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CMB50N06N

Cmos(广东场效应半导体) · IC · TO-263

CMB50N06N from Cmos(广东场效应半导体), in a TO-263. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate of the MOSFET, rated for a gate-source voltage of ±20 V (VGS), per the Absolute Maximum Ratings.
2 D passive Drain of the MOSFET, rated for 60 V drain-source voltage (VDS) and 50 A continuous drain current at TC=25℃.
3 S passive Source of the MOSFET, rated for 50 A continuous source current (IS) per the Diode Characteristics table.

Key specifications

Parameter Value
Manufacturer Cmos(广东场效应半导体)
Package TO-263
Category
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Gate-Source Leakage Current IGSS -100 100 nA VGS = ±20V , VDS=0V 2
Gate Threshold Voltage VGS(th) 1 3 V VGS=VDS , ID =250μA 2
Drain-Source Leakage Current IDSS 1 uA VDS=60V , VGS=0V , TJ=25℃ 2
Drain-Source Leakage Current IDSS 100 uA VDS=60V , VGS=0V , TJ=100℃ 2
Drain-Source Breakdown Voltage BVDSS 60 V VGS=0V , ID=250μA 2
Static Drain-Source On-Resistance RDS(ON) 11 14 mΩ VGS=10V , ID=25A 2
Static Drain-Source On-Resistance RDS(ON) 13 16 mΩ VGS=4.5V , ID=20A 2
Continuous Source Current IS 50 A 2
Pulsed Source Current ISM 200 A VG=VD=0V , Force Current 2
Diode Forward Voltage VSD 0.84 1.25 V VGS=0V , IS=20A ,TJ=25℃ 2
Drain-Source Voltage VDS 60 V 1
Gate-Source Voltage VGS -20 20 V 1
Continuous Drain Current ID@TC=25℃ 50 A 1
Continuous Drain Current ID@TC=100℃ 35 A 1
Pulsed Drain Current IDM 200 A 1
Single Pulse Avalanche Energy EAS 162 mJ Note 1: VDD=30V , VGS=10V , L=1mH , IAS=18A 1
Total Power Dissipation PD@TC=25℃ 145 W 1
Storage Temperature Range TSTG -55 150 ℃ 1
Operating Junction Temperature Range TJ -55 150 ℃ 1
Thermal Resistance Junction-ambient RθJA 50 ℃/W 1
Thermal Resistance Junction-Case RθJC 0.86 ℃/W 1

CAD (KiCad official)

  • Symbol: CMB50N06N
  • Footprint: Package_TO_SOT_SMD:TO-263-2
  • 3D model: TO-263 (KiCad packages3D, STEP)
  • 3D model files: cmb50n06n-etched.step / cmb50n06n-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); cmb50n06n.step / cmb50n06n.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Cmos(广东场效应半导体) datasheet (3 pp, sha256 cd4b62bc1e5bf790, retrieved 2026-10-20, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF