# CLVC2G125IDCURQ1

**Texas Instruments** · Buffers / Drivers · VSSOP-8

CLVC2G125IDCURQ1 from Texas Instruments, in a VSSOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1OE | input | Output enable for buffer 1; the 1Y output is high-impedance when 1OE is high. |
| 2 | 1A | input | Buffer 1 data input, accepts voltages up to 5.5 V; unused inputs must be held at VCC or GND. |
| 3 | 2Y | tri_state | Buffer 2 3-state output with ±24-mA drive at 3.3 V, high-impedance when 2OE is high. |
| 4 | GND | power_in | Ground. |
| 5 | 2A | input | Buffer 2 data input, accepts voltages up to 5.5 V; unused inputs must be held at VCC or GND. |
| 6 | 1Y | tri_state | Buffer 1 3-state output with ±24-mA drive at 3.3 V, high-impedance when 1OE is high. |
| 7 | 2OE | input | Output enable for buffer 2; the 2Y output is high-impedance when 2OE is high. |
| 8 | VCC | power_in | Supply voltage, 1.65 V to 5.5 V operating. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | VSSOP-8 |
| Category | Logic ICs |
| Pins | 8 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage range | VCC | -0.5 |  | 6.5 | V |  | 2 |
| Input voltage range | VI | -0.5 |  | 6.5 | V |  | 2 |
| Output voltage range, high-impedance or power-off state | VO | -0.5 |  | 6.5 | V | high-impedance or power-off state | 2 |
| Output voltage range, high or low state | VO | -0.5 |  |  | V | high or low state; max VCC + 0.5 V | 2 |
| Input clamp current | IIK | -50 |  |  | mA | VI < 0 | 2 |
| Output clamp current | IOK | -50 |  |  | mA | VO < 0 | 2 |
| Continuous output current | IO | -50 |  | 50 | mA | ±50 mA | 2 |
| Continuous current through VCC or GND |  | -100 |  | 100 | mA | ±100 mA | 2 |
| Package thermal impedance | θJA |  | 227 |  | °C/W | DCU package | 2 |
| Storage temperature range | Tstg | -65 |  | 150 | °C |  | 2 |
| Supply voltage, operating | VCC | 1.65 |  | 5.5 | V | Operating | 3 |
| Supply voltage, data retention only | VCC | 1.5 |  |  | V | Data retention only | 3 |
| High-level input voltage | VIH | 2 |  |  | V | VCC = 3 V to 3.6 V | 3 |
| Low-level input voltage | VIL |  |  | 0.8 | V | VCC = 3 V to 3.6 V | 3 |
| Input voltage | VI | 0 |  | 5.5 | V |  | 3 |
| Output voltage, 3-state | VO | 0 |  | 5.5 | V | 3-state | 3 |
| Operating free-air temperature | TA | -40 |  | 85 | °C |  | 3 |
| High-level output voltage | VOH | 2.4 |  |  | V | IOH = -16 mA, VCC = 3 V | 4 |
| High-level output voltage | VOH | 2.3 |  |  | V | IOH = -24 mA, VCC = 3 V | 4 |
| High-level output voltage | VOH | 3.8 |  |  | V | IOH = -32 mA, VCC = 4.5 V | 4 |
| Low-level output voltage | VOL |  |  | 0.55 | V | IOL = 24 mA, VCC = 3 V | 4 |
| Input current | II | -5 |  | 5 | μA | A or OE inputs, VI = 5.5 V or GND, VCC = 0 to 5.5 V | 4 |
| Power-off leakage current | Ioff | -10 |  | 10 | μA | VI or VO = 5.5 V, VCC = 0 | 4 |
| Off-state output current | IOZ |  |  | 10 | μA | VO = 0 to 5.5 V, VCC = 3.6 V | 4 |
| Supply current | ICC |  |  | 10 | μA | VI = 5.5 V or GND, IO = 0, VCC = 1.65 V to 5.5 V | 4 |
| Change in supply current | ΔICC |  |  | 500 | μA | One input at VCC, 0.6 V, other inputs at VCC or GND, VCC = 3 V to 5.5 V | 4 |
| Input capacitance, data inputs | Ci |  | 3.5 |  | pF | VI = VCC or GND, VCC = 3.3 V | 4 |
| Input capacitance, control inputs | Ci |  | 4 |  | pF | VI = VCC or GND, VCC = 3.3 V | 4 |
| Output capacitance | Co |  | 6.5 |  | pF | VO = VCC or GND, VCC = 3.3 V | 4 |
| Propagation delay A to Y | tpd | 1.4 |  | 4.3 | ns | VCC = 3.3 V ± 0.3 V | 4 |
| Enable time OE to Y | ten | 1.2 |  | 4.7 | ns | VCC = 3.3 V ± 0.3 V | 4 |
| Disable time OE to Y | tdis | 1.4 |  | 4.6 | ns | VCC = 3.3 V ± 0.3 V | 4 |

## CAD (KiCad official)

- Symbol: `CLVC2G125IDCURQ1`
- Footprint: `Package_SO:VSSOP-8_2.3x2mm_P0.5mm`
- 3D model: VSSOP-8 (KiCad packages3D, STEP)
- 3D model files: `clvc2g125idcurq1-etched.step` / `clvc2g125idcurq1-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `clvc2g125idcurq1.step` / `clvc2g125idcurq1.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/lit/ds/symlink/clvc2g125idcurq1.pdf) (16 pp, sha256 `fce78632a676a4ce`, retrieved 2026-10-23, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/clvc2g125idcurq1-datasheet.pdf)