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CJ7809B-TGN-ARG

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Changjing Voltage Regulators - Linear, Low Drop Out (LDO) Regulators, TO-263-2L. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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CJ7809B-TGN-ARG

Changjing · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · TO-263-2L

CJ7809B-TGN-ARG from Changjing, in a TO-263-2L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 IN power_in Input of the device; for the CJ7809B the recommended input voltage maximum is 29 V (absolute maximum input voltage is 36 V).
2 GND power_in Regulator ground.
3 OUT power_out Output of the device, providing up to 1 A output current (fixed 9.0 V for the CJ7809B).

Key specifications

Parameter Value
Manufacturer Changjing
Package TO-263-2L
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Output voltage (±2% grade) VOUT 8.82 9 9.18 V TJ = 25°C, ±2% grade 13
Output voltage over line, load and temperature 8.65 9 9.35 V IOUT = 5mA to 1A, VIN = 11.5 to 23V, TJ = -40 to 125°C, PD ≤ 15W 13
Line regulation ΔVRLINE 25 90 mV VIN = 11.5 to 23V, IOUT = 500mA 13
Load regulation ΔVRLOAD 25 100 mV VIN = 15V, IOUT = 5mA to 1A 13
Quiescent current IQ 3.2 6 mA VIN = 15V, TJ = -40 to 125°C, IOUT = 0mA 13
Quiescent current change ΔIQ 0.1 0.8 mA VIN = 15V, IOUT = 5mA to 1A 13
Quiescent current change ΔIQ 0.3 0.8 mA VIN = 11.5 to 23V, IOUT = 500mA 13
Short circuit current ISC 200 mA VIN = 35V, TA = 25°C 13
Maximum input voltage range VIN MAX 36 V 8
Maximum output current IOUT MAX 1 A 8
Maximum junction temperature TJ Max 150 °C 8
Storage temperature Tstg -65 150 °C 8
Soldering temperature Tsolder 260 °C 10s 8
Input voltage range (CJ7809B) VIN 29 V CJ7809B 8
Operating junction temperature TJ -40 125 °C 8
Junction-to-ambient thermal resistance, TO-263-2L RΘJA 62.3 °C/W TA = 25°C, soldered on PCB, still air, no extra heat dissipation pads 9
Junction-to-case thermal resistance, TO-263-2L RΘJC 5.3 °C/W TA = 25°C, soldered on PCB, still air, no extra heat dissipation pads 9
Reference maximum power dissipation, TO-263-2L PD Ref 1.6 W TA = 25°C, soldered on PCB, still air, no extra heat dissipation pads 9

CAD (KiCad official)

  • Symbol: CJ7809B-TGN-ARG
  • Footprint: Package_TO_SOT_SMD:TO-263-2
  • 3D model: TO-263-2L (KiCad packages3D, STEP)
  • 3D model files: cj7809b-tgn-arg-etched.step / cj7809b-tgn-arg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); cj7809b-tgn-arg.step / cj7809b-tgn-arg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Changjing datasheet (33 pp, sha256 2bf7e0142c58a2c8, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF