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Contents

README

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CJ6330A30M

Changjing · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOT-23-3L

CJ6330A30M from Changjing, in a SOT-23-3L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Regulator ground.
2 OUT power_out Regulator output; an output capacitor must be placed between OUT and GND to maintain stability, as close to the OUT and GND pins as possible for best transient response.
3 IN power_in Input to the device; use the recommended input capacitor placed as close as possible to the IN and GND pins to obtain the best transient response and minimize input impedance. Input voltage range is 2.5V to 18V.

Key specifications

Parameter Value
Manufacturer Changjing
Package SOT-23-3L
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input voltage range VIN 2.5 18 V 8
Operating junction temperature TJ -40 125 °C 8
Operating ambient temperature TA -40 85 °C 8
Input voltage VIN 2.5 18 V TA = 25°C 10
DC output tolerance -2 2 % TJ = 25°C, IOUT = 1mA 10
Output current IOUT 300 mA TJ = 25°C 10
Quiescent current IQ 2 5 µA IOUT = 0mA 10
Dropout voltage VDO 160 270 mV VOUT = 3.0 to 3.6V, IOUT = 100mA 10
Line regulation LNR 0.01 0.3 %/V VIN = VOUT +1V to 18V, IOUT = 10mA 10
Output current limit ILimit 350 500 mA VOUT = 0.5 × VOUT Normal, VIN = 5.0V 10
Standby current ISTBY 0.2 µA EN = GND 10
EN low voltage VEN L 0.3 V 10
Input voltage range VIN -0.3 24 V 8
Enable input voltage range VEN -0.3 24 V 8
Output voltage range VOUT -0.3 10 V 8
Maximum junction temperature TJ Max 125 °C 8
Storage temperature Tstg -40 125 °C 8
Soldering temperature Tsolder 260 °C 10s 8
Junction-to-ambient thermal resistance (SOT-23-3L) RΘJA 261.2 °C/W Still air, TA = 25°C, 1 in² FR-4 board, 2 oz copper 9
Junction-to-case thermal resistance (SOT-23-3L) RΘJC 65.7 °C/W 9
Reference maximum power dissipation for continuous operation (SOT-23-3L) PD Ref 0.38 W Still air, TA = 25°C, 1 in² FR-4 board, 2 oz copper 9

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper • Place the input and output capacitors as close to the pins of the device as possible; • The device is connected by copper plane and the heat sink (or back pad) of the device is fully welded with 25

CAD (KiCad official)

  • Symbol: CJ6330A30M
  • Footprint: Package_TO_SOT_SMD:SOT-23-3
  • 3D model: SOT-23-3L (KiCad packages3D, STEP)
  • 3D model files: cj6330a30m-etched.step / cj6330a30m-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); cj6330a30m.step / cj6330a30m.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Changjing datasheet (35 pp, sha256 ef1dd74aa3b7af80, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF