# CMS16

**TOSHIBA** · Schottky Diodes · SOD-128

CMS16 from TOSHIBA, in a SOD-128. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | TOSHIBA |
| Package | SOD-128 |
| Category | Diodes |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Peak forward voltage (1) | VFM (1) |  |  | 0.4 | V | IFM = 1 A (pulse test) | 1 |
| Peak forward voltage (2) | VFM (2) |  | 0.5 | 0.55 | V | IFM = 3 A (pulse test) | 1 |
| Peak repetitive reverse current (1) | IRRM (1) |  |  | 2 | μA | VRRM = 5 V (pulse test) | 1 |
| Peak repetitive reverse current (2) | IRRM (2) |  | 26 | 200 | μA | VRRM = 40 V (pulse test) | 1 |
| Junction capacitance | Cj |  | 95 |  | pF | VR = 10 V, f = 1 MHz | 1 |
| Thermal resistance (junction to ambient), ceramic board | Rth (j-a) |  | 60 |  | °C/W | Device on ceramic board; board 50 mm × 50 mm; soldering land 2 mm × 2 mm; board thickness 0.64 mm | 1 |
| Thermal resistance (junction to ambient), glass-epoxy board 6 mm land | Rth (j-a) |  | 135 |  | °C/W | Device on glass-epoxy board; board 50 mm × 50 mm; soldering land 6 mm × 6 mm; board thickness 1.6 mm | 1 |
| Thermal resistance (junction to ambient), glass-epoxy board 2.1 mm × 1.4 mm land | Rth (j-a) |  | 210 |  | °C/W | Device on glass-epoxy board; board 50 mm × 50 mm; soldering land 2.1 mm × 1.4 mm; board thickness 1.6 mm | 1 |
| Thermal resistance (junction to lead) | Rth (j-ℓ) |  | 16 |  | °C/W |  | 1 |
| Repetitive peak reverse voltage | VRRM |  |  | 40 | V |  | 1 |
| Average forward current | IF (AV) |  |  | 3 | A | Note 1: Tℓ = 106°C; device on ceramic board; rectangular waveform α = 180°, VR = 20 V | 1 |
| Non-repetitive peak forward surge current | IFSM |  |  | 30 | A | 50 Hz | 1 |
| Junction temperature | Tj | -40 |  | 150 | °C |  | 1 |
| Storage temperature range | Tstg | -40 |  | 150 | °C |  | 1 |
| Recommended maximum junction temperature | Tj |  |  | 120 | °C | Handling precaution 2: recommended junction temperature kept below 120 °C | 2 |
| VRRM temperature coefficient at low temperatures | VRRM |  | 0.1 |  | %/°C | Low-temperature environment operation | 2 |

## CAD (KiCad official)

- Symbol: `CMS16`
- Footprint: `Diode_SMD:D_SOD-128`
- 3D model: SOD-128 (KiCad packages3D, STEP)
- 3D model files: `cms16-etched.step` / `cms16-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `cms16.step` / `cms16.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [TOSHIBA datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8600697326549536768) (5 pp, sha256 `e53b2803d0355014`, retrieved 2026-10-16, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `cathode-band convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/cms16-datasheet.pdf)