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Contents

README

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CKS32F051C8T6

CKS · Microcontrollers (MCU/MPU/SOC) · LQFP-48(7x7)

CKS32F051C8T6 from CKS, in a LQFP-48(7x7). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VBAT power_in Backup supply for RTC, external 32 kHz oscillator and backup registers when VDD is off. 1.65-3.6 V.
2 PC13 bidirectional Standard 3.3 V I/O (TC). Additional functions: RTC_TAMP1, RTC_TS, RTC_OUT, WKUP2. Supplied via the VBAT switch - limited to 2 MHz / 30 pF, cannot source LED current.
3 PC14/OSC32_IN bidirectional Standard 3.3 V I/O (TC) muxed with the 32.768 kHz LSE oscillator input (OSC32_IN). Supplied via the VBAT switch with the same 2 MHz / 30 pF drive limits as PC13.
4 PC15/OSC32_OUT bidirectional Standard 3.3 V I/O (TC) muxed with the 32.768 kHz LSE oscillator output (OSC32_OUT). Backup-domain pin with 2 MHz / 30 pF drive limits.
5 PF0/OSC_IN bidirectional 5 V-tolerant I/O (FT) muxed with the HSE main crystal oscillator input (OSC_IN, 4-32 MHz).
6 PF1/OSC_OUT bidirectional 5 V-tolerant I/O (FT) muxed with the HSE main crystal oscillator output (OSC_OUT).
7 NRST bidirectional Bidirectional device reset (RST, active low) with internal weak pull-up. Asserted externally to reset the MCU, driven low internally on any internal reset source.
8 VSSA power_in Analog ground reference for ADC, DAC, reset block, RC oscillators and PLL. Tie to VSS on the board.
9 VDDA power_in Analog supply 2.0-3.6 V (min 2.4 V when ADC or DAC is used). Must be ≥ VDD and powered before VDD.
10 PA0 bidirectional 3.3 V I/O direct-to-ADC (TTa). AF: USART2_CTS, TIM2_CH1_ETR, COMP1_OUT, TSC_G1_IO1. Additional: ADC_IN0, COMP1_INM6, RTC_TAMP2, WKUP1.
11 PA1 bidirectional 3.3 V I/O direct-to-ADC (TTa). AF: USART2_RTS, TIM2_CH2, TSC_G1_IO2, EVENTOUT. Additional: ADC_IN1, COMP1_INP.
12 PA2 bidirectional 3.3 V I/O direct-to-ADC (TTa). AF: USART2_TX, TIM2_CH3, TIM15_CH1, COMP2_OUT, TSC_G1_IO3. Additional: ADC_IN2, COMP2_INM6.
13 PA3 bidirectional 3.3 V I/O direct-to-ADC (TTa). AF: USART2_RX, TIM2_CH4, TIM15_CH2, TSC_G1_IO4. Additional: ADC_IN3, COMP2_INP.
14 PA4 bidirectional 3.3 V I/O direct-to-ADC (TTa). AF: SPI1_NSS/I2S1_WS, USART2_CK, TIM14_CH1, TSC_G2_IO1. Additional: ADC_IN4, COMP1_INM4, COMP2_INM4, DAC1_OUT.
15 PA5 bidirectional 3.3 V I/O direct-to-ADC (TTa). AF: SPI1_SCK/I2S1_CK, CEC, TIM2_CH1_ETR, TSC_G2_IO2. Additional: ADC_IN5, COMP1_INM5, COMP2_INM5.
16 PA6 bidirectional 3.3 V I/O direct-to-ADC (TTa). AF: SPI1_MISO/I2S1_MCK, TIM3_CH1, TIM1_BKIN, TIM16_CH1, COMP1_OUT, TSC_G2_IO3, EVENTOUT. Additional: ADC_IN6.
17 PA7 bidirectional 3.3 V I/O direct-to-ADC (TTa). AF: SPI1_MOSI/I2S1_SD, TIM3_CH2, TIM14_CH1, TIM1_CH1N, TIM17_CH1, COMP2_OUT, TSC_G2_IO4, EVENTOUT. Additional: ADC_IN7.
18 PB0 bidirectional 3.3 V I/O direct-to-ADC (TTa). AF: TIM3_CH3, TIM1_CH2N, TSC_G3_IO2, EVENTOUT. Additional: ADC_IN8.
19 PB1 bidirectional 3.3 V I/O direct-to-ADC (TTa). AF: TIM3_CH4, TIM14_CH1, TIM1_CH3N, TSC_G3_IO3. Additional: ADC_IN9.
20 PB2 bidirectional 5 V-tolerant I/O (FT). AF: TSC_G3_IO4.
21 PB10 bidirectional 5 V-tolerant I/O (FT). AF: I2C2_SCL, CEC, TIM2_CH3, TSC_SYNC.
22 PB11 bidirectional 5 V-tolerant I/O (FT). AF: I2C2_SDA, TIM2_CH4, TSC_G6_IO1, EVENTOUT.
23 VSS power_in Digital ground.
24 VDD power_in Digital supply 2.0-3.6 V.
25 PB12 bidirectional 5 V-tolerant I/O (FT). AF: SPI2_NSS, TIM1_BKIN, TSC_G6_IO2, EVENTOUT.
26 PB13 bidirectional 5 V-tolerant I/O (FT). AF: SPI2_SCK, TIM1_CH1N, TSC_G6_IO3.
27 PB14 bidirectional 5 V-tolerant I/O (FT). AF: SPI2_MISO, TIM1_CH2N, TIM15_CH1, TSC_G6_IO4.
28 PB15 bidirectional 5 V-tolerant I/O (FT). AF: SPI2_MOSI, TIM1_CH3N, TIM15_CH1N, TIM15_CH2. Additional: RTC_REFIN.
29 PA8 bidirectional 5 V-tolerant I/O (FT). AF: USART1_CK, TIM1_CH1, EVENTOUT, MCO.
30 PA9 bidirectional 5 V-tolerant I/O (FT). AF: USART1_TX, TIM1_CH2, TIM15_BKIN, TSC_G4_IO1.
31 PA10 bidirectional 5 V-tolerant I/O (FT). AF: USART1_RX, TIM1_CH3, TIM17_BKIN, TSC_G4_IO2.
32 PA11 bidirectional 5 V-tolerant I/O (FT). AF: USART1_CTS, TIM1_CH4, COMP1_OUT, TSC_G4_IO3, EVENTOUT.
33 PA12 bidirectional 5 V-tolerant I/O (FT). AF: USART1_RTS, TIM1_ETR, COMP2_OUT, TSC_G4_IO4, EVENTOUT.
34 PA13/SWDIO bidirectional 5 V-tolerant I/O (FT). Configured as SWDAT (SWDIO) after reset with internal pull-up. AF: IR_OUT, SWDAT.
35 PF6 bidirectional 5 V-tolerant I/O (FT). AF: I2C2_SCL.
36 PF7 bidirectional 5 V-tolerant I/O (FT). AF: I2C2_SDA.
37 PA14/SWCLK bidirectional 5 V-tolerant I/O (FT). Configured as SWCLK after reset with internal pull-down. AF: USART2_TX, SWCLK.
38 PA15 bidirectional 5 V-tolerant I/O (FT). AF: SPI1_NSS/I2S1_WS, USART2_RX, TIM2_CH1_ETR, EVENTOUT.
39 PB3 bidirectional 5 V-tolerant I/O (FT). AF: SPI1_SCK/I2S1_CK, TIM2_CH2, TSC_G5_IO1, EVENTOUT.
40 PB4 bidirectional 5 V-tolerant I/O (FT). AF: SPI1_MISO/I2S1_MCK, TIM3_CH1, TSC_G5_IO2, EVENTOUT.
41 PB5 bidirectional 5 V-tolerant I/O (FT). AF: SPI1_MOSI/I2S1_SD, I2C1_SMBA, TIM16_BKIN, TIM3_CH2.
42 PB6 bidirectional 5 V-tolerant I/O with Fast-Mode+ (FTf, 20 mA sink for I2C Fm+). AF: I2C1_SCL, USART1_TX, TIM16_CH1N, TSC_G5_IO3.
43 PB7 bidirectional 5 V-tolerant I/O with Fast-Mode+ (FTf). AF: I2C1_SDA, USART1_RX, TIM17_CH1N, TSC_G5_IO4.
44 BOOT0 input Dedicated boot-mode select input (B). Sampled at reset with the option-byte boot bit to select boot from user Flash / system memory / SRAM. Must be tied through an external pull-up or pull-down; cannot be left floating.
45 PB8 bidirectional 5 V-tolerant I/O with Fast-Mode+ (FTf). AF: I2C1_SCL, CEC, TIM16_CH1, TSC_SYNC.
46 PB9 bidirectional 5 V-tolerant I/O with Fast-Mode+ (FTf). AF: I2C1_SDA, IR_OUT, TIM17_CH1, EVENTOUT.
47 VSS power_in Digital ground.
48 VDD power_in Digital supply 2.0-3.6 V.

Key specifications

Parameter Value
Manufacturer CKS
Package LQFP-48(7x7)
Category MCU
Pins 48

Ordering variants

Same part, different packaging or reel option.

  • CKS32F051C8T6
  • CKS32F051C8T6C6T6
  • CKS32F051C8T6C4T6
  • CKS32F051C8T6C8T7
  • CKS32F051C8T6C6T7
  • CKS32F051C8T6C4T7
  • CKS32F051C8T6C8U6
  • CKS32F051C8T6C6U6
  • CKS32F051C8T6C4U6
  • CKS32F051C8T6C8U7
  • CKS32F051C8T6C6U7
  • CKS32F051C8T6C4U7
  • CKS32F051C8T6R8T6
  • CKS32F051C8T6R6T6
  • CKS32F051C8T6R4T6
  • CKS32F051C8T6R8T7
  • CKS32F051C8T6R6T7
  • CKS32F051C8T6R4T7
  • CKS32F051C8T6K8T6
  • CKS32F051C8T6K6T6
  • CKS32F051C8T6K4T6
  • CKS32F051C8T6K8T7
  • CKS32F051C8T6K6T7
  • CKS32F051C8T6K4T7
  • CKS32F051C8T6K8U6
  • CKS32F051C8T6K6U6
  • CKS32F051C8T6K4U6
  • CKS32F051C8T6K8U7
  • CKS32F051C8T6K6U7
  • CKS32F051C8T6K4U7

CAD (KiCad official)

  • Symbol: CKS32F051C8T6
  • Footprint: Package_QFP:LQFP-48_7x7mm_P0.5mm
  • 3D model: LQFP-48(7x7) (KiCad packages3D, STEP)
  • 3D model files: cks32f051c8t6-etched.step / cks32f051c8t6-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); cks32f051c8t6.step / cks32f051c8t6.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: CKS datasheet (91 pp, sha256 e733607a3ed17f59, retrieved 2026-08-17, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF