component
CGRKM4001-HF
Public Made by Adomby adom
Comchip Diodes - General Purpose, SOD-123F. Diode: pin 1 is the cathode (the banded end) by the KiCad diode-footprint convention, KiCad symbol/footprint/3D.
Made with KiCad 10.0 · needs KiCad 10.0 or later to open · KiCad file format 20260206
CGRKM4001-HF
Comchip · Diodes - General Purpose · SOD-123F
CGRKM4001-HF from Comchip, in a SOD-123F. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Comchip |
| Package | SOD-123F |
| Category | Diodes |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum repetitive peak reverse voltage | VRRM | 50 | V | 1 | |||
| Maximum DC blocking voltage | VDC | 50 | V | 1 | |||
| Maximum RMS voltage | VRMS | 35 | V | 1 | |||
| Maximum averaged forward current | IO | 1 | A | 1 | |||
| Maximum instantaneous forward voltage | VF | 1.1 | V | IF=1.0A | 1 | ||
| Forward surge current | IFSM | 30 | A | 8.3ms single half sine-wave superimposed on rated load (JEDEC method) | 1 | ||
| Reverse current at rated DC blocking voltage | IR | 5 | µA | @TA=25°C | 1 | ||
| Reverse current at rated DC blocking voltage | IR | 50 | µA | @TA=100°C | 1 | ||
| Thermal resistance, junction to ambient air | RθJA | 60 | °C/W | Junction to ambient and junction to lead on 0.2x0.2in (5.0x5.0mm) copper pad areas | 1 | ||
| Operating junction temperature | TJ | -55 | 150 | °C | 1 | ||
| Storage temperature range | TSTG | -65 | 170 | °C | 1 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | Notes: 1. Thermal resistance from junction to ambient and from junction to lead mounted on 0.2x0.2”(5.0x5.0mm) copper pad areas. | 1 |
CAD (KiCad official)
- Symbol:
CGRKM4001-HF - Footprint:
Diode_SMD:D_SOD-123F - 3D model: SOD-123F (KiCad packages3D, STEP)
- 3D model files:
cgrkm4001-hf-etched.step/cgrkm4001-hf-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);cgrkm4001-hf.step/cgrkm4001-hf.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Comchip datasheet (5 pp, sha256
14407fe9e57fbd86, retrieved 2026-11-07, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarycathode-band convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).