# CL9945A50P3M

**CHIPLINK(芯联)** · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOT-89-3L

CL9945A50P3M from CHIPLINK(芯联), in a SOT-89-3L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Ground terminal (接地端) of the regulator; the datasheet gives no electrical limit for this pin. |
| 2 | VIN | power_in | Supply input pin; the maximum input voltage is 24 V, and the absolute maximum VIN rating is -0.3 V to +28 V. |
| 3 | VOUT | power_out | Regulated output pin; output voltage is selectable from 1.5 V to 5 V in 0.1 V steps, with a maximum output current of 150 mA. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | CHIPLINK(芯联) |
| Package | SOT-89-3L |
| Category | Power Management (PMIC) |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| VIN pin voltage | VIN | -0.3 |  | 28 | V |  | 3 |
| VOUT pin voltage | VOUT | 2.7 |  | 24 | V |  | 3 |
| Maximum power dissipation, SOT89 |  |  |  | 500 | mW | SOT89 package | 3 |
| Maximum power dissipation, SOT89 with added PCB heat dissipation |  |  |  | 1000 | mW | SOT89, increased PCB heat dissipation (note 1, reference only) | 3 |
| Operating ambient temperature | Topr | -25 |  | 85 | C |  | 3 |
| Storage temperature | Tstg | -40 |  | 125 | C |  | 3 |
| Soldering temperature | Tsolder |  |  | 260 | C | 10 s | 3 |
| ESD human body model |  | 2000 |  |  | V | Human body model (HBM) | 3 |
| ESD machine model |  | 200 |  |  | V | Machine model (MM) | 3 |
| Latch-up level |  | 200 |  |  | mA |  | 3 |

## CAD (KiCad official)

- Symbol: `CL9945A50P3M`
- Footprint: `Package_TO_SOT_SMD:SOT-89-3`
- 3D model: SOT-89-3L (KiCad packages3D, STEP)
- 3D model files: `cl9945a50p3m-etched.step` / `cl9945a50p3m-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `cl9945a50p3m.step` / `cl9945a50p3m.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [CHIPLINK(芯联) datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8603127080334999552) (10 pp, sha256 `5d58efa996304931`, retrieved 2026-10-18, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/cl9945a50p3m-datasheet.pdf)