# CL9901A28L3M

**CHIPLINK(芯联)** · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOT-23-3L

CL9901A28L3M from CHIPLINK(芯联), in a SOT-23-3L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GND | power_in | Ground terminal of the CL9901 regulator (接地端), used as the reference for the VOUT pin voltage range of GND-0.3 V to VIN+0.3 V. |
| 2 | VOUT | power_out | Regulated output pin; the datasheet limits the VOUT pin voltage to GND-0.3 V to VIN+0.3 V and the output current to 500 mA, with IOUT limited by Pd/(VIN-VOUT). |
| 3 | VIN | power_in | Supply input pin; the absolute maximum VIN pin voltage is -0.3 V to +6.0 V. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | CHIPLINK(芯联) |
| Package | SOT-23-3L |
| Category | Power Management (PMIC) |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input voltage, absolute maximum (VIN pin) | VIN | -0.3 |  | 6 | V |  | 3 |
| Output current, absolute maximum (VOUT pin) | IOUT |  |  | 500 | mA | Note (1): IOUT = Pd/(VIN-VOUT) | 3 |
| Maximum power dissipation, SOT23_3L |  |  |  | 300 | mW | SOT23_3L package, without added PCB heat dissipation | 3 |
| Maximum power dissipation, SOT23_3L with PCB heat dissipation |  |  |  | 600 | mW | SOT23_3L package, with added PCB heat dissipation; Note (2): for reference only | 3 |
| Storage temperature | Tstg | -40 |  | 125 | C |  | 3 |
| Soldering temperature | Tsolder |  |  | 260 | C | 10 s | 3 |
| Operating ambient temperature | Topr | -25 |  | 85 | C |  | 3 |

## CAD (KiCad official)

- Symbol: `CL9901A28L3M`
- Footprint: `Package_TO_SOT_SMD:SOT-23-3`
- 3D model: SOT-23-3L (KiCad packages3D, STEP)
- 3D model files: `cl9901a28l3m-etched.step` / `cl9901a28l3m-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `cl9901a28l3m.step` / `cl9901a28l3m.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [CHIPLINK(芯联) datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8603127895225622528) (10 pp, sha256 `80814e3270d530b4`, retrieved 2026-10-17, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/cl9901a28l3m-datasheet.pdf)