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CJ4054A420M

Changjing · Pre-ordered transistors · SOT-23-5L

CJ4054A420M from Changjing, in a SOT-23-5L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model). Symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 CHRG output Open-drain charge status output that is pulled low by an internal N-channel MOSFET (about 10mA sink) while charging and is high impedance during undervoltage lockout.
2 GND power_in Ground terminal.
3 BAT bidirectional Charger power stage current output and battery voltage sense input that regulates the final float voltage (4.20V for CJ4054A420M) and should be bypassed to GND with a 10µF to 47µF capacitor, drawing less than 2µA in shutdown or sleep mode.
4 VCC power_in Charger positive input supply, specified from 4.5V to 6.5V and to be bypassed with at least a 4.7µF capacitor, which enters low-power sleep mode when VCC drops to within 80mV of the BAT voltage.
5 PROG output Charge current program, charge current monitor and shutdown pin, programmed by a 1% RPROG resistor to GND (regulated to 1V in constant-current mode and 0.1V in pre-conditioning), with a 1.21V shutdown threshold and an approximately 2.4V clamp.

Key specifications

Parameter Value
Manufacturer Changjing
Package SOT-23-5L
Category Triode/MOS Tube/Transistor
Pins 5

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Supply Voltage VCC -0.3 10 V All voltages with respect to network ground 4
PROG Pin Voltage -0.3 V Printed as -0.3~VCC+0.3; upper limit is an expression, not a number 4
BAT Pin Voltage -0.3 8 V 4
CHRG Pin Voltage -0.3 10 V 4
BAT Pin Output Current (Continuous) IBAT 800 mA 4
Output sink current ICHRG 10 mA 4
Power dissipation PD 400 mW SOT-23-5L package 4
Operating Ambient Temperature Range TA -40 85 °C 4
Junction Temperature TJ -40 125 °C 4
Storage Temperature Tstg -65 125 °C 4
Lead Temperature (Soldering) Tsolder 260 °C 10s 4
ESD rating HBM 4000 V JESD22-A114A 4
ESD rating MM 200 V JESD22-A115A 4
Input voltage range VCC 4.5 6.5 V 4
BAT Pin Output Current (Continuous) IBAT 10 600 mA Footnote 2: thermal regulation reduces current at TJ 120°C 4
Operating junction temperature range TJ 0 70 °C 4
Fast-charge current programming resistor RPROG 1.66 100 kΩ Use 1% tolerance metal film resistor (footnote 3) 4
Undervoltage Lockout Threshold VUVL 3.9 V VCC Rising: 0V→4V 5
Hysteresis on UVLO ΔVUVL 150 mV VCC Falling: 4V→0V 5
Manual Shutdown Threshold Voltage (PROG pin rising) VMSD 1.15 1.21 1.3 V PROG Pin Rising 5
Manual Shutdown Threshold Voltage (PROG pin falling) VMSD 0.9 1 1.1 V PROG Pin Falling 5
Input Supply Current, Charge Mode ICC(CHG) 100 200 µA Charge Mode, RPROG=10kΩ 5
Input Supply Current, Standby Mode (Charge Terminated) ICC(STB) 25 50 µA 5
Input Supply Current, Shutdown Mode ICC(SHDN) 25 50 µA RPROG Not Connected or VCC<VUVL 5
Input Supply Current, Sleep Mode ICC(SLP) 25 50 µA VUVL < VCC < VBAT + VSLP 5
Battery leakage current into BAT pin, Standby Mode IBAT(STB) -2.5 -6 µA Standby Mode (Charge Terminated), VBAT = VFLOAT 5
Battery leakage current into BAT pin, Shutdown Mode IBAT(SHDN) -2 1 2 µA Shutdown Mode (RPROG Not Connected or VCC<VUVL) 5
Battery leakage current into BAT pin, Sleep Mode IBAT(SLP) -2 1 2 µA Sleep Mode (VUVL < VCC < VBAT + VSLP or VCC Floating) 5
Regulated Output Voltage Accuracy VFLOAT -50 50 mV 0°C ≤ TA ≤ 85°C, IBAT = 20mA, RPROG=10kΩ 5
Dropout voltage, VCC, VBAT V(DO) 240 mV IBAT=600mA 5
Fast-Charge Current Range ICHG 10 600 mA VBAT > VTRIKL, ICHG= KPROG x VPROG /RPROG 5
Fast-Charge Current Set Voltage VPROG 0.9 1 1.1 V RPROG = 10kΩ, Current Mode 5
Fast-Charge Current set factor KPROG 1000 mA ∗ kΩ / Volts 100mA≤ICHG≤600mA 5
External resistor range RPROG 1.66 100 kΩ Resistor connected to PROG pin 5
Fast-Charge Current in typical application ICHG 450 500 550 mA RPROG = 2kΩ, VBAT=4.0V, Current Regulation Mode 5
Fast-Charge Current in typical application ICHG 90 100 110 mA RPROG = 10kΩ, VBAT=4.0V, Current Regulation Mode 5
PROG Pin Pull-Up Current IPROG 0.15 A 5
Pre-charge to fast-charge transition threshold VTRIKL 2.9 V RPROG = 10kΩ, VBAT Rising 6
Pre-charge Hysteresis V(TRIKL-HYS) 100 mV RPROG = 10kΩ, VBAT Falling 6
Pre-charge Current range I(PRECHG) 0.3 70 mA VBAT < VTRIKL, I(PRECHG)= KPROG x VPRECHG /RPROG 6
Pre-charge Current set voltage VPRECHG 100 mV Voltage on PROG pin, VBAT < VTRIKL 6
Pre-charge Current in typical application I(PRECHG) 50 mA VBAT < VTRIKL, RPROG=2kΩ 6
Battery shorted regulation current IBAT(SHORT) 50 mA BAT=GND, RPROG=2kΩ 6
Temperature regulation limit TJ(REG) 120 °C VCC= 5V, VBAT=3.2 V, Fast-charge current set to 600mA 6
C/10 Charge termination detection current range ITERM 1 70 mA VBAT > VRECHG, ITERM= KPROG x VTERM /RPROG 6
C/10 Charge termination detection set voltage VTERM 100 mV VBAT > VRECHG 6
C/10 Charge termination detection in typical application ITERM 50 mA RPROG=2kΩ 6
C/10 Charge termination detection current ITERM 7 10 13 mA RPROG=10kΩ 6
Deglitch time, termination detected TDGL(TERM) 0.8 1.8 4 mS IBAT Falling Below ICHG/10 6
Recharge Threshold Detection ΔVRECHG 150 mV VFLOAT-VBAT < ΔVRECHG 6
Deglitch time, recharge detection TDGL(RECHG) 0.8 1.8 4 mS VBAT Falling 6
Sleep mode entry threshold voltage VSLP 80 mV VCC Falling, VUVL < VBAT ≤ VFLOAT 6
Sleep mode exit threshold voltage V(SLP_EXIT) 100 mV VCC Rising, VUVL < VBAT ≤ VFLOAT 6
CHRG Pin Low-level Output Voltage VCHRG 0.3 0.6 V ICHRG=5mA (sink current) 6
Soft-Start Time tSS 20 µs IBAT=0 to IBAT =1000V/RPROG 6
Junction-to-ambient thermal resistance, topside copper 2500mm2 θJA 125 °C/W 2-layer board, backside copper 2500mm2, board area 2500mm2, still air 16
Junction-to-ambient thermal resistance, topside copper 1000mm2 θJA 125 °C/W 2-layer board, backside copper 2500mm2, board area 2500mm2, still air 16
Junction-to-ambient thermal resistance, topside copper 225mm2 θJA 130 °C/W 2-layer board, backside copper 2500mm2, board area 2500mm2, still air 16
Junction-to-ambient thermal resistance, topside copper 100mm2 θJA 135 °C/W 2-layer board, backside copper 2500mm2, board area 2500mm2, still air 16
Junction-to-ambient thermal resistance, topside copper 50mm2 θJA 150 °C/W 2-layer board, backside copper 2500mm2, board area 2500mm2, still air 16

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper die to the copper lead frame, through the package leads, (especially the ground lead) to the PC board 16

CAD (KiCad official)

  • Symbol: CJ4054A420M
  • Footprint: Package_TO_SOT_SMD:SOT-23-5
  • 3D model: SOT-23-5L, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 1.15 mm tall, datasheet A, midpoint of min and max). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions come from the datasheet drawing where it was read and are defaults otherwise (see provenance.model_3d_generated), not the manufacturer's CAD (STEP)
  • 3D model files: cj4054a420m-etched.step / cj4054a420m-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); cj4054a420m.step / cj4054a420m.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Changjing datasheet (33 pp, sha256 96f60dc73e5facbc, retrieved 2026-11-12, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF