - 3D model: TO-252 (KiCad packages3D, STEP)
- 3D model files:
cs100n03a4-g-etched.step/cs100n03a4-g-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);cs100n03a4-g.step/cs100n03a4-g.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: CRMICRO datasheet (10 pp, sha256
6c1cb06b3cb8b558, retrieved 2026-10-31, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# CS100N03A4-G
**CRMICRO** · MOSFETs · TO-252
CS100N03A4-G from CRMICRO, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; gate-to-source voltage is rated at ±20 V, with a threshold of 0.9 V min to 2.0 V max at ID = 250 µA. |
| 2 | D | passive | Drain; rated at 30 V drain-to-source, with 100 A silicon-limited and 60 A package-limited continuous current at TC = 25 °C. |
| 3 | S | passive | Source; the body diode carries up to 60 A continuous (IS) and 240 A pulsed (ISM). |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | CRMICRO |
| Package | TO-252 |
| Category | Triode/MOS Tube/Transistor |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-to-Source Breakdown Voltage | VDSS | 30 | | | V | VGS=0V, ID=250µA | 2 |
| Drain to Source Leakage Current | IDSS | | | 1 | µA | VDS=30V, VGS=0V, Tj=25℃ | 2 |
| Drain to Source Leakage Current | IDSS | | | 100 | µA | VDS=24V, VGS=0V, Tj=125℃ | 2 |
| Gate to Source Forward Leakage | IGSS(F) | | | 100 | nA | VGS=20V | 2 |
| Gate to Source Reverse Leakage | IGSS(R) | | | -100 | nA | VGS=-20V | 2 |
| Drain-to-Source On-Resistance | RDS(ON) | | 3.3 | 4.5 | mΩ | VGS=10V, ID=19A | 2 |
| Drain-to-Source On-Resistance | RDS(ON) | | 5.6 | 7.5 | mΩ | VGS=4.5V, ID=19A | 2 |
| Gate Threshold Voltage | VGS(TH) | 0.9 | 1.4 | 2 | V | VDS=VGS, ID=250µA | 2 |
| Continuous Source Current (Body Diode) | IS | | | 60 | A | TC=25 °C | 3 |
| Maximum Pulsed Current (Body Diode) | ISM | | | 240 | A | TC=25 °C | 3 |
| Diode Forward Voltage | VSD | | | 1.2 | V | IS=19A, VGS=0V | 3 |
| Junction-to-Case Thermal Resistance | RθJC | | | 1.62 | ℃/W | | 3 |
| Junction-to-Ambient Thermal Resistance | RθJA | | | 64 | ℃/W | | 3 |
| Drain-to-Source Voltage | VDSS | | | 30 | V | Tj=25℃ | 1 |
| Continuous Drain Current (Silicon limited) | ID | | | 100 | A | TC=25 °C | 1 |
| Continuous Drain Current (Package limited) | ID | | | 60 | A | TC=25 °C | 1 |
| Pulsed Drain Current | IDM | | | 240 | A | TC=25 °C | 1 |
| Gate-to-Source Voltage | VGS | -20 | | 20 | V | | 1 |
| Avalanche Energy | EAS | | | 196 | mJ | L=0.5mH, Ias=28A, Start TJ=25℃ | 1 |
| Power Dissipation | PD | | | 77.1 | W | TC=25 °C | 1 |
| Derating Factor above 25°C | | | | 0.617 | W/℃ | | 1 |
| Operating Junction and Storage Temperature Range | TJ, Tstg | -55 | | 150 | ℃ | | 1 |
| Gate resistance | Rg | | 2.1 | | Ω | VGS=0V, VDS=0V, f=1MHz | 2 |
| Input Capacitance | Ciss | | 2442 | | pF | VGS=0V, VDS=15V, f=1.0MHz | 2 |
| Output Capacitance | Coss | | 352.5 | | pF | VGS=0V, VDS=15V, f=1.0MHz | 2 |
| Reverse Transfer Capacitance | Crss | | 320.8 | | pF | VGS=0V, VDS=15V, f=1.0MHz | 2 |
| Turn-on Delay Time | td(ON) | | 12.8 | | ns | VGS=10V, RG=2.5Ω, VDD=15V, ID=19A | 2 |
| Rise Time | tr | | 9.2 | | ns | VGS=10V, RG=2.5Ω, VDD=15V, ID=19A | 2 |
| Turn-Off Delay Time | td(OFF) | | 54 | | ns | VGS=10V, RG=2.5Ω, VDD=15V, ID=19A | 2 |
| Fall Time | tf | | 10.8 | | ns | VGS=10V, RG=2.5Ω, VDD=15V, ID=19A | 2 |
| Total Gate Charge | Qg | | 48 | | nC | ID=19A, VDD=15V, VGS=10V | 2 |
| Gate to Source Charge | Qgs | | 9.3 | | nC | ID=19A, VDD=15V, VGS=10V | 2 |
| Gate to Drain (Miller) Charge | Qgd | | 10.9 | | nC | ID=19A, VDD=15V, VGS=10V | 2 |
| Reverse Recovery Time | trr | | 40.36 | | ns | di/dt=100A/us, IF=19A | 3 |
| Reverse Recovery Charge | Qrr | | 31.99 | | nC | di/dt=100A/us, IF=19A | 3 |
## CAD (KiCad official)
- Symbol: `CS100N03A4-G`
- Footprint: `Package_TO_SOT_SMD:TO-252-2`
- 3D model: TO-252 (KiCad packages3D, STEP)
- 3D model files: `cs100n03a4-g-etched.step` / `cs100n03a4-g-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `cs100n03a4-g.step` / `cs100n03a4-g.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [CRMICRO datasheet](docs/cs100n03a4-g-datasheet.pdf) (10 pp, sha256 `6c1cb06b3cb8b558`, retrieved 2026-10-31, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/cs100n03a4-g-datasheet.pdf)