main
Ray Publish 0.1.0 745ae22 17d ago

CJ7812B-TFN-ARG

Changjing · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · TO-252-2L

CJ7812B-TFN-ARG from Changjing, in a TO-252-2L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 IN power_in Input of the device; the recommended input voltage range for the CJ7812B is up to 32 V, with an absolute maximum input of 36 V.
2 GND power_in Regulator ground.
3 OUT power_out Output of the device, providing the fixed 12 V output of the CJ7812B with output current up to 1 A at TJ = 25°C.

Key specifications

Parameter Value
Manufacturer Changjing
Package TO-252-2L
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output voltage, TJ = 25°C, ±2% grade VOUT 11.75 12 12.25 V TJ = 25°C; ±2% grade 14
Output voltage over line, load and temperature VOUT 11.5 12 12.5 V IOUT = 5mA to 1A, VIN = 14.8 to 27V, TJ = -40 to 125°C, PD ≤ 15W 14
Line regulation ΔVRLINE 25 120 mV VIN = 14.8 to 27V, IOUT = 500mA 14
Load regulation ΔVRLOAD 40 120 mV VIN = 19V, IOUT = 5mA to 1A 14
Quiescent current IQ 3.4 6 mA VIN = 19V, TJ = -40 to 125°C, IOUT = 0mA 14
Quiescent current change ΔIQ 0.1 0.8 mA VIN = 19V, IOUT = 5mA to 1A 14
Quiescent current change ΔIQ 0.3 0.8 mA VIN = 14.8 to 30V, IOUT = 500mA 14
Short circuit current ISC 200 mA VIN = 35V, TA = 25°C 14
Maximum input voltage range VIN MAX 36 V 8
Maximum output current IOUT MAX 1 A 8
Maximum junction temperature TJ Max 150 °C 8
Storage temperature Tstg -65 150 °C 8
Soldering temperature Tsolder 260 °C 10s 8
Input voltage range, CJ7812B VIN 32 V CJ7812B 8
Operating junction temperature TJ -40 125 °C 8
Junction-to-ambient thermal resistance, TO-252-2L RΘJA 78.9 °C/W TO-252-2L; TA = 25°C; soldered on PCB in still air without extra heat dissipation pads 9
Junction-to-case thermal resistance, TO-252-2L RΘJC 5.8 °C/W TO-252-2L 9
Reference maximum power dissipation for continuous operation, TO-252-2L PD Ref 1.25 W TO-252-2L; TA = 25°C; soldered on PCB in still air 9

CAD (KiCad official)

  • Symbol: CJ7812B-TFN-ARG
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252-2L (KiCad packages3D, STEP)
  • 3D model files: cj7812b-tfn-arg-etched.step / cj7812b-tfn-arg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); cj7812b-tfn-arg.step / cj7812b-tfn-arg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Changjing datasheet (33 pp, sha256 2bf7e0142c58a2c8, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF