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Contents

README

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CMP840

Cmos(广东场效应半导体) · IC · TO-220

CMP840 from Cmos(广东场效应半导体), in a TO-220. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate terminal; the gate-source voltage is rated at ±30 V (VGSS), and the datasheet gives gate-body leakage limits of 100 nA forward and -100 nA reverse at VGS = ±30 V.
2 D passive Drain terminal; the device is rated at 500 V VDSS and 8 A continuous drain current at TC = 25℃ (5 A at TC = 100℃), with 32 A pulsed drain current, and the datasheet notes that drain current is limited by maximum junction temperature.
3 S passive Source terminal; the body diode is rated at a maximum continuous forward current of 8 A and a maximum pulsed forward current of 32 A.

Key specifications

Parameter Value
Manufacturer Cmos(广东场效应半导体)
Package TO-220
Category
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS 500 V VGS = 0 V, ID = 250 µA 2
Zero Gate Voltage Drain Current IDSS 1 µA VDS = 500 V, VGS = 0 V 2
Zero Gate Voltage Drain Current IDSS 100 µA VDS = 400 V, TC = 125℃ 2
Gate-Body Leakage Current, Forward IGSSF 100 nA VGS = 30 V, VDS = 0 V 2
Gate-Body Leakage Current, Reverse IGSSR -100 nA VGS = -30 V, VDS = 0 V 2
Gate Threshold Voltage VGS(th) 2 4 V VDS = VGS, ID = 250 µA 2
Static Drain-Source On-Resistance RDS(on) 0.92 1.1 Ω VGS = 10 V, ID = 3.5A 2
Drain-Source Diode Forward Voltage VSD 0.87 1.4 V VGS = 0 V, IS = 7A 2
Maximum Continuous Drain-Source Diode Forward Current IS 8 A 2
Maximum Pulsed Drain-Source Diode Forward Current ISM 32 A 2
Drain-Source Voltage VDSS 500 V 1
Drain Current - Continuous ID 8 A TC = 25℃ 1
Drain Current - Continuous ID 5 A TC = 100℃ 1
Drain Current - Pulsed IDM 32 A 1
Gate-Source Voltage VGSS -30 30 V 1
Single Pulsed Avalanche Energy EAS 500 mJ VDS = 80 V, VGS = 10 V, L = 10 mH, IAS = 10 A (note b) 1
Peak Diode Recovery dv/dt dv/dt 4.5 V/ns 1
Power Dissipation PD 140 W TC = 25℃ 1
Operating and Storage Temperature Range TJ, TSTG -55 150 ℃ 1
Maximum Lead Temperature for Soldering Purposes TL 300 ℃ 1/8 from case for 5 seconds 1
Thermal Resistance, Junction-to-Case RθJC 0.89 ℃/W Max. 1
Thermal Resistance, Junction-to-Ambient RθJA 62.5 ℃/W Max. 1

CAD (KiCad official)

  • Symbol: CMP840
  • Footprint: Package_TO_SOT_THT:TO-220-3_Vertical
  • 3D model: TO-220 (KiCad packages3D, STEP)
  • 3D model files: cmp840-etched.step / cmp840-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); cmp840.step / cmp840.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Cmos(广东场效应半导体) datasheet (3 pp, sha256 59c40dc62a3dde46, retrieved 2026-10-20, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF