# CMD1653

**Cmos(广东场效应半导体)** · MOSFETs · TO-252

CMD1653 from Cmos(广东场效应半导体), in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate terminal of the N-channel MOSFET; gate-source voltage is rated at ±20 V (VGS). |
| 2 | D | passive | Drain terminal; drain-source voltage is rated at 30 V (VDS) with continuous drain current of 50 A at TC=25°C. |
| 3 | S | passive | Source terminal; continuous source current is rated at 50 A (IS) and pulsed source current at 150 A (ISM). |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Cmos(广东场效应半导体) |
| Package | TO-252 |
| Category | Transistors/Thyristors |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS |  |  | 30 | V |  | 1 |
| Gate-Source Voltage | VGS |  |  | 20 | V |  | 1 |
| Continuous Drain Current | ID@TC=25 |  |  | 50 | A |  | 1 |
| Continuous Drain Current | ID@TC=100 |  |  | 40 | A |  | 1 |
| Pulsed Drain Current | IDM |  |  | 150 | A |  | 1 |
| Single Pulse Avalanche Energy | EAS |  |  | 55 | mJ | VDD=15V, VGS=10V, L=1.0mH, IAS=10A | 1 |
| Avalanche Current | IAS |  |  | 40 | A |  | 1 |
| Total Power Dissipation | PD@TC=25 |  |  | 50 | W |  | 1 |
| Storage Temperature Range | TSTG | -55 |  | 175 |  |  | 1 |
| Operating Junction Temperature Range | TJ | -55 |  | 175 |  |  | 1 |
| Thermal Resistance Junction-ambient | R JA |  |  | 45 | /W | surface mounted on 1 inch2 FR-4 board, 2OZ copper (note 1) | 1 |
| Thermal Resistance Junction-Case | R JC |  |  | 2.5 | /W | surface mounted on 1 inch2 FR-4 board, 2OZ copper (note 1) | 1 |
| Drain-Source Breakdown Voltage | BVDSS | 30 |  |  | V | VGS=0V, ID=250uA | 2 |
| Static Drain-Source On-Resistance | RDS(ON) |  | 6.5 | 8 | m | VGS=10V, ID=30A | 2 |
| Static Drain-Source On-Resistance | RDS(ON) |  | 11 | 14 | m | VGS=4.5V, ID=20A | 2 |
| Gate Threshold Voltage | VGS(th) |  |  | 3 | V | VGS=VDS, ID=250uA | 2 |
| Drain-Source Leakage Current | IDSS |  |  | 1 | uA | VDS=24V, VGS=0V, TJ=25℃ | 2 |
| Drain-Source Leakage Current | IDSS |  |  | 10 | uA | VDS=24V, VGS=0V, TJ=150℃ | 2 |
| Gate-Source Leakage Current | IGSS |  |  | 100 | nA | VGS 20V, VDS=0V | 2 |
| Continuous Source Current | IS |  |  | 50 | A |  | 2 |
| Pulsed Source Current | ISM |  |  | 150 | A | VG=VD=0V, Force Current | 2 |
| Diode Forward Voltage | VSD |  |  | 1.2 | V | VGS=0V, IS=20A, TJ=25℃ | 2 |
| BVDSS Temperature Coefficient | BVDSS TJ |  | 0.023 |  | V/ | Reference to 25, ID=250uA | 2 |
| VGS(th) Temperature Coefficient | VGS(th) |  | -5 |  | mV/ | VGS=VDS, ID=250uA | 2 |
| Forward Transconductance | gfs |  | 35 |  | S | VDS=5V, ID=10A | 2 |
| Gate Resistance | Rg |  | 2.4 |  |  | VDS=0V, VGS=0V, f=1MHz | 2 |
| Total Gate Charge | Qg |  | 12 |  | nC | VDS=15V, VGS=4.5V, ID=20A | 2 |
| Gate-Source Charge | Qgs |  | 4.5 |  | nC | VDS=15V, VGS=4.5V, ID=20A | 2 |
| Gate-Drain Charge | Qgd |  | 6 |  | nC | VDS=15V, VGS=4.5V, ID=20A | 2 |
| Turn-On Delay Time | Td(on) |  | 10 |  | ns | VDD=15V, VGS=10V, RG=3.3, ID=20A | 2 |
| Rise Time | Tr |  | 25 |  | ns | VDD=15V, VGS=10V, RG=3.3, ID=20A | 2 |
| Turn-Off Delay Time | Td(off) |  | 20 |  | ns | VDD=15V, VGS=10V, RG=3.3, ID=20A | 2 |
| Fall Time | Tf |  | 14 |  | ns | VDD=15V, VGS=10V, RG=3.3, ID=20A | 2 |
| Input Capacitance | Ciss |  | 950 |  | pF | VDS=15V, VGS=0V, f=1MHz | 2 |
| Output Capacitance | Coss |  | 380 |  | pF | VDS=15V, VGS=0V, f=1MHz | 2 |
| Reverse Transfer Capacitance | Crss |  | 180 |  | pF | VDS=15V, VGS=0V, f=1MHz | 2 |

## CAD (KiCad official)

- Symbol: `CMD1653`
- Footprint: `Package_TO_SOT_SMD:TO-252-2`
- 3D model: TO-252 (KiCad packages3D, STEP)
- 3D model files: `cmd1653-etched.step` / `cmd1653-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `cmd1653.step` / `cmd1653.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Cmos(广东场效应半导体) datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8590904034305777664) (2 pp, sha256 `36dd4f3f81e7e194`, retrieved 2026-10-19, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/cmd1653-datasheet.pdf)