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CMB32N20P

Cmos(广东场效应半导体) · MOSFETs · TO-263

CMB32N20P from Cmos(广东场效应半导体), in a TO-263. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate terminal of the N-channel MOSFET, with gate-source voltage rated at ±20 V (VGS).
2 D passive Drain terminal, rated for a drain-source voltage of 200 V and a continuous drain current of 32 A at TC=25℃ (limited by maximum junction temperature).
3 S passive Source terminal, with body-diode continuous source current rated at 32 A and pulsed source current at 128 A.

Key specifications

Parameter Value
Manufacturer Cmos(广东场效应半导体)
Package TO-263
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS 200 V VGS=0V, ID=250uA 2
Gate Threshold Voltage VGS(th) 2 4 V VGS=VDS, ID=250uA 2
Drain-Source Leakage Current IDSS 1 uA VDS=200V, VGS=0V 2
Drain-Source Leakage Current IDSS 100 uA VDS=160V, VGS=0V 2
Gate-Source Leakage Current IGSS -100 100 nA VGS = ±20V, VDS=0V 2
Continuous Source Current IS 32 A 2
Pulsed Source Current ISM 128 A VG=VD=0V, Force Current 2
Diode Forward Voltage VSD 1.5 V VGS=0V, IS=32 A, TJ=25℃ 2
Drain-Source Voltage VDS 200 V 1
Gate-Source Voltage VGS -20 20 V Printed as ±20 V 1
Continuous Drain Current ID@TC=25℃ 32 A Drain current limited by maximum junction temperature 1
Continuous Drain Current ID@TC=100℃ 22 A Drain current limited by maximum junction temperature 1
Pulsed Drain Current IDM 128 A Repetitive rating; pulse width limited by maximum junction temperature (note 1) 1
Single Pulse Avalanche Energy EAS 1000 mJ VDD=80V, VGS=10V, L=5.0mH, IAS=20A (note 2) 1
Total Power Dissipation PD@TC=25℃ 160 W TC=25℃ (220/263/262 column) 1
Storage Temperature Range TSTG -55 150 ℃ 1
Operating Junction Temperature Range TJ -55 150 ℃ 1
Thermal Resistance Junction-ambient RθJA 62.5 ℃/W 1
Thermal Resistance Junction-case RθJC 0.78 ℃/W 1

CAD (KiCad official)

  • Symbol: CMB32N20P
  • Footprint: Package_TO_SOT_SMD:TO-263-2
  • 3D model: TO-263 (KiCad packages3D, STEP)
  • 3D model files: cmb32n20p-etched.step / cmb32n20p-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); cmb32n20p.step / cmb32n20p.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Cmos(广东场效应半导体) datasheet (3 pp, sha256 01ab40b3499d0a78, retrieved 2026-10-21, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF