component
CMP10N60
Public Made by Adomby adom
Cmos MOSFETs, TO-220. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 11d ago |
| viewers | 11d ago |
| cmp10n60-etched.glb | 11d ago |
| cmp10n60-etched.step | 11d ago |
| cmp10n60-hero.glb | 11d ago |
| cmp10n60-hero.overlay.json | 11d ago |
| cmp10n60.glb | 11d ago |
| cmp10n60.kicad_mod | 11d ago |
| cmp10n60.kicad_sym | 11d ago |
| cmp10n60.lbr | 11d ago |
| cmp10n60.step | 11d ago |
| package.json | 11d ago |
| page.json | 11d ago |
| README.md | 11d ago |
CMP10N60
Cmos · MOSFETs · TO-220
CMP10N60 from Cmos, in a TO-220. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate terminal of the MOSFET, with gate-source voltage rated at ±30 V (VGSS). |
| 2 | D | passive | Drain terminal, rated for 600 V drain-source voltage (VDSS) and 10 A continuous drain current at TC = 25℃. |
| 3 | S | passive | Source terminal, the reference for the gate-source voltage and the drain-source breakdown test condition (VGS = 0 V). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Cmos |
| Package | TO-220 |
| Category | Triode/MOS Tube/Transistor |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDSS | 600 | V | 1 | |||
| Gate-Source Voltage | VGSS | -30 | 30 | V | 1 | ||
| Single Pulsed Avalanche Energy | EAS | 562 | mJ | 1 | |||
| Repetitive Avalanche Energy | EAR | 16 | mJ | 1 | |||
| Peak Diode Recovery dv/dt | dv/dt | 5 | V/ns | 1 | |||
| Operating and Storage Temperature Range | TJ, TSTG | -55 | 150 | ℃ | 1 | ||
| Maximum lead temperature for soldering | TL | 300 | ℃ | 1/8 from case for 5 seconds | 1 | ||
| Thermal Resistance, Junction-to-Ambient | RθJA | 62.5 | ℃/W | 1 | |||
| Thermal Resistance, Case-to-Sink | RθCS | 0.5 | ℃/W | 1 | |||
| Drain-Source Breakdown Voltage | BVDSS | 600 | V | VGS = 0 V, ID = 250 µA | 2 | ||
| Breakdown Voltage Temperature Coefficient | BVDSS / TJ | 0.67 | V/°C | ID = 250 µA, Referenced to 25°C | 2 | ||
| Zero Gate Voltage Drain Current | IDSS | 10 | µA | VDS = 600 V, VGS = 0 V | 2 | ||
| Zero Gate Voltage Drain Current at high temperature | IDSS | 100 | µA | VDS = 480 V, TC=125°C | 2 | ||
| Gate-Body Leakage Current, Forward | IGSSF | 100 | nA | VGS = 30 V, VDS = 0 V | 2 | ||
| Gate-Body Leakage Current, Reverse | IGSSR | -100 | nA | VGS = -30 V, VDS = 0 V | 2 | ||
| Gate Threshold Voltage | VGS(th) | 2 | 4.5 | V | VDS = VGS, ID = 250 µA | 2 | |
| Forward Transconductance | gFS | 8 | S | VDS = 25 V, ID = 5A | 2 | ||
| Input Capacitance | Ciss | 1800 | pF | VDS = 25 V, VGS = 0 V, f = 1.0 MHz | 2 | ||
| Output Capacitance | Coss | 138 | pF | VDS = 25 V, VGS = 0 V, f = 1.0 MHz | 2 | ||
| Reverse Transfer Capacitance | Crss | 21 | pF | VDS = 25 V, VGS = 0 V, f = 1.0 MHz | 2 | ||
| Total Gate Charge | Qg | 38 | nC | VDS = 480 V, ID = 10A, VGS = 10 V | 2 | ||
| Gate-Source Charge | Qgs | 7 | nC | VDS = 480 V, ID = 10A, VGS = 10 V | 2 | ||
| Gate-Drain Charge | Qgd | 16.7 | nC | VDS = 480 V, ID = 10A, VGS = 10 V | 2 | ||
| Maximum Continuous Drain-Source Diode Forward Current | IS | 10 | A | 2 | |||
| Maximum Pulsed Drain-Source Diode Forward Current | ISM | 40 | A | 2 | |||
| Drain-Source Diode Forward Voltage | VSD | 1.4 | V | VGS = 0 V, IS = 9A | 2 | ||
| Reverse Recovery Time | trr | 330 | ns | VGS = 0 V, IS = 4A, dIF / dt = 100 A/µs | 2 | ||
| Reverse Recovery Charge | Qrr | 2.2 | µC | VGS = 0 V, IS = 4A, dIF / dt = 100 A/µs | 2 |
CAD (KiCad official)
- Symbol:
CMP10N60 - Footprint:
Package_TO_SOT_THT:TO-220-3_Vertical - 3D model: TO-220 (KiCad packages3D, STEP)
- 3D model files:
cmp10n60-etched.step/cmp10n60-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);cmp10n60.step/cmp10n60.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Cmos datasheet (2 pp, sha256
53f72570d28ce42c, retrieved 2026-10-27, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).