component
CJ2333
Public Made by Adomby adom
Changjing MOSFETs, SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
Open in new tab ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Symbol & Footprint
Schematic Symbol
Open full view ↗Loads when you scroll to it. Unloads after 5 minutes in the background.
PCB Footprint
Open full view ↗Loads when you scroll to it. Unloads after 5 minutes in the background.
Datasheet
Open in new tab ↗Loads when you scroll to it. Unloads after 5 minutes in the background.
README
markdownCJ2333
Changjing · MOSFETs · SOT-23
CJ2333 from Changjing, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GATE | input | Gate terminal of the MOSFET, rated for a gate-source voltage VGS of ±8 V per the absolute maximum ratings. |
| 2 | SOURCE | passive | Source terminal; the datasheet rates the source-drain diode forward current IS at -1.4 A (TC=25℃) and the pulsed diode current ISM at -20 A. |
| 3 | DRAIN | passive | Drain terminal, rated for a drain-source voltage VDS of -12 V and a continuous drain current ID of -6 A (pulsed IDM of -20 A, t=300µs). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Changjing |
| Package | SOT-23 |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | -12 | V | 1 | |||
| Gate-Source Voltage | VGS | -8 | 8 | V | 1 | ||
| Continuous Drain Current | ID | -6 | A | 1 | |||
| Pulsed Drain Current | IDM | -20 | A | t=300µs | 1 | ||
| Power Dissipation | PD | 0.35 | W | Device mounted on no heat sink (note b) | 1 | ||
| Power Dissipation | PD | 1.1 | W | Device mounted on FR-4 substrate board, minimum recommended pad layout, single side (note a) | 1 | ||
| Thermal Resistance from Junction to Ambient | RθJA | 357 | ℃/W | Device mounted on no heat sink (note b) | 1 | ||
| Thermal Resistance from Junction to Ambient | RθJA | 113 | ℃/W | Device mounted on FR-4 substrate board, minimum recommended pad layout, single side (note a) | 1 | ||
| Junction Temperature | TJ | 150 | ℃ | 1 | |||
| Storage Temperature | TSTG | -55 | 150 | ℃ | 1 | ||
| Drain-source breakdown voltage | V(BR)DSS | -12 | V | VGS = 0V, ID =-250µA | 2 | ||
| Zero gate voltage drain current | IDSS | -1 | µA | VDS =-12V,VGS = 0V | 2 | ||
| Gate-body leakage current | IGSS | -0.1 | 0.1 | µA | VGS =±8V, VDS = 0V | 2 | |
| Gate threshold voltage | VGS(th) | -1 | -0.4 | V | VDS =VGS, ID =-250µA | 2 | |
| Drain-source on-resistance | RDS(on) | 28 | mΩ | VGS =-4.5V, ID =-5A | 2 | ||
| Drain-source on-resistance | RDS(on) | 32 | mΩ | VGS =-3.7V, ID =-4.6A | 2 | ||
| Drain-source on-resistance | RDS(on) | 40 | mΩ | VGS =-2.5V, ID =-4.3A | 2 | ||
| Drain-source on-resistance | RDS(on) | 63 | mΩ | VGS =-1.8V, ID =-1A | 2 | ||
| Drain-source on-resistance | RDS(on) | 150 | mΩ | VGS =-1.5V, ID =-0.5A | 2 | ||
| Gate resistance | Rg | 1.9 | 19 | Ω | f =1MHz | 2 | |
| Total Gate Charge | Qg | 14 | 21 | nC | VDS =-6V,VGS =-4.5V,ID=-5A | 2 | |
| Turn-on delay time | td(on) | 26 | 40 | ns | VDD=-6V,VGEN=-4.5V,ID=-4A, RL=6Ω,RGEN=1Ω (shared block printed above tf) | 2 | |
| Turn-on rise time | tr | 24 | 40 | ns | VDD=-6V,VGEN=-4.5V,ID=-4A, RL=6Ω,RGEN=1Ω (shared block printed above tf) | 2 | |
| Turn-off delay time | td(off) | 45 | 70 | ns | VDD=-6V,VGEN=-4.5V,ID=-4A, RL=6Ω,RGEN=1Ω (shared block printed above tf) | 2 | |
| Turn-off fall time | tf | 20 | 35 | ns | VDD=-6V,VGEN=-4.5V,ID=-4A, RL=6Ω,RGEN=1Ω | 2 | |
| Diode reverse recovery time | trr | 24 | 48 | ns | IF=-4A,dI/dt=100A/µs (shared block printed above Qrr) | 2 | |
| Diode reverse recovery charge | Qrr | 8 | 16 | nC | IF=-4A,dI/dt=100A/µs | 2 |
CAD (KiCad official)
- Symbol:
CJ2333 - Footprint:
Package_TO_SOT_SMD:SOT-23 - 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files:
cj2333-etched.step/cj2333-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);cj2333.step/cj2333.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Changjing datasheet (5 pp, sha256
d4bf07c781ba4d73, retrieved 2026-10-19, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).