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Contents

README

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CGRA4001-HF

Comchip · Diodes - General Purpose · SMA

CGRA4001-HF from Comchip, in a SMA. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode, indicated by the cathode band on the DO-214AC (SMA) package; the device blocks up to 50 V DC reverse voltage (VRRM 50 V for CGRA4001-HF) and passes 1.0 A average forward current.
2 A passive Anode of the rectifier diode in the DO-214AC (SMA) package; max instantaneous forward voltage is 1.1 V at IF=1.0 A, 25°C.

Key specifications

Parameter Value
Manufacturer Comchip
Package SMA
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Max. repetitive peak reverse voltage VRRM 50 V TA=25°C 1
Max. DC blocking voltage VDC 50 V TA=25°C 1
Max. RMS voltage VRMS 35 V TA=25°C 1
Peak forward surge current IFSM 30 A 8.3ms single half sine-wave superimposed on rated load (JEDEC method) 1
Max. average forward rectified current IF 1 A 1
Max. instantaneous forward voltage VF 1.1 V IF=1.0A @ 25°C 1
Max. DC reverse current at rated DC blocking voltage IR 5 μA TA=25°C 1
Max. DC reverse current at rated DC blocking voltage IR 50 μA TA=100°C 1
Operating temperature range TJ -55 150 °C 1
Storage temperature range TSTG -55 150 °C 1
Typical junction capacitance CJ 10 pF Measured at 1.0MHZ and applied reverse voltage of 4.0V DC 1
Typical thermal resistance RθJC 70 °C/W 1

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin - Terminals: Lead free plating (Tin finish). Solderable per MIL-STD-750, Method 2026. 1

CAD (KiCad official)

  • Symbol: CGRA4001-HF
  • Footprint: Diode_SMD:D_SMA
  • 3D model: SMA (KiCad packages3D, STEP)
  • 3D model files: cgra4001-hf-etched.step / cgra4001-hf-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); cgra4001-hf.step / cgra4001-hf.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Comchip datasheet (4 pp, sha256 bf2a2af40ed54561, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF