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CMA16N50

Cmos · MOSFETs · TO-3P

CMA16N50 from Cmos, in a TO-3P. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; gate-source voltage is rated at ±30 V maximum, with threshold of 2 to 4 V at VGS=VDS, ID=250uA.
2 D passive Drain; drain-source voltage rated at 500 V with 16 A continuous drain current at TC=25℃ (64 A pulsed).
3 S passive Source; continuous source current of 16 A and pulsed source current of 64 A through the body diode.

Key specifications

Parameter Value
Manufacturer Cmos
Package TO-3P
Category Triode/MOS Tube/Transistor
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS 500 V VGS=0V, ID=250uA 2
Gate Threshold Voltage VGS(th) 2 4 V VGS=VDS, ID=250uA 2
Drain-Source Leakage Current IDSS 1 uA VDS=500V, VGS=0V 2
Drain-Source Leakage Current at elevated temperature IDSS 10 uA VDS=400V, VGS=0V, TC=125℃ 2
Gate-Source Leakage Current IGSS -100 100 nA VGS = ±30V, VDS=0V 2
Continuous Source Current IS 16 A 2
Pulsed Source Current ISM 64 A VG=VD=0V, Force Current 2
Diode Forward Voltage VSD 1.4 V VGS=0V, IS=16A, TJ=25℃ 2
Drain-Source Voltage VDS 500 V 1
Gate-Source Voltage VGS -30 30 V 1
Continuous Drain Current at TC=25℃ ID 16 A TC=25℃ 1
Continuous Drain Current at TC=100℃ ID 9.6 A TC=100℃ 1
Pulsed Drain Current IDM 64 A 1
Single Pulse Avalanche Energy EAS 960 mJ 1
Total Power Dissipation at TC=25℃ PD 200 W TC=25℃ 1
Storage Temperature Range TSTG -55 150 ℃ 1
Operating Junction Temperature Range TJ -55 150 ℃ 1
Thermal Resistance Junction-ambient RθJA 40 ℃/W 1
Thermal Resistance Junction-case RθJC 0.6 ℃/W 1

CAD (KiCad official)

  • Symbol: CMA16N50
  • Footprint: Package_TO_SOT_THT:TO-3P-3_Vertical
  • 3D model: TO-3P (KiCad packages3D, STEP)
  • 3D model files: cma16n50-etched.step / cma16n50-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); cma16n50.step / cma16n50.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Cmos datasheet (2 pp, sha256 33bfb3b6c54d7733, retrieved 2026-11-07, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF