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Contents

README

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CR4N60A4K

CRMICRO · MOSFETs · TO-252

CR4N60A4K from CRMICRO, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Gate input Gate control input; gate-to-source voltage is rated at ±30 V maximum, with a threshold of 2.0 to 4.0 V at ID = 250 µA.
2 Drain passive Drain terminal, rated for 600 V drain-to-source and 4 A continuous drain current (16 A pulsed).
3 Source passive Source terminal, which is also the body-diode anode, rated for 4 A continuous source current (16 A pulsed).

Key specifications

Parameter Value
Manufacturer CRMICRO
Package TO-252
Category Transistors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-to-Source Voltage VDSS 600 V Tc=25℃ 1
Continuous Drain Current ID 4 A Tc=25℃ 1
Continuous Drain Current ID 2.5 A TC = 100 °C 1
Pulsed Drain Current IDM 16 A Repetitive rating; pulse width limited by maximum junction temperature 1
Gate-to-Source Voltage VGS -30 30 V 1
Single Pulse Avalanche Energy EAS 250 mJ L=10mH, ID=7A, Start TJ=25℃ 1
Peak Diode Recovery dv/dt dv/dt 5 V/ns ISD=4A, di/dt≤100A/us, VDD≤BVDS, Start TJ=25℃ 1
Power Dissipation PD 75 W Tc=25℃ 1
Derating Factor above 25°C 0.6 W/℃ 1
Operating Junction Temperature TJ 150 ℃ 1
Storage Temperature Range Tstg -55 150 ℃ 1
Drain to Source Breakdown Voltage VDSS 600 V VGS=0V, ID=250µA 2
Drain to Source Leakage Current IDSS 1 µA VDS=600V, VGS=0V, TJ=25℃ 2
Drain to Source Leakage Current IDSS 100 µA VDS=480V, VGS=0V, TJ=125℃ 2
Gate to Source Forward Leakage IGSS(F) 100 nA VGS=+30V 2
Gate to Source Reverse Leakage IGSS(R) -100 nA VGS=-30V 2
Drain-to-Source On-Resistance RDS(ON) 2.1 2.5 Ω VGS=10V, ID=2A 2
Gate Threshold Voltage VGS(TH) 2 4 V VDS = VGS, ID = 250µA 2
Diode Forward Voltage VSD 1.5 V IS=4.0A, VGS=0V 3
Continuous Source Current (Body Diode) IS 4 A 3
Maximum Pulsed Current (Body Diode) ISM 16 A 3
Junction-to-Case Thermal Resistance RθJC 1.67 ℃/W 3
Junction-to-Ambient Thermal Resistance RθJA 100 ℃/W 3
Bvdss Temperature Coefficient ΔBVDSS/ΔTJ 0.67 V/℃ ID=250uA, Reference 25℃ 2
Forward Transconductance gfs 3.5 S VDS=15V, ID=2A 2
Input Capacitance Ciss 583 pF VGS=0V, VDS=25V, f=1.0MHz 2
Output Capacitance Coss 44 pF VGS=0V, VDS=25V, f=1.0MHz 2
Reverse Transfer Capacitance Crss 2.7 pF VGS=0V, VDS=25V, f=1.0MHz 2
Turn-on Delay Time td(ON) 13 ns ID=4A, VDD=300V, RG=10Ω 2
Rise Time tr 8.8 ns ID=4A, VDD=300V, RG=10Ω 2
Turn-Off Delay Time td(OFF) 25 ns ID=4A, VDD=300V, RG=10Ω 2
Fall Time tf 9.5 ns ID=4A, VDD=300V, RG=10Ω 2
Total Gate Charge Qg 15.4 nC ID=4A, VDD=480V, VGS=10V 2
Gate to Source Charge Qgs 2.7 nC ID=4A, VDD=480V, VGS=10V 2
Gate to Drain (Miller) Charge Qgd 8.2 nC ID=4A, VDD=480V, VGS=10V 2
Reverse Recovery Time trr 560 ns IS=4.0A, Tj=25℃, dIF/dt=100A/us, VGS=0V 3
Reverse Recovery Charge Qrr 2500 nC IS=4.0A, Tj=25℃, dIF/dt=100A/us, VGS=0V 3
Reverse Recovery Current IRRM 9 A IS=4.0A, Tj=25℃, dIF/dt=100A/us, VGS=0V 3

CAD (KiCad official)

  • Symbol: CR4N60A4K
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252 (KiCad packages3D, STEP)
  • 3D model files: cr4n60a4k-etched.step / cr4n60a4k-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); cr4n60a4k.step / cr4n60a4k.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: CRMICRO datasheet (10 pp, sha256 7d2c538a3c7983db, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF