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Contents

README

markdown

CMD4010

Cmos(广东场效应半导体) · IC · TO-252

CMD4010 from Cmos(广东场效应半导体), in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; VGS rated ±20 V with threshold of 1 V min to 3 V max at ID=250uA.
2 D passive Drain (also the metal tab); VDS rated 40 V and continuous current 60 A at TC=25°C.
3 S passive Source; connects to the body diode anode, which has VSD max 1.1 V at ISD=15A.

Key specifications

Parameter Value
Manufacturer Cmos(广东场效应半导体)
Package TO-252
Category
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS 40 V VGS=0V, ID=250uA 2
Gate Threshold Voltage VGS(th) 1 3 V VGS=VDS, ID=250uA 2
Static Drain-Source On-Resistance RDS(ON) 14 mΩ VGS=10V, ID=15A 2
Static Drain-Source On-Resistance RDS(ON) 17 mΩ VGS=5V, ID=8A 2
Drain-Source Leakage Current IDSS 1 uA VDS=32V, VGS=0V, TJ=25℃ 2
Drain-Source Leakage Current IDSS 30 uA VDS=32V, VGS=0V, TJ=85℃ 2
Gate-Source Leakage Current IGSS 100 nA VGS 20V, VDS=0V 2
Diode Forward Voltage VSD 1.1 V VGS=0V, ISD=15A 2
Drain-Source Voltage VDS 40 V 1
Gate-Source Voltage VGS -20 20 V 1
Continuous Drain Current ID@TC=25 60 A 1
Continuous Drain Current ID@TC=100 35 A 1
Total Power Dissipation PD@TC=25 50 W 1
Storage Temperature Range TSTG -55 150 1
Operating Junction Temperature Range TJ 150 1
Pulsed Drain Current IDM 240 A 1
Single Pulse Avalanche Energy EAS 144 mJ Note 1: VDS=30V, VGS=10V, L=1mH, IAS=17A 1
Thermal Resistance Junction-ambient R JA 50 /W 1
Thermal Resistance Junction-Case R JC 2.5 /W 1

CAD (KiCad official)

  • Symbol: CMD4010
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252 (KiCad packages3D, STEP)
  • 3D model files: cmd4010-etched.step / cmd4010-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); cmd4010.step / cmd4010.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Cmos(广东场效应半导体) datasheet (3 pp, sha256 3553d35c83d6d6c1, retrieved 2026-10-20, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF