# CMFB103F3500HANT

**FH Guangdong Fenghua Advanced Tech** · NTC Thermistors · 0805

CMFB103F3500HANT from FH Guangdong Fenghua Advanced Tech, in a 0805. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | One of two interchangeable Ni/Sn-plated terminal electrodes of the chip NTC thermistor (R25 10 kΩ, B25/50 3500 K), operating range -40°C to +120°C. |
| 2 | 2 | passive | Second interchangeable Ni/Sn-plated terminal electrode of the chip NTC thermistor (R25 10 kΩ, B25/50 3500 K), operating range -40°C to +120°C. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | FH Guangdong Fenghua Advanced Tech |
| Package | 0805 |
| Category | Sensors |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Tolerance of R25 (code F) | ΔR25 | -1 |  | 1 | % | Part-number tolerance code F = ±1.0%, R25 at 25℃ | 5 |
| Tolerance of B value (code H) | ΔB25/50 | -3 |  | 3 | % | Part-number tolerance code H = ±3.0% | 5 |
| Operating temperature range |  | -40 |  | 120 | ℃ | Reliability item 1, Operating Temperature Range | 12 |
| R25 change after resistance to soldering heat | ΔR25 | -5 |  | 5 | % | Solder 260±5℃, immersion 10±1s | 12 |
| B25/50 change after resistance to soldering heat | ΔB25/50 | -2 |  | 2 | % | Solder 260±5℃, immersion 10±1s | 12 |
| R25 change after vibration | ΔR25 | -5 |  | 5 | % | Vibration 10Hz-55Hz-10Hz, amplitude 1.52mm, 2 hrs per X/Y/Z axis | 13 |
| B25/50 change after vibration | ΔB25/50 | -2 |  | 2 | % | Vibration 10Hz-55Hz-10Hz, amplitude 1.52mm, 2 hrs per X/Y/Z axis | 13 |
| R25 change after resistance to flexure | ΔR25 | -5 |  | 5 | % | Size 0805 camber 1.0mm, pressing speed 0.5 mm/s on PCB | 13 |
| B25/50 change after resistance to flexure | ΔB25/50 | -2 |  | 2 | % | Size 0805 camber 1.0mm, pressing speed 0.5 mm/s on PCB | 13 |
| R25 change after drop | ΔR25 | -5 |  | 5 | % | Drop 10 times on concrete floor from 1 m | 13 |
| B25/50 change after drop | ΔB25/50 | -2 |  | 2 | % | Drop 10 times on concrete floor from 1 m | 13 |
| R25 change after high temperature storage | ΔR25 | -5 |  | 5 | % | 125±2℃, no load, 500±2hrs | 13 |
| B25/50 change after high temperature storage | ΔB25/50 | -2 |  | 2 | % | 125±2℃, no load, 500±2hrs | 13 |
| R25 change after low temperature storage | ΔR25 | -5 |  | 5 | % | -40±2℃, 500±2hrs | 14 |
| B25/50 change after low temperature storage | ΔB25/50 | -2 |  | 2 | % | -40±2℃, 500±2hrs | 14 |
| R25 change after constant humidity heat | ΔR25 | -5 |  | 5 | % | 55±2℃, 90-95%RH, 500±2hrs | 14 |
| B25/50 change after constant humidity heat | ΔB25/50 | -2 |  | 2 | % | 55±2℃, 90-95%RH, 500±2hrs | 14 |
| R25 change after temperature cycling | ΔR25 | -5 |  | 5 | % | 32 cycles without load, -40℃ to +125℃ steps of 30 min, 10 min RT | 14 |
| B25/50 change after temperature cycling | ΔB25/50 | -2 |  | 2 | % | 32 cycles without load, -40℃ to +125℃ steps of 30 min, 10 min RT | 14 |
| Preheat temperature difference, solder to part surface |  |  |  | 150 | ℃ | Pre-heating: difference between solder and part surface, max | 16 |
| Cooling temperature difference, part to solvent |  |  |  | 100 | ℃ | After soldering: difference between part surface and solvent, max | 17 |
| Iron soldering power |  |  |  | 30 | W | Iron soldering, iron tip not to touch ceramic body | 17 |
| Iron soldering time |  |  |  | 5 | S | Iron soldering at 350℃, dwell time <5S | 17 |
| Iron soldering temperature |  |  | 350 |  | ℃ | Iron soldering set point, iron tip max 30W | 17 |
| Zero-power resistance R25 | R25 |  | 10 |  | KΩ | At 25℃, zero-power, part code 103 (10 KΩ) | 8 |
| B value B25/50 | B25/50 |  | 3500 |  | K | B25/50 per part code 3500, T1/T2 25/50 (code A) | 8 |

## CAD (KiCad official)

- Symbol: `CMFB103F3500HANT`
- Footprint: `Resistor_SMD:R_0805_2012Metric`
- 3D model: 0805 (KiCad packages3D, STEP)
- 3D model files: `cmfb103f3500hant-etched.step` / `cmfb103f3500hant-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `cmfb103f3500hant.step` / `cmfb103f3500hant.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [FH Guangdong Fenghua Advanced Tech datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8590224408263757824) (19 pp, sha256 `47186ed5f781bcb7`, retrieved 2026-10-15, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/cmfb103f3500hant-datasheet.pdf)