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Contents

README

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CMD30P02

Cmos(广东场效应半导体) · IC · TO-252

CMD30P02 from Cmos(广东场效应半导体), in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; controls the channel, with VGS rated ±12 V maximum and threshold of -0.5 to -1.5 V at ID=-250uA.
2 D passive Drain, also the exposed tab; rated VDS -20 V and continuous drain current -30 A at TC=25℃.
3 S passive Source; carries up to -30 A continuous with body diode forward voltage of -1.3 V max at IF=-5A.

Key specifications

Parameter Value
Manufacturer Cmos(广东场效应半导体)
Package TO-252
Category
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDS -20 V 1
Gate-Source Voltage VGS -12 12 V 1
Continuous Drain Current ID -30 A TC=25℃ 1
Continuous Drain Current ID -18 A TC=75℃ 1
Pulsed Drain Current IDM -120 A 1
Single Pulse Avalanche Energy EAS 42 mJ VDD=-15V, VGS=-10V, L=0.5mH, IAS=-13A 1
Total Power Dissipation PD 40 W TC=25℃ 1
Storage Temperature Range TSTG -55 150 ℃ 1
Operating Junction Temperature Range TJ -55 150 ℃ 1
Thermal Resistance Junction-ambient RθJA 110 ℃/W 1
Thermal Resistance Junction-Case RθJC 4 ℃/W 1
Drain-Source Breakdown Voltage BVDSS -20 V VGS=0V, ID=-250uA 2
Static Drain-Source On-Resistance RDS(ON) 30 40 mΩ VGS=-4.5V, ID=-6A 2
Static Drain-Source On-Resistance RDS(ON) 50 90 mΩ VGS=-2.5V, ID=-4A 2
Gate Threshold Voltage VGS(th) -0.5 -1.5 V VGS=VDS, ID=-250uA 2
Drain-Source Leakage Current IDSS -1 uA VDS=-20V, VGS=0V, TJ=25℃ 2
Drain-Source Leakage Current IDSS -10 uA VDS=-20V, VGS=0V, TJ=125℃ 2
Gate-Source Leakage Current IGSS -100 100 nA VGS = ±12V, VDS=0V 2
Continuous Source Current IS -30 A 2
Pulsed Source Current ISM -120 A VGS =VDS =0V, Force Current 2
Diode Forward Voltage VSD -1.3 V VGS=0V, IF=-5A, Tj =25℃ 2

CAD (KiCad official)

  • Symbol: CMD30P02
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252 (KiCad packages3D, STEP)
  • 3D model files: cmd30p02-etched.step / cmd30p02-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); cmd30p02.step / cmd30p02.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Cmos(广东场效应半导体) datasheet (4 pp, sha256 f2d5ed1cb8bdeb7a, retrieved 2026-10-29, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF